Plastic packaged device having a hollow portion enclosing a chip element
First Claim
Patent Images
1. A packaged electronic device, comprising:
- an electronic chip element;
means for supporting the chip element;
packaging means for enclosed said chip element;
wall means disposed on said supporting means for defining an area surrounding the electronic chip element; and
said packaging means and said wall means defining a hollow space extending from said area and separating the chip element from contact with said packaging means.
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Accused Products
Abstract
A plastic packaged device comprises a chip element mounted on a supporting member, and covered by a hollow portion. The supporting member has a wall portion at least partially surrounding the chip element. As the hollow portion ends at the wall portion, sufficient space for covering the chip element is achieved.
16 Citations
10 Claims
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1. A packaged electronic device, comprising:
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an electronic chip element; means for supporting the chip element; packaging means for enclosed said chip element; wall means disposed on said supporting means for defining an area surrounding the electronic chip element; and said packaging means and said wall means defining a hollow space extending from said area and separating the chip element from contact with said packaging means. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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- 8. A packaged device containing a chip element mounted on a supporting member sealed within the device with a hollow portion over the chip element, characterized in that the supporting member includes wall portions which at least partially define the hollow portion.
Specification