Moldable/foldable radio housing

• US 4,939,792 A
• Filed: 11/16/1987
• Issued: 07/03/1990
• Est. Priority Date: 11/16/1987
• Status: Expired due to Fees

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: McKee, John M., Urbish, Glenn F., Suppelsa, Anthony B., McKinley, Martin J.
• Primary Examiner(s): Olms, Douglas W.
• Assistant Examiner(s): Smith, Ralph
• Application Number:
  US07/121,323
• Time in Patent Office: 960 Days
• Field of Search: 455/351, 455/346-348, 455/89, 455/90, 343/702, 361/412, 361/415, 361/422, 361/397-399, 361/331, 361/380, 364/708
• US Class Current: 455/347
• CPC Class Codes: H04B 1/08 Constructional details, e.g. cabinet
• CPC Class Codes: H05K 1/0278 Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
• CPC Class Codes: H05K 1/119 Details of rigid insulating substrates therefor, e.g. three-dimensional details H05K1/117 takes precedence
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/0191 wherein the thickness of the dielectric plays an important role
• CPC Class Codes: H05K 2201/042 Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
• CPC Class Codes: H05K 2201/09036 Recesses or grooves in insulating substrate recess in metallic substrate H05K2201/09745
• CPC Class Codes: H05K 2201/09045 Locally raised area or protrusion of insulating substrate rigid curved substrate H05K2201/09018
• CPC Class Codes: H05K 2201/09118 Moulded substrate
• CPC Class Codes: H05K 2201/0999 Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
• CPC Class Codes: H05K 2201/10037 Printed or non-printed battery
• CPC Class Codes: H05K 2201/10053 Switch
• CPC Class Codes: H05K 2201/10136 Liquid Crystal display [LCD]
• CPC Class Codes: H05K 2201/10598 Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
• CPC Class Codes: H05K 2201/2009 Reinforced areas, e.g. for a specific part of a flexible printed circuit
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308
• CPC Class Codes: H05K 3/326 the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence

Abstract

A molded thermoplastic housing (100) includes base (102) and cover (104) members joined by a living hinge (106). The base member (102) includes a peripheral wall (108). Four solderable printed circuit patterns (112, 114, 116 and 118) are vacuum deposited onto the interior and exterior surfaces of both housing members. The printed circuit patterns on opposing surfaces of the base and cover members are joined by conductive through-holes (e.g., 120 and 122), while the printed circuit patterns on the interior surfaces of the base and cover members are joined by an interconnecting printed circuit pattern (124) which is vacuum deposited onto the living hinge. Mylar sheets (132) are adhered to the exterior surface of the housing to insulate the exterior printed circuit patterns. An antenna pattern (126) is also vacuum deposited onto an exterior surface of the housing. A switch (136) and battery contact (152) are integrally formed with the housing and an integrally molded structural support means strenghthens the housing members. The housing is manufactured "opened up" and, at the final assembly stage, the cover member is rotated about the hinge until it contacts the upper surface of the peripheral wall (108B). Snap-fit connectors (e.g., 110) join the cover to the base.

Claims

1. A moldable/foldable housing for an electronic device comprising in combination:

first and second housing members and a hinge joining said housing members, said housing members and said hinge being integrally molded;

a first solderable printed circuit pattern disposed directly on a first surface of said first housing member;

a second printed circuit pattern disposed on a second surface of said first housing member, said second surface opposing said first surface; and

a conductive through-hole connected between said first and second printed circuit patterns.

2. The moldable/foldable housing of claim 1, wherein said second surface of said first housing member includes an exterior surface of said housing, and said housing includes an insulating sheet disposed over said second printed circuit pattern.

3. A moldable/foldable housing for an electronic device comprising in combination:

first and second housing members and a hinge joining said housing members, said housing members and said hinge being integrally molded;

a first solderable printed circuit pattern disposed directly on a first surface of said first housing member; and

a switch, integrally formed with said housing, said switch including;

a thin, flexible wall integrally molded into said first housing member;

a first printed circuit switch contact disposed directly on a surface of said thin wall;

a second printed circuit switch contact disposed directly on said second housing member.

4. A moldable/foldable housing for an electronic device comprising in combination:

first and second housing members and a hinge joining said housing members, said housing members and said hinge being integrally molded;

a first solderable printed circuit pattern disposed directly on a first surface of said first housing member;

structural means, integrally molded with said housing, for strengthening said housing member, said structural means including reinforcing rods molded into said housing.

5. A moldable/foldable housing for an electronic device comprising in combination:

first and second housing members and a hinge joining said housing members, said housing members and said hinge being integrally molded;

a first solderable printed circuit pattern disposed directly on a first surface of said first housing member; and

a battery contact, said battery contact including;

a thin, flexible wall integrally molded in said first housing member;

a protuberance attached to said thin wall;

a printed circuit battery contact disposed on said protuberance;

said housing being constructed and arranged such that when a battery in installed in said housing, said printed circuit battery contact is forcibly engaged with a terminal on said battery, causing said thin wall to flex.

6. A moldable/foldable housing for an electronic device comprising in combination:

first and second housing members and a hinge joining said housing members, said housing members and said hinge being integrally molded from a thermoplastic material;

a first solderable printed circuit pattern vacuum deposited on a first surface of said first housing member;

a second solderable printed circuit pattern vacuum deposited on a second surface of said first housing member, said second surface opposing said first surface; and

a conductive through-hole connected between said first and second printed circuit patterns.

7. The moldable/foldable housing in claim 6, wherein said second surface of said first housing member includes an exterior surface of said housing, and said housing includes an insulating sheet disposed over said second printed circuit pattern.

8. A moldable/foldable housing for an electronic device comprising in combination:

first and second housing members and a hinge joining said housing members, said housing members and said hinge being integrally molded from a thermoplastic material;

a first solderable printed circuit pattern vacuum deposited on a first surface of said first housing member; and

a switch, integrally formed with said housing, said switch including;

a thin, flexible wall integrally molded into said first housing member;

a first printed circuit switch contact vacuum deposited on a surface of said thin wall; and

a second printed circuit switch contact vacuum deposited on said second housing member;

9. A moldable/foldable housing for an electronic device, comprising in combination:

first and second housing members and a hinge joining said housing members, said housing members and said hinge being integrally molded from a thermosplastic material;

a first solderable printed circuit pattern vacuum deposited on a first surface of said first housing member; and

structural means, integrally molded with said housing, for strengthening said housing member, the structural means including reinforcing rods molded into said housing.

10. A moldable/foldable housing for an electronic device comprising in combination:

first and second housing members and a hinge joining said housing members, said housing members and said hinge being integrally molded from a thermoplastic material;

a first solderable printed circuit pattern vacuum deposited on a first surface of said first housing member; and

a battery contact, said battery contact including;

a thin, flexible wall integrally molded in said first housing member;

a protuberance attached to said thin wall; and

a printed circuit battery contact vacuum deposited on said protuberance;

said housing being constructed and arranged such that when a battery is installed in said housing, said printed circuit battery contact is forcibly engaged with a mating contact on said battery, causing said thin wall to flex.

11. A moldable/foldable housing for an electronic device, comprisinq in combination:

first and second housing members and a hinge joining said housing members, said housing members and said hinge being integrally molded from a thermoplastic material;

first and second solderable printed circuit patterns vacuum deposited on opposing surfaces of said first housing member;

conductive through-holes connected between said first and second printed circuit patterns;

a third solderable printed circuit pattern vacuum deposited on a surface of said second housing member;

an interconnecting printed circuit pattern vacuum deposited on said hinge and connected between said first and third printed circuit patterns.

12. The moldable/foldable housing of claim 11, further comprising a switch, said switch including:

a thin, flexible wall integrally molded into said first housing member;

a first printed circuit switch contact vacuum deposited on a surface of said flexible wall; and

a second printed circuit switch contact vacuum deposited on said second housing member.

13. The moldable/foldable housing of claim 11, further comprising a battery contact, said battery contact including:

a thin, flexible wall integrally molded in said first housing member;

a protuberance attached to said thin wall; and

a printed circuit battery contact vacuum deposited on said protuberance;

said housing being constructed and arranged such that when a battery is installed in said housing, said printed circuit battery contact is forcibly engaged with a terminal on said battery, causing said thin wall to flex.