Flexible membrane heat sink

• US 4,938,279 A
• Filed: 08/01/1989
• Issued: 07/03/1990
• Est. Priority Date: 02/05/1988
• Status: Expired due to Term

• Current Assignee: Teradyne Incorporated
• Original Assignee: Hughes Aircraft Company (Rtx Corporation)
• Inventors: Betker, Jay B.
• Primary Examiner(s): Davis, Jr., Albert W.
• Application Number:
  US07/359,068
• Time in Patent Office: 336 Days
• Field of Search: 165/46, 165/80.4, 165/80.5, 165/96, 165/104.33, 357/82, 361/385, 361/384
• US Class Current: 165/46
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: Y10S 165/048 Electrical component

Abstract

An expandable and contractable sealed environment is provided by a rigid frame member and a pair of deformable heat transfer elements fixed to the frame member. The frame member is located between two heat-producing electronic assemblies. A coolant agent is pumped into the sealed environment to flex the membranes and cause them to conformally contact the pair of electronic assemblies. Excess heat in the assemblies is then allowed to pass across the membranes and into the coolant agent for dissipation purposes. In order to remove the electronic assemblies, the pressure of the coolant agent is reduced, which permits the heat transfer element to return to its nondeformed state removed from the assembly. Thus, the electronic assemblies can be removed without the need to open fluid couplings.

Claims

1. A heat sink assembly comprising:

first and second heat producing assemblies, a support structure, said first and second heat-producing electronic assemblies being supported by said support structure to leave a space between said heat-producing electronic assemblies, said heat-producing electronic assemblies being demountably mounted with respect to said support structure, said heat sink assembly comprising;

a rigid metallic frame, said frame having ends and walls to define a reservoir space therein and having first and second planar faces;

first and second resilient metallic membranes being secured with their inner faces respectively against said first and second faces of said frame and sealed with respect thereto to enclose said reservoir space, said outer faces of said membranes being substantially planar when said reservoir is unpressurized, said assembly having a thickness between said first and second membrane outer faces less than the space between said spaced electronic assemblies so that said heat sink assembly can be placed between spaced electronic assemblies without contact thereon;

a coolant fluid inlet connection to said reservoir in said heat sink assembly to permit coolant to flow into said reservoir and a coolant outflow connection from said reservoir spaced from said inlet connection to permit coolant fluid outflow from said reservoir; and

control means for controlling coolant fluid flow and reservoir pressure to pressurize said reservoir to resiliently deflect said membranes into contact with the adjacent electronic assemblies and simultaneously cause coolant flow through said reservoir to extract heat therefrom so that said control means can be operated to depressurize said reservoir to permit resilient retraction of said membranes out of contact with the adjacent electronic assemblies to permit detachment of one of said electronic assemblies from said support structure and replacement thereof without removal of said heat sink assembly from its position adjacent the remaining electronic assembly.

2. The heat sink assembly of claim 1 wherein said frame and said membranes are made of a metal selected from the group consisting of stainless steel, aluminum and copper.

3. The heat sink assembly of claim 2 wherein each said membrane is attached to said frame by welding material.

4. The method of cooling spaced adjacent electronic assemblies comprising the steps of:

placing between the spaced adjacent electronic assemblies an unpressurized heat sink having a rigid frame and first and second flexible membranes out of contact with the spaced electronic assemblies;

simultaneously pressurizing the heat sink assembly with coolant fluid to resiliently deflect the first and second membranes on the heat sink assembly respectively into contact with the adjacent electronic assemblies and passing coolant through the heat sink assembly to withdraw heat from the heat sink assembly in the electronic assemblies with which the heat sink assembly is in physical and thermal contact;

depressurizing the heat sink; and

removing and replacing at least one of the adjacent electronic assemblies without removing the heat sink.

5. The method of cooling spaced adjacent electronic assemblies comprising the steps of:

placing between the spaced adjacent electronic assemblies an unpressurized heat sink having a rigid frame and first and second flexible membranes out of contact with the spaced electronic assemblies;

simultaneously pressurizing the heat sink assembly with coolant fluid to resiliently deflect the first and second membranes on the heat sink assembly respectively into contact with the adjacent electronic assemblies and passing coolant through the heat sink assembly to withdraw heat from the heat sink assembly in the electronic assemblies with which the heat sink assembly is in physical and thermal contact;

depressurizing the heat sink;

removing and replacing at least one of the adjacent electronic assemblies without removing the heat sink; and

repressurizing the heat sink so that its membranes resiliently deflect into contact with the replaced electronic assembly to cool it.