Low softening point metallic oxide glasses suitable for use in electronic applications

• US 4,945,071 A
• Filed: 04/19/1989
• Issued: 07/31/1990
• Est. Priority Date: 04/19/1989
• Status: Expired due to Term

• Current Assignee: National Starch and Chemical Investment Holding Corporation
• Original Assignee: National Starch and Chemical Investment Holding Corporation
• Inventors: Friesen, G. Delbert, Shin, Yun K., Hoffman, deceased, Lewis
• Primary Examiner(s): Dixon, Jr., William R.
• Assistant Examiner(s): KOSLOW, CAROL M
• Application Number:
  US07/340,183
• Time in Patent Office: 468 Days
• Field of Search: 501/41, 501/73, 501/74, 106/1.14, 106/1.19
• US Class Current: 501/41
• CPC Class Codes: C03C 3/122 containing oxides of As, Sb, Bi, Mo, W, V, Te as glass formers
• CPC Class Codes: C03C 8/24 Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/8385 using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 24/26 Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/0103 Zinc [Zn]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01042 Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/0105 Tin [Sn]
• CPC Class Codes: H01L 2924/01051 Antimony [Sb]
• CPC Class Codes: H01L 2924/01052 Tellurium [Te]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits

Abstract

This invention presents a series of glasses which possess low softening points, high resistance to recrystallization and good durability in the presence of moisture. The glasses are contained within oxides of silver, vanadium, tellurium, and lead and have glass transition temperatures below 260° C., and are useful in electronic applications such as die attach adhesives and sealing glasses.

Claims

1. A low softening point glass composition comprising 2 to 40% by wt. silver oxide, 12 to 40% by wt. vanadium oxide, and 35 to 75% by wt. tellurium oxide, and 2 to 30% by wt. lead oxide, wherein all percentages total 100.

2. The low softening point glass composition of claim 1, wherein the ratio of silver oxide/tellurium oxide is 0.1/1 to 0.5/1 (wt./wt.).

3. The low softening point glass composition of claim 1 having a glass transition temperature below 260°

C.

4. The low softening point glass composition of claim 1, which further comprises up to a total of 10% (by wt.) of one or more oxide compounds selected from the group consisting of phosphorous oxide, tungsten oxide, silicon oxide, copper oxide, aluminum oxide, bismuth oxide, tin oxide, zinc oxide thallium oxide, arsenic oxide, molybdenum oxide, titanium oxide, and antimony oxide.

11. A sealing glass comprising the low softening point composition of claim 1.

12. The sealing glass of claim 11 which further comprises an effective amount of an expansion-modifying filler, such that the thermal expansion coefficient of the glass is reduced.

13. The sealing glass of claim 12, wherein the expansion-modifying filler is selected from the group consisting of beta-eucryptite and amorphous silica.

5. A die attach adhesive composition consisting essentially of an admixture of

(a) a metal selected from the group consisting of silver, gold, and plantinum, and

(b) a powdered, low softening point glass composition comprising 2 to 40% by wt. silver oxide, 12 to 40% by wt. vanadium oxide, 35 to 75% by wt. tellurium oxide, and 2 to 30% by wt. lead oxide, wherein all percentages total 100,

having a peak firing temperature of 400°

C. or lower, wherein the ratio of (a)/(b) is 4;

1 to 100;

1.

6. The die attach adhesive of claim 5 wherein the metal is silver.

7. The die attach adhesive of claim 5, wherein the metal is selected from the group consisting of flaked metal, powdered metal, mixtures of flaked metals, mixtures of powdered metals, and mixtures of flaked and powdered metals.

8. The die attach adhesive of claim 6, wherein the ratio of silver oxide/tellurium oxide in the glass composition is 0.1/1 to 0.5/1 (wt./wt.).

9. The die attach adhesive of claim 5, wherein the glass composition has a glass transition temperature below 260°

C.

10. The die attach adhesive of claim 5, wherein the glass composition further comprises up to a total of 10% (by wt.) of one or more oxide compounds selected from the group consisting of phosphorous pentoxide, tungsten oxide, silicon oxide, copper oxide, aluminum oxide, bismuth oxide, tin oxide, zinc oxide thallium oxide, arsenic oxide, molybdenum oxide, titanium oxide, and antimony oxide.