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High-density package

  • US 4,943,844 A
  • Filed: 11/22/1985
  • Issued: 07/24/1990
  • Est. Priority Date: 11/22/1985
  • Status: Expired due to Term
First Claim
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1. A chip carrier comprising:

  • a chip carrier body having a cavity therein, and a lower mounting space, on the bottom of said cavity, for mounting at least one integrated circuit chip;

    at least one bonding ledge having contact pads thereon in proximity to said mounting space inside said cavity;

    at least one heat plate mounted above said lower mounting space within said cavity;

    said heat plate being attached with low thermal resistance to said body of said chip carrier, said heat plate having a second mounting surface thereon for mounting at least one integrated circuit chip thereon;

    at least one integrated circuit chip mounted on said lower mounting space, and at least one integrated circuit chip mounted on said second mounting surface;

    a plurality of connecting leads linking contact pads on said integrated circuits to selected contact pads on said bonding ledges; and

    a lid hermetically sealed to said body of said chip cavity, said lid and said chip cavity enclosing therebetween said lower mounting space, said heat plate, and said chips mounted to said space and said heat plate;

    wherein said heat plate comprises openings to expose plural ones of said contact pads on said bonding ledges.

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