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Process for electrolessly plating copper and plating solution therefor

  • US 4,935,267 A
  • Filed: 05/06/1988
  • Issued: 06/19/1990
  • Est. Priority Date: 05/08/1987
  • Status: Expired due to Fees
First Claim
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1. A process for electrolessly plating copper on a substrate, comprising the steps of i) immersing a substrate having a surface in a first electroless copper plating bath containing a copper ion, a first complexing agent for the copper ion, a reducing agent and a pH-adjusting agent to form a first copper film on the surface of the substrate;

  • and ii) immersing the substrate in a second electroless copper plating bath containing a copper ion, a second complexing agent for the copper ion, a reducing agent and a pH-adjusting agent to form a second copper film on the first copper film;

    wherein the first complexing agent for the copper ion has a copper complex stability constant substantially lower than that of the second complexing agent for the copper ion.

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