Method for plating on titanium

• US 4,938,850 A
• Filed: 09/26/1988
• Issued: 07/03/1990
• Est. Priority Date: 09/26/1988
• Status: Expired due to Term

• Current Assignee: Hughes Electronics Corporation (Rtx Corporation)
• Original Assignee: Hughes Aircraft Company (Rtx Corporation)
• Inventors: Troup, Sue, Rothschild, Bill F.
• Primary Examiner(s): Niebling, John F.
• Assistant Examiner(s): Leader, William T.
• Application Number:
  US07/248,885
• Time in Patent Office: 645 Days
• Field of Search: 204/29, 204/32.1, 204/37.1, 204/38.5, 427/309
• US Class Current: 205/191
• CPC Class Codes: C23C 18/1692 Heat-treatment
• CPC Class Codes: C23C 18/1844 with use of organic or inorganic compounds other than metals, first
• CPC Class Codes: C23C 18/1848 by electrochemical pretreatment
• CPC Class Codes: C25D 5/38 of refractory metals or nickel

Abstract

A method for application of an adherent nickel plate to titanium includes steps of surface preparation, deposition of nickel from a plating solution, and a final treatment. The surface preparation steps include a hydrochloric acid dip, a nitric acid/hydrofluoric acid activation, treatment to slow the re-formation of an oxide layer, and deposition of a nickel strike. The treatment to reduce oxide formation may be accomplished without application of a current, in a solution of acetic and hydrofluoric acid, in which titanium alloy has been electrolytically dissolved. Alternatively, the treatment may be performed with the piece to be plated made anodic in a solution of acetic acid and hydrofluoric acid.

Claims

1. A process for plating electroless nickel onto a titanium piece, consisting of the steps of:

cleaning the piece of titanium;

contacting the piece of titanium to a concentrated hydrochloric acid solution;

activating the piece of titanium in a solution of nitric acid and hydrofluoric acid;

immersing, without the application of any voltage or current, the piece of titanium in a treatment solution prepared by the process of

preparing a mixture of acetic acid and hydrofluoric acid,

placing an inert cathode and a titanium anode into the mixture, and

dissolving titanium into the mixture;

coating the piece of titanium with a nickel strike layer;

electrolessly plating the piece of titanium with a nickel layer; and

heat treating the piece of plated titanium.

2. The process of claim 1, wherein the solution used in the step of contacting the piece of titanium to a concentrated hydrochloric acid solution has about 50 volume percent hydrochloric acid.

3. The process of claim 1, wherein the solution used in the step of activating is an aqueous solution containing about 30 volume percent nitric acid and about 5 volume percent hydrofluoric acid.

4. The process of claim 1, wherein the nickel strike solution has about 32 ounces per gallon of nickel chloride pentahydrate and about 10 to 12 percent by volume of hydrochloric acid.

5. The process of claim 1, wherein the step of heat treating is performed in a nitrogen atmosphere at a temperature of about 825°

F.

6. The process of claim 1, wherein the step of contacting the surface is accomplished by preparing a mixture having about 87.5 percent by volume acetic acid and about 12.5 percent by volume hydrofluoric acid, placing a copper cathode and a titanium anode into the solution, and dissolving the alloy Ti-6Al-4V into the solution under an anodic current density of about 10 to about 15 amperes per square foot until about 17 grams per liter of titanium are in solution.