Method for the continuous flow make of customized planar electrical circuits

• US 4,935,093 A
• Filed: 02/11/1988
• Issued: 06/19/1990
• Est. Priority Date: 06/07/1982
• Status: Expired due to Fees

• Current Assignee: Max Reeb
• Original Assignee: Max Reeb
• Inventors: Reeb, Max
• Primary Examiner(s): Powell, William A.
• Application Number:
  US07/155,154
• Time in Patent Office: 859 Days
• Field of Search: 156/629, 156/630, 156/631, 156/633, 156/634, 156/643, 156/645, 156/656, 156/659.1, 156/242, 156/901, 156/902, 219/121 LM, 29/846, 29/847, 29/848, 174/68.5
• US Class Current: 216/6
• CPC Class Codes: G06K 19/0672 with resonating marks
• CPC Class Codes: G08B 13/2417 having a radio frequency identification chip
• CPC Class Codes: G08B 13/242 Tag deactivation
• CPC Class Codes: G08B 13/2431 Tag circuit details
• CPC Class Codes: G08B 13/2437 Tag layered structure, processes for making layered tags
• CPC Class Codes: G08B 13/244 Tag manufacturing, e.g. continuous manufacturing processes
• CPC Class Codes: G08B 13/2442 Tag materials and material properties thereof, e.g. magnetic material details
• CPC Class Codes: H01L 27/01 comprising only passive thin-film or thick-film elements formed on a common insulating substrate passive two-terminal components without a potential-jump or surface barrier for integrated circuits, details thereof and multistep manufacturing processes therefor H01L28/00
• CPC Class Codes: H03H 5/02 without voltage- or current-dependent elements
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

The invention provides a novel process for the mass production of thin, flexible electrical low-cost circuits. More particularly, the invention concerns the super mass production of flexible planar LC circuits, as are commercially desired as marker means in electronic article surveillance systems. The novel method provides the computerized nonstop super-mass production of such circuits and breaks down prior art barriers in view of limits for custom designs of shape, face, and resonant properties of such circuits. Custom designs of circuits are easily layouted onscreen of a modern personal computer. The data obtained thereof are downloaded to the process line. Hopping custom circuit designs with ease is unprecedentedly introduced. Forming tools have been abandoned. As an exclusive longlife production tool electromagnetic wave energy is extensively used. The circuits obtained may be washed and sewn and nicely go one way with a pretty commercial face.

Claims

1. A method of constructing a planar electrical circuit containing inductive and capacitive components and having the form of a flexible, tag-like strip, said method comprising at least the steps of:

a. continuously providing a flexible insulative substrate having a first and a second face;

b. continuously providing a continuous metal foil having a first and a second face, said first face being blank;

c. continuously providing an etchant impervious sealing layer having a resealing capability and being depositable at least on one of said first faces of said substrate and said metal foil;

d. continuously bringing in an at least touching superposition said first faces of said substate and metal foil with said sealing layer spaced therebetween, thereby forming a connectable combination;

e. continuously connecting said combination, in a manner to form an at least tri-layered one-piece sandwich construction having the sealing layer as its central component, by activating said sealing layer for a first time;

f. continuously generating on said second face of said metal foil a plurality of planar insulative paths, said plurality of insulative paths, forming repetitive etchant resistive mask patterns, each of which having an outline defining the outline of at least first and second conductor path patterns to be successively generated on said substrate;

g. continuously etching the patternized sandwich contruction;

h. continuously drying the etched contruction;

i. continuously recreating the sealing capability of said sealing layer in all places in which the metal has been removed, by chemically treating the contruction;

k. about at least one line (running in the direction of advance of said contruction) continuously bringing into an aligned superposition equal faces of the etched and sealably recreated construction such, that said first and second conductor path patterns become mutually aligned in an opposing relationship to each other and spaced from each other by at least the double width of said planar insulative paths of said etchant resistive mask patterns, and so that first and second conductor path patterns are trapped between said flexible, insulative substrate having outwardly disposed its second face;

l. continuously laminating said superposed construction by activating at least said sealing layer for a second time;

m. repetitively providing severing cuts in the superposed and sealed construction for facilititaion its division into individual flexible, planar electrical circuits in the form of tag-like strips.

2. The method as defined in claim 1, further including the step of

o. selecting said flexible, insulative substrate so that the finished tag-like strip can be washed and sewn.

3. The method as defined in claim 1, further including the step of

p. bonding said sealing layer to one of said first faces previously to step d.

4. The method as defined in claim 1, further including the step of

q. continuously providing at least a coded position print on said second face of said substrate prior to etching the sandwich construction, which print is readable for a controlled positioning of the construction.

5. The method as defined in claim 1, further including the step of

iii. providing film prints on said second face of said substrate.

6. The method as defined in claim 4, wherein printed information on said substrate is provided in a repetitive registration with respect to said continuously provided position print.

7. The method as defined in claim 1, prior to step h. further including the step of

r. continuously providing at least an etchant resistive print on said second face of said substrate, and registering with said print etchant resistive mask patterns to be generated on the metal face of said construction.

8. The method as defined in claim 1, prior to step 1, further including the step of

s. continuously providing on said sandwich construction, along at least one desired line in the direction of its advance, through at least one layer of said sandwich construction, repetitive perforations, or--at certain repetitive spacings--respective repetitive cuts, or repetitive openings in which the respective layer is substantially absent.

9. The method as defined in claim 7, further including the step of

t. continuously providing through at least a second layer of said sandwich construction--and substantially centered at the center line of perforations or openings or cuts through at least a first layer of said construction--distinctly differently shaped perforations, or repetitive openings, in which the respective layer is substantially absent.

10. The method as defined in claim 1, further including the step of

u. continuously printing additional coded or trademark information on said second face of said substrate, which print appears readable at least in special (e.g. actinic) light.

11. The method as defined in claim 1, further including the step of

v. continuously dividing said sandwich construction along at least one desired line in the direction of its advance.

12. The method as defined in claim 1, wherein

said etchant resistive mask patterns comprise individual insulative paths having individual widths and individual spacings, and wherein both across and along said construction the ratios of widths of said insulative paths and the respective spacing therebetween substantially are ratios of small integers as are e.g. 2:

1, 1;

2, 3;

2, 5;

3, 4;

7.

13. The method as defined in claim 1, wherein

the unit measure or unit increment defining quantisized widths of said insulative paths running in a direction along said continuous construction differs from the unit measure or unit increment defining the quantisized widths of insulative paths running in an orthogonal direction.

14. The method as defined in claim 1, wherein

the spacings between insulative paths in a first direction are substantially constant, and wherein

the spacings between insulative paths in a second direction orthogonally to said first direction are substantially constant.

15. The method as defined in claim 1, wherein

etching is performed at an extent, that respective conductive paths are narrower than masking insulative paths on their top.

16. The method as defined in claim 1, wherein

predominantly capacitively effective portions of said first and second conductor path patterns are provided with a plurality of etched openings being arranged on said portions according to a raster scheme.

17. The method as defined in claim 1, wherein step k, comprises the step of

w. trreating the etched and dried construction in a high frequency corona field for at least aiding the recovery of said layer'"'"'s sealing capabilities so as to facilitate its activation a second time.

18. The method as defined in claim 1, further including the step of

x. utilizing said first and second conductor path patterns at least as a working or balancing electrode for high frequency corona treating said insulative paths deposited thereon.

19. The method as defined in claim 1, further comprising the step of:

y. continuously positioning and depositing an endless conductive means over defined portions of said insulative paths at least on one of said first and second conductor path patterns.

20. The method as defined in claim 1, further comprising the step of

z. continuously positioning and depositing at least one additional dielectric strip on at least a portion of said insulative path pattern, at least on one of said first and second conductor path patterns, just prior to the superposition of equal faces of said construction, so

that after said mutually aligned superposition of equal faces of said construction certain respective first and second path portions of said first an second conductor path patterns are spaced at least by a tri-layered sandwich composition of said insulative paths and said additional dielectric strip so,

that the greatest effective thickness of an insulative layer is substantially provided in the flat spaces between mutually opposing conductor paths of said aligned first and second conductor path patterns, rather than in their lateral spaces.

21. The method as defined in claim 20, wherein

the critical temperature for plastification of said additional dielectric strip is higher than the respective temperature of said insulative path patterns, and wherein

said additional dielectric strip substantially maintains its dimensional shape under temperature and pressure conditions under which said insulative paths laminate and thus bifacially bond said additional dielectric strip to certain respective first and second path portions of said first an second conductor path patterns.

22. The method as defined in claim 20, including the step of

aa. extruding said additional dielectric strip from a thermoplastic material just prior to its deposition on said insulative path patterns.

23. The method as defined in claim 22, wherein

at least the extrusion thickness of said additional dielectric strip is controlled responsive to sample values of at least one typical resonant frequency acquired from finished circuits and put in as control values to a closed servo loop at least for extrusion thickness control.

24. The method as defined in claim 1, wherein both controlled pressure and controlled heat are applied in the lamination step for sealing said sealing layer a second time.

25. The method as defined in claim 1, wherein said laminating the etched and dried and superposed construction includes the step of

bb. feeding the construction between at least first and second laminating cylinders having a controlled pressure against each other and first and second controlled temperatures, respectively.

26. The method as defined in claim 25, wherein

said temperatures are regulated at least in response to cylinder revolution speed.

27. The method as defined in claim 1, wherein

both controlled pressure and controlled heat are applied in the lamination step for thinning the average thickness of an insulative layer spaced between conductor path portions.

28. The method as defined in claim 27, wherein

said controlled heat at least in part is effected by high frequency currents induced in certain partitions of the surface of a laminating cylinder mantle, which partitions are being allocated in registration with conductor path patterns to arrive thereon.

29. The method as defined in claim 27, further including the step of

cc. selectively injecting a certain amount of heat into predominantly capacitively effective portions of said first and second conductor path patterns for influencing the effective thickness of the resulting insulative layer spacing said path portions.

30. The method as defined in claim 29, wherein

said selective heat injection is effected by high frequency currents induced in said conductor path portions.

31. The method as defined in claim 30, wherein

said high frequency currents are effected by subjecting at least said capacitively effective conductor path portions of the etched and dried and superposed construction to an electromagnetic energy field just prior to laminating.

32. The method as defined in claim 30, including the step of

dd. passing said construction at least one electromagnetic energy emitter which is fed from a high frequency energy source at least between certain instants of time, this passing being provided shortly prior to the laminating touch.

33. The method as defined in claim 32, including the steps of

ee. feeding said superposed construction on a tuning cylinder having a first temperature;

ff. having said construction pass (on the circumference of said tuning cylinder) said electromagnetic energy emitter being arranged outside said tuning cylinder;

gg. taking over the thus selectively heated up construction between said laminating cylinders.

34. The method as defined in claim 32, including the steps of

hh. feeding said construction on a non-conductive combined tuning and laminating cylinder having the shape of a hollow tube and being heated up to a base temperature which is regulated at least responsive to cylinder revolution speed;

ii. having said construction pass (on the circumference of said cylinder) said electromagnetic energy emitter being arranged in the interior of said cylinder;

kk. laminating the heated and selectively heated up construction between said combined tuning and laminating cylinder and at least a second cylinder under controlled pressure and heat.

35. The method as defined in claim 34, wherein

said hollow cylinder is made from a glass-like material.

36. The method as defined in claim 32, further including the step of

ll. duty cycle controlling said high frequency energy source for repetitively switching it on and off for responsively injecting that specific amount of heat into said capacitively effective conductor path portions which amount is useful for reaching and maintaining a desired resonant frequency of finished circuits.

37. The method as defined in claim 36, wherein

said duty cycle control is accomplished in response to sample values of at least one typical resonant frequency acquired from finished circuits and put in as control values to a closed servo loop for duty cycle control.

38. The method as defined in claim 32, wherein

said electromagnetic energy emitter is designed and arranged so that it is capable of feeding electromagnetic energy merely to a selectable track of said construction.

39. The method as defined in claim 32, wherein

said electromagnetic energy emitter is designed and arranged so that at least parts thereof are capable of being exchanged, and wherein

said high frequency energy source is adjustable in view of its working frequency.

40. The method as defined in claim 32, further comprising the step of

mm. changing at least one of

the location,

the orientation,

the polarization of said electromagnetic energy emitter responsive to sample values of at least one typical resonant frequency acquired from finished electrical circuits and put in as control values to a closed servo loop for controlling said change.

41. The method as defined in one of claim 1, further including the step of

nn. subjecting the construction to an at least repetitive welding process for at least one conductive connection per circuit among the following:

A first conductor path portion of the first conductor path pattern to a second conductor path portion of the second conductor path pattern;

a first or second conductor path portion of respective first and second conductor path patterns to an endless conductive means.

42. The method as defined in claim 41, wherein

said welding process is carried out between welding tips after the superposition of equal faces of said etched and dried construction.

43. The method as defined in claim 1, further including the steps of

oo. continuously depositing on at least a part of one face of the laminated and etched construction an adhesive layer;

pp. continuously covering at least said adhesive layer with a continuous peel-off strip;

qq. continuously rolling up the resulting sandwich composition on supply rolls for the self-adhesive disposal of individual electrical circuits.

44. The method as defined in claim 1, further including the step of

rr. cutting away at least one margin of the superposed and laminated construction.

45. The method as defined in claim 1, further including the step of

ss. cutting away at least one margin of the superposed and laminated construction, which margin carries a means previously utilized for superposition.

46. The method as defined in claim 1, further including the step of

tt. melt-sealing the face covers (i.e. the outwardly disposed substrate) of said construction along the margins of finished electrical circuits so that a welding seam for enhanced tear resistance is effected along at least a part of the outline of planar electrical circuits.

47. The method as defined in claim 1, further including the step of

uu. providing in the superposed and laminated construction at least one opening per circuit face.

48. The method as defined in claim 1, further including the step of

vv. providing at different times registrated prints on said second face of said substrate.

49. The method as defined in claim 1, further including the steps of

ww. continuously coating said second face of said metal foil with an uniform insulative layer performing etchant resistive, this step being provided previously to step g;

xx. selectively removing portions of said uniform insulative layer so as to form said etchant resistive mask patterns.

50. The method as defined in claim 49, wherein the step of selectively removing portions of said uniform insulative layer includes the step of

yy. locally vaporizing said insulative layer by locally injecting electromagnetic energy into said insulative layer.

51. The method as defined in claim 50, wherein the step of locally injecting electromagnetic energy utilizes

electromagnetic energy in the form of focused laser light.

52. The method as defined in claim 1, wherein

said insulative paths are made from a meltable powder, which powder melts and films on said second face of said metal foil and performs etchant resistive in a film state.

53. The method as defined in claim 52, wherein

said meltable powder is applied to said second face of said metal foil by aid of electrostatical means.

54. The method as defined in claim 1, wherein

said insulative paths are made from a meltable powder, which powder contains an olefin component.

55. The method as defined in claim 1, wherein

said insulative paths are made from a meltable powder, which powder is optically doped for a high energy absorption on a certain wavelength of laser light.

56. The method as defined in claim 52, wherein

said insulative paths are written down by melting down said powder by means of at least one laser beam, which beam is switched and deflected under computer control in a respective synchronization with the advance of said sandwich construction.

57. The method as defined in claim 56, wherein

said etchant resistive mask patterns are written down in a line-by-line scheme, and wherein

a first sequence of pulse trains assembling to laser duty pulses is provided in correspondence with those portions of said path patterns, which are constant in any case, and wherein

a second sequence of pulse trains assembling to laser duty pulses is provided and adaptively manipulated under computer control so as to line-by-line modify at least certain parts of said path patterns responsive to a test measurement of at least one resonant frequency of finished circuits.

58. The method as defined in claim 56, wherein

said melting down said powder is performed by a plurality of lasers in cooperation with at least one rotating mirror means, said lasers being controlled at least for flyspot-sharing into duty pulses for writing long lines.

59. The method as defined in claim 52, including the previous steps of:

zz. continuously providing a uniform charge per unit area on the mantle of a drum, said mantle having a very low conductance in darkness and a high conductance when influenced by the energy of an exposing light;

aaa. continuously line-by-line exposing said mantle so, that an exposure pattern is deposited on said mantle, said exposure pattern causing a pattern of different charges per unit area according to desired etchant resist patterns;

bbb. continuously depositing said powder on the charge patternized mantle of said drum by aid of electrostatical means, by thus creating respective powder patterns thereon;

ccc. continuously redepositing and transferring said powder patterns to an insulative and endlessly recirculating web;

ddd. feeding both said web and said sandwich construction between at least two laminating cylinders, so that said powder patterns are trapped between said metal face of said sandwich construction (second face of said metal foil) and said recirculating web;

eee. melting and film bonding said powder patterns to said metal face of said sandwich construction.

60. The method as defined in claim 59, wherein

said line-by-line exposure is performed by laser means in cooperation with moving mirror deflection means.

61. The method as defined in claim 59, wherein

said line-by-line exposure is effected by a continuous column-by-column exposure by a plurality of individual solid state light emitting means, which means are arranged at least single-in-line to form at least one row in parallel to the axis of said drum.

62. The method as defined in claim 59, wherein

said line-by-line exposure is effected by a continuous column-by-column exposure by means of at least a light source and a plurality of individual liquid crystal shutter means, which shutter means are arranged at least single-in-line to form at least one row in parallel to the axis of said drum.

63. The method as defined in claim 59, wherein

said endlessly recirculating web is heated up to a controllable predetermined temperature at least within a certain embracing angle on the circumference of at least one cylinder prior to the laminating touch with said metal face of said sandwich construction.

64. The method as defined in claim 59, wherein

said metal foil of said sandwich construction is heated up to a controllable predetermined temperature within a certain embracing angle on the circumference of at least one cylinder prior to the laminating touch with said endlessly recirculating web.

65. The method as defined in claim 59, wherein said metal foil of said sandwich construction, by way of electromagnetic induction, is heated up to a controllable determined temperature prior to the laminating touch with said endlessly recirculating web.

66. The method as defined in claim 59, wherein

said endlessly recirculating web is made subject to a coating with an ultra thin layer of a liquid, which layer effects a much lower affixation of said filming powder patterns to said web than becomes active between said filming powder patterns and said metal face of said sandwich construction.

67. The method as defined in claim 59, wherein

said exposure is carried out under the control of a computer capable of driving suitable exposure means.

68. The method as defined in claim 1, further including at least one of the additional steps of

fff. providing perforations at least in said substrate by aid of laser light;

ggg. cutting notches at least in said substrate by aid of laser light.

69. The method as defined in claim 1, wherein

the structure of said substrate in based on a spunbonded polymer.

70. The method as defined in claim 1, wherein

said substrate is constructed of the basis of a tissue-like compound formed of a spunbonded polymer and being reenforced by a composite spun and mixbonded polyester component.

71. The method as defined in claim 1, wherein

said sealing layer is made from polyethylene.

72. The method as defined in claim 59, wherein

said endlessly recirculating web is based on an aramide fibre.

73. The method as defined in claim 1, after step e. further including the step of:

n. continuously providing said at least tri-layered one-piece sandwich construction with suitable pilot means for repetitionally precise transportation and later aligned superposition of equal faces of said construction.

74. The method as defined in claim 60, wherein

said line-by-line exposure is performed by that at least one beam of emitted laser light, in a TV cathode ray tube fashion, is switched between a high and a minimum intensity according to a defined pulse pattern in correspondence with the respective pattern line of the desired exposure pattern and by that said at least one beam of thus pulse-switched laser light is made subject of a continuous deflection by at least one mirror means moving in a synchronized relationship with said pulse pattern for thus effecting a continuous line-by-line exposure of said drum.

75. The method as defined in claim 61, wherein

the arrangement of said plurality of individual solid state light emitting means, are also arranged at least single-in-line to form at least one row in parallel to the axis of said drum to every individual one of which means is being supplied an individual current pulse in correspondence with an individual column exposure pattern along said drum'"'"'s circumference, so that every respective plurality of corresponding column pulses in parallel represents a line current pulse pattern for individually driving in parallel said row arranged solid state light emitting means for thus effecting a continuous line-by-line exposure of said drum.

76. The method as defined in claim 62, wherein

said shutter means are arranged at least single-in-line to form at least one row in parallel to the axis of said drum, and to every individual one of which shutter means is supplied a shutter voltage pulse in correspondence with an individual column exposure pattern along said drum'"'"'s circumference, so that every respective plurality of corresponding shutter voltage pulses in parallel represents a line shutter pulse pattern for individually driving in parallel said row arranged liquid crystal shutter means for thus effecting a continuous line-by-line exposure of said drum.

77. The method as defined in claim 67, wherein

said exposure is carried out by way of generating, in correspondence with the desired charge pattern on the drum'"'"'s mantle to synchronously advance, a parallel data stream for assembling at least one pulse sequence for controlling the exposure means in dependency on drum revolution speed.

78. The method as defined in claim 59 wherein

the step of continuously depositing said powder includes the step of

hhh. enhancing electrostatical charge efficiency of yet undeposited and thus moving powder by aid of triboelectrical means.

79. The method as defined in claim 77, wherein

by aid of a column decoding means a multi-in-parallel pulse sequense is continuously being composed from said parallel data stream, every individual (column) pulse sequence thereof being fed to an individual (column) driving means for pulse powering an individual (column) exposing means the plurality of whose latter forming at least one row.

80. The method as defined in claim 73, wherein

said plot means include the cut of at least one opening per electrical circuit in at least said substrate.

81. The method as defined in claim 73 wherein

said pilot means include at least one line of perforations or grip holes along said substrate.

82. The method as defined in claim 7, wherein

printed information on said substrate is provided in a repetitive registration with respect to said continuously provided position print.

83. The method as defined in claim 10, wherein

printed information on said substrate is provided in a repetitive registration with respect to said continuously provided position print.

84. The method as defined in claim 76 wherein

printed information on said substrate is provided in a repetitive registration with respect to said continuously provided position print.

85. A method of forming an LC marker for use as an identification device in an electronic article surveillance system, said method comprising:

(a) forming two substantially identical, conductive multi-turn spirals (37, 20-27, 36, 28-35,

     5) each turn of which forms a substantially closed loop;

(b) positioning said spirals on opposite surfaces of a sheet-like dielectric layer, with each spiral being oppositely would with respect to the other when both are viewed from the same side of said dielectric layer, opposing portions of each spiral being positioned in substantial registry with an opposing portion of the opposite spiral; and

(c) electrically contacting at least one predetermined portion (36,

     37) of each spiral with an opposing portion of the other spiral, the resulting resonant circuit including a series of closed loops, having both inductive and distributed capacitive components, and wherein steps b and c of positioning and contacting comprise

(d) adhering two connecting spirals (37, 20-27, 36, 28-35,

     5) to the same face of a dielectric sheet (11) having a certain thickness and folding said sheet back upon itself proximate to the connection between the spirals such that the conductive path of the spirals become positioned in substantial registry with each other, and with at least a double thickness of said dielectric sheet (11) therebetween.

86. The method as defined in claim 85 wherein said forming is performed by etching a metal foil, the metal foil being combined with said dielectric sheet so as to form, prior to etching, at least a dual layer composition.

87. A method of forming an LC marker for use as an identification device in an electronic surveillance system, said method comprising the steps of:

(a) forming two substantially identical, conductive multi-turn sprials (90, 91,

     5), each turn of which forms a substantially closed loop, the innermost turns terminating into respective capacitive plates (95,

     96);

(b) positioning said spirals and capacitive plates on opposite surfaces of a sheet-like dielectric layer,

with each spiral being oppositely wound with respect to the other when both are viewed from the same side of said dielectric layer, individual portions of each spiral being positioned in the lateral spaces between respective portions of the other spiral so as to interlace, and with both capacitive plates in substantial registry,

(c) electrically contacting at least one predetermined portion of each spiral with an opposing portion of the other spiral, the resulting resonant circuit thereby exhibiting concentrated inductive and capacitive components, and wherein steps b and c of positioning and contacting comprise

(d) providing two capacitive plates (95,

     96) in conductive communication with two connected spirals on the same face of a dielectric sheet (11) having a certain thickness and folding said sheet back upon itself proximate to the connection between the spirals such that

the conductive path of the spirals becomes positioned so as to interlace with each other and the capacitive plates become positioned in substantial registry with each other, and with at least a double thickness of said dielectric sheet (11) therebetween.

88. The method as defined in claim 87 wherein said forming is performed by etching a metal foil, the metal foil being combined with said dielectric sheet so as to form, prior to etching, at least a dual layer composition.