High-density package

• US 4,943,844 A
• Filed: 11/22/1985
• Issued: 07/24/1990
• Est. Priority Date: 11/22/1985
• Status: Expired due to Term

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Williams, Charles E., Beene, Gary L., Oscilowski, Alex A., Zogas, Peter
• Primary Examiner(s): Hille, Rolf
• Assistant Examiner(s): CLARK, SHEILA V
• Application Number:
  US06/801,029
• Time in Patent Office: 1,705 Days
• Field of Search: 357/75, 357/74, 357/81
• US Class Current: 257/701
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/0652 the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 Multilayer substrate
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/1627 stacked type assemblies, e.g. stacked multi-cavities
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

A chip carrier with improved packing density, wherein at least one layer of chips is bonded not directly to the substrate, but rather to a heat plate which attaches over the chip cavity and inside the hermetic sealing lid. The heat plate has openings in it to permit attachment of the leads from the chips in the upper layer to bond pads on a bonding ledge inside the cavity of the chip carrier, after the heat plate is emplaced. Each bonding ledge is preferably made somwhat wider than it would otherwise be, and the leads from multiple layers of chips are preferably bonded onto the same bonding ledge.

Claims

1. A chip carrier comprising:

a chip carrier body having a cavity therein, and a lower mounting space, on the bottom of said cavity, for mounting at least one integrated circuit chip;

at least one bonding ledge having contact pads thereon in proximity to said mounting space inside said cavity;

at least one heat plate mounted above said lower mounting space within said cavity;

said heat plate being attached with low thermal resistance to said body of said chip carrier, said heat plate having a second mounting surface thereon for mounting at least one integrated circuit chip thereon;

at least one integrated circuit chip mounted on said lower mounting space, and at least one integrated circuit chip mounted on said second mounting surface;

a plurality of connecting leads linking contact pads on said integrated circuits to selected contact pads on said bonding ledges; and

a lid hermetically sealed to said body of said chip cavity, said lid and said chip cavity enclosing therebetween said lower mounting space, said heat plate, and said chips mounted to said space and said heat plate;

wherein said heat plate comprises openings to expose plural ones of said contact pads on said bonding ledges.

2. The chip carrier of claim 1, wherein said heat plate has openings therein to expose all of said contact pads and at least one of said bonding ledges.

3. The chip carrier of claim 1, wherein said leads from said chips mounted on said heat plate comprise conductive traces supported at least partially by a polymer strip which extends across multiple anse of said conductive traces.

4. The chip carrier of claim 1, wherein said chip carrier body comprises a multilayer cofired ceramic body.

5. The chip carrier of claim 1,

wherein a first and second heat plate are enclosed in said cavity,

said second heat plate lying above said first heat plate,

and wherein said chip carrier body includes at least first and second bonding ledges,

said second bonding ledge being higher than said first bonding ledge.

and said second heat plate being attached with low thermal resistance to said second bonding ledge.

6. The chip carrier of claim 1, wherein said heat plate comprises a metal which has a thermal coefficient of expansion within 20% of that of alumina.

7. The chip carrier of claim 1, wherein said second mounting surface on said heat plate is substantially planar.

8. The chip carrier of claim 1,

wherein said second mounting surface on said heat plate includes more than one substantially planar portion, said respective planar portions having different heights,

whereby said chips mounted on said heat plate are not all of the same height.

9. The chip carrier of claim 8,

wherein said chips mounted on the most protrusive portions of said mounting surface of said heat plate are connected to a first set of parallel leads supported in a flexible polymer strip,

and at least some of said chips which are not mounted on said most protruding portion of said heat plate are connected to leads supported by a second flexible polymer strip,

wherein said first polymer strip at least partially overlies said second polymer strip.

10. The chip carrier of claim 1, wherein the average heat dissipation of the chips mounted on said first mounting surface is higher than the average heat dissipation of the chips mounted on said second mounting surface.

11. The chip carrier of claim 1, wherein the total heat dissipation of all of the chips mounted on said first mounting surface of said chip carrier body is more than twice the total heat dissipation of all of the chips mounted on said second mounting surface on said heat plate.

12. The chip carrier of claim 1,

wherein said chips mounted on said heat plate are connected to said contact pads on said bonding ledges by discrete bonding wires,

and wherein said second mounting surface on said heat plate faces away from said first mounting surface on said chip carrier body.

13. The chip carrier of claim 1,

wherein said chips mounted on said heat plate are connected to said contact pads on said bonding ledges through leads supported on a flexible polymer strip,

and wherein said chips are mounted on the face of said heat plate which faces toward said first mounting surface.

14. The chip carrier of claim 1, wherein a low thermal resistance theremal contact makes a low resistance thermal contact between said heat plate and said lid.

17. The chip carrier of claim 1, wherein said heat plate is attached to said bonding ledge, and said contact pads on said bonding ledge are positioned within said openings of said heat plate.

18. The chip carrier of claim 1, wherein said openings in heat plate are indentations around the periphery of said heat plate.

15. The chip carrier of claim 15, wherein said thermal contact comprises a very soft metal.

16. A circuit board assembly comprising:

a board substrate;

a plurality of chip carrier packages affixed to said substrate; and

a plurality of traces interconnecting said chip carrier packages to configure a desired macroscopic circuit configuration;

wherein at least some of said chip carriers comprise;

(a) a chip carrier body having a cavity therein, and a lower mounting space on the bottom of said cavity, for mounting at least one integrated circuit chip;

(b) at least one bonding ledge having contact pads thereon in proximity to said mounting space inside said cavity;

(c) at least one heat plate mounted above said lower mounting space within said cavity;

(d) said heat plate being attached with low thermal resistance to said body of said chip carrier, said heat plate having a second mounting surface thereon for mounting at least one integrated circuit chip thereon said heat plate comprising openings which expose plural ones of said contact pads on said bonding ledges;

(e) at least one integrated circuit chip mounted on said lower mounting space, and at least one integrated circuit chip mounted on said second mounting surface;

(f) a plurality of connecting leads linking contact pads on said integrated circuits to selected contact pads on said bonding ledges; and

(g) a lid hermetically sealed to said body of said chip cavity, said lid and said chip cavity enclosing therebetween said lower mounting space, said heat plate, and said chips mounted to said space and said heat plate.

20. The board assembly of claim 16, wherein said heat plate has openings therein to expose all of said contact pads and at least one of said bonding ledges.

21. The board assembly of claim 16, wherein said leads from said chips mounted on said heat plate comprise conductive traces supported at least partially by a polymer strip which extends across multiple ones of said conductive traces.

22. The board assembly of claim 16, wherein said chip carrier body comprises a multilayer co-fired ceramic body.

23. The board assembly of claim 16,

wherein a first and second heat plate are enclosed in said cavity, said second heat plate lying above said first heat plate,

and wherein said chip carrier body includes at least first and second bonding ledges,

said second bonding ledge being higher than said first bonding ledge,

and said second heat plate is attached with low thermal resistance to said second bonding ledge.

24. The board assembly of claim 16, wherein said heat plate comprises a metal which has a thermal coefficient of expansion within 20% of that of alumina.

25. The board assembly of claim 16, wherein said second mounting surface on said heat plate is substantially planar.

26. The board assembly of claim 16,

wherein said second mounting surface on said heat plate includes more than one substantially planar portion, said respective planar portions having different heights,

whereby said chips mounted on said heat plate are not all of the same height.

27. The board assembly of claim 26,

wherein said chips mounted on the most protrusive portions of said mounting surface of said heat plate are connected to a first set of parallel leads supported in a flexible polymer strip,

and at least some of said chips which are not mounted on said most protruding portion of said heat plate are connected to leads supported by a second flexible polymer strip,

wherein said first polymer strip at least partially overlies said second polymer strip.

28. The board assembly of claim 16, wherein the average heat dissipation of the chips mounted on said first mounting surface is higher than the average heat dissipation of the chips mounted on said second mounting surface.

29. The board assembly of claim 16, wherein the total heat dissipation of all of the chips mounted on said first mounting surface of said chip carrier body is more than twice the total heat dissipation of all of the chips mounted on said second mounting surface on said heat plate.

30. The board assembly of claim 16,

wherein said chips mounted on said heat plate are connected to said contact pads on said bonding ledges by discrete bonding wires,

and wherein said second mounting surface on said heat plate faces away from said first mounting surface on said chip carrier body.

31. The board assembly of claim 16,

wherein said chips mounted on said heat plate are connected to said contact pads on said bonding ledges through leads supported on a flexible polymer strip,

and wherein said chips are mounted on the face of said heat plate which faces toward said first mounting surface.

32. The board assembly of claim 16, wherein a low thermal resistance thermal contact material makes thermal contact between said heat plate and said lid.

33. The board assembly of claim 32, wherein said thermal contact material comprises a very soft metal.

34. The board assembly of claim 16, wherein said heat plate is attached to said bonding ledge, and said contact pads on said bonding ledge are positioned within said openings of said heat plate.

35. The board assembly of claim 16, wherein said openings in heat plate are indentations around the periphery of said heat plate.

36. The board assembly of claim 34, wherein said openings in heat plate are in dentations around the periphery of said heat plate.

19. The chip carrier of 17, wherein said openings in heat plate are indentations around the periphery of said heat plate.