Test fixture for multi-GHZ microwave integrated circuits

• US 4,947,111 A
• Filed: 04/06/1989
• Issued: 08/07/1990
• Est. Priority Date: 04/06/1989
• Status: Expired due to Fees

• Current Assignee: Harris Corporation (L3Harris Technologies, Inc.)
• Original Assignee: Harris Corporation (L3Harris Technologies, Inc.)
• Inventors: Perkins, Gilbert, Higman, Roger H.
• Primary Examiner(s): Eisenzopf, Reinhard J.
• Assistant Examiner(s): Nguyen, Vinh P.
• Application Number:
  US07/334,147
• Time in Patent Office: 488 Days
• Field of Search: 324/158 F, 324/158 P, 324/73 PC, 324/73 AT, 324/72.5, 333/1, 333/32, 439/482
• US Class Current: 324/750.16
• CPC Class Codes: G01R 1/045 Sockets or component fixtures for RF or HF testing

Abstract

A fixture for testing of an MMIC-containing package includes an alignment plate, a pogo-pin assembly, a waffleline support baseplate, and a pressure engagement assembly. The alignment plate contains a pattern of apertures that matches that of the pins of the MMIC-containing package and defines, with those pins, transmission lines having an impedance that effectively matches that of the internal interconnect to the MMICs within the package. The alignment plate is mounted atop a pogo-pin assembly, pogo-pins of which are aligned with signal conductors of the package, and which form transmission lines having an impedance effectively matching the impedance of the transmission lines through the alignment plate. The pogo-pin assembly engages a waffleline structure in a baseplate. The baseplate includes coaxial connectors that are coupled to channels of the waffleline and joined to the pogo-pins. A pressure engagement assembly is mounted upon the baseplate adjacent to the pogo-pin assembly for urging a MMIC-containing package into pressure contact with the alignment plate. As the package is brought into contact with the alignment plate, its signal conductors are aligned with and pass through the apertures through the plate, and press against the pogo-pins.

Claims

1. A device for supporting and enabling access to signal conductors of a microwave integrated circuit-containing package, so as to permit testing of the operation of the circuit comprising:

a housing containing conductive material and having a first and second surfaces and through which a plurality of cylindrical bores extend between said first and second surfaces, said bores passing through said conductive material and being arranged in a pattern that matches that of the signal conductors of said package;

sleeves of dielectric material inserted into said plurality of cylindrical bores; and

a plurality of pogo-pins inserted into respective ones of said cylindrical bores so as to be surrounded by said sleeves of dielectric material and forming with the conductive material of said housing respective capacitive reactances of sections of microwave transmission line between said first and second surfaces of said housing, such that the impedance thereof effectively matches the impedance through said signal conductors of said package, and further including a plate containing conductive material, said plate having a plurality of apertures through conductive material of said plate, said apertures being arranged in said pattern, and said plate being positioned against said first surface of said housing such that said pattern of apertures therethrough is aligned with the pattern of cylindrical bores through said housing, and wherein the cross section of a respective aperture is larger than that of a conductor of said package, so that when a package is placed on said plate, a respective conductor thereof is surrounded by a dielectric region, as it passes through an aperture to engage a respective one of said pogo pins, and forms a transmission line through said plate having an impedance which effectively matches the impedance of a respective section of transmission line through said housing.

2. A device according to claim 1, wherein said plate is a conductive plate.

3. A device according to claim 1, wherein a respective pogo-pin extends beyond said second surface of said housing, and further including a support baseplate containing a transmission line interconnect structure and a pattern of holes therethrough which intersect regions of said transmission line intersect structure, the pattern of holes through said baseplate corresponding to the pattern of cylindrical bores through said housing, said baseplate engaging said second surface of said housing such that the pattern of holes therethrough is aligned with the pattern of cylindrical bores through said housing, and wherein the cross section of a respective hole through said baseplate is larger than that of the portion of a pogo-pin which extends beyond said second surface of said housing, so that said portion of a pogo-pin is surrounded by a dielectric region as it passes through a hole and intersects said transmission line interconnect structure, and forms a transmission line through said baseplate having an impedance which effectively matches the impedance of a respective section of transmission line through said housing.

4. A device according to claim 3, wherein said transmission line interconnect structure comprises a waffleline structure formed in surface of said baseplate opposite the surface thereof which engages said second surface of said housing.

5. A device according to claim 4, wherein a respective pogo-pin comprises a conductive tube, from a first end of which a conductive pin, that is mechanically solid with and electrically coupled with said first end of said tube and is sized to pass through a hole in said baseplate into a conductor receiving region of said waffleline structure, said tube further including an internal spring mechanically coupled to a translatable rod member which extends through said tube to a second end thereof, and a conductive ring member affixed to said tube.

6. A device according to claim 5, wherein the diameter of said conductive ring member is less than the diameter of a cylindrical bore through said housing, so that there is an annular gap between said conductive ring member and said bore, and wherein a respective bore is fitted with a pair of sleeves of dielectric material that extend from said first and second surfaces of said housing into said bore and abut against the conductive ring member of the pogo-pin that has been inserted into the bore.

7. A device according to claim 6, wherein a respective one of the apertures through said conductive plate has a wide diameter region which receives a bushing to provide coaxial alignment of a conductor pin of said package within said respective aperture.

8. A device according to claim 4, wherein said baseplate further includes a plurality of coaxial connectors that are coupled to spaced apart channels of said waffleline and joined to protruding pins of respective ones of said pogo-pins by way of strands of insulated center conductor that extend through channels of said waffleline.

9. A device according to claim 3, further comprising means, coupled to said support baseplate, for engaging a microwave integrated circuit-containing package and urging said package into contact with said conductive plate, so that, as said package is held against said conductive plate, its signal conductors are aligned with and pass through the apertures through said plate, and press against the pogo-pins of said housing.

10. A device according to claim 9, wherein said means comprises a ram assembly having a rotatable, spring-loaded, axially displaceable cylinder for retaining a microwave integrated circuit-containing package at one end and, through displacement and rotation thereof, for causing said package to be held against said conductive plate by a prescribed spring force.

11. A device according to claim 9, wherein said means comprises a pivotal arm assembly mounted to said baseplate, said arm assembly having a fitting for capturing a microwave integrated circuit-containing package and a clamp for securing said arm in engagement with said baseplate, so that a package captured by said fitting is urged into a pressure engagement against said conductive plate.

12. A device according to claim 1, wherein a respective pogo-pin comprises a conductive tube, protruding from a first end of which is a conductive pin that is mechanically solid with and electrically coupled with said first end of said conductive tube, said conductive pin having a diameter less than that of said conductive tube, said conductive tube containing an internal spring which is mechanically coupled to a translatable rod member which extends through a second end of said conductive tube.

13. A device according to claim 12, wherein said pogo-pin further includes a conductive ring member affixed to said tube.

14. A device according to claim 13, wherein the diameter of said conductive ring member is less than the diameter of a cylindrical bore through said housing, so that there is an annular gap between said conductive ring member and said bore, and wherein a respective bore is fitted with a pair of sleeves of dielectric material that extend from said first and second surfaces of said housing into said bore and abut against the conductive ring member of the pogo-pin that has been inserted into the bore.

15. A device for supporting and enabling access to signal conductors of a microwave integrated circuit-containing package, so as to permit testing of the operation of the circuit comprising:

a housing containing conductive material and having a first and second surfaces and through which a plurality of cylindrical bores extend between said first and second surfaces, said bores passing through said conductive material and being arranged in a pattern that matches that of the signal conductors of said package;

sleeves of dielectric material inserted into said plurality of cylindrical bores; and

a plurality of pogo-pins inserted into respective ones of said cylindrical bores so as to be surrounded by said sleeves of dielectric material and forming with the conductive material of said housing respective capacitive reactances of sections of microwave transmission line between said first and second surfaces of said housing, such that the impedance thereof effectively matches the impedance through said signal conductors of said package, wherein a respective pogo-pin comprises a conductive tube from a first end of which protrudes a conductive pin that is mechanically solid with and electrically coupled with said first end of said tube, said conductive pin having a diameter less than that of said conductive tube, said tube further containing an internal spring which is mechanically coupled to a translatable rod member which extends through said tube to a second end thereof, and a conductive ring member affixed to said tube.

16. A device according to claim 15, wherein the diameter of said conductive ring member is less than the diameter of a cylindrical bore through said housing, so that there is an annular gap between said conductive ring member and said bore, and wherein a respective bore is fitted with a pair of sleeves of dielectric material that extend from said first and second surfaces of said housing into said bore and abut against the conductive ring member of the pogo-pin that has been inserted into the bore.

17. A testing fixture for supporting and providing access to signal conductor pins extending from a microwave integrated circuit-containing package, so as to permit testing of the operation of the circuit comprising:

a conductive alignment plate having a plurality of apertures therethrough, said apertures being arranged in a pattern that matches that of the signal conductor pins of said package, so that said package may be placed upon said alignment plate with said signal conductor pins passing through said apertures and forming therewith a transmission line having an impedance which effectively matches that of the signal conductors within said package;

a pogo-pin assembly including a housing containing conductive material and having a first and second surfaces and through which a plurality of cylindrical bores extend between said first and second surfaces, said bores passing through said conductive material and being arranged in a pattern that matches that of the signal conductors of said package, sleeves of dielectric material inserted into said plurality of cylindrical bores, and a plurality of pogo-pins inserted into respective ones of said cylindrical bores, so as to be surrounded by said sleeves of dielectric material and forming with the conductive material of said housing respective sections of microwave transmission line between said first and second surfaces of said housing, with the impedance thereof effectively matching the impedance of the transmission line through said conductive alignment plate, said pogo-pins extending beyond said second surface of said housing; and

a support baseplate containing a transmission line interconnect structure and a pattern of holes therethrough which intersect regions of said transmission line interconnect structure, the pattern of holes through said baseplate corresponding to the pattern of cylindrical bores through said housing, said baseplate engaging said second surface of said housing such that the pattern of holes therethrough is aligned with the pattern of cylindrical bores through said housing, and wherein the portion of a pogo-pin which extends beyond said second surface of said housing forms a transmission line through said baseplate having an impedance which effectively matches the impedance of a respective section of transmission line through said housing.

18. A device according to claim 17, further comprising means, coupled to said support baseplate, for engaging a microwave integrated circuit-containing package and urging said package into contact with said conductive plate, so that, as said package is held against said conductive plate, its signal conductors are aligned with and pass through the apertures through said plate, and press against the pogo-pins of said housing.

19. A device according to claim 18, wherein said means comprises a ram assembly having a rotatable, spring-loaded, axially displaceable cylinder for retaining a microwave integrated circuit-containing package at one end and, through displacement and rotation thereof, for causing said package to be held against said conductive plate by a prescribed spring force.

20. A device according to claim 18, wherein said means comprises a pivotal arm assembly mounted to said baseplate, said arm assembly having a fitting for capturing a microwave integrated circuit-containing package and a clamp for securing said arm in engagement with said baseplate, so that a package captured by said fitting is urged into a pressure engagement against said conductive plate.

21. A device according to claim 17, wherein said transmission line interconnect structure comprises a waffleline structure formed in a surface of said baseplate opposite the surface thereof which engages said second surface of said housing, and wherein said baseplate further includes a plurality of coaxial connectors that are coupled to spaced apart channels of said waffleline and joined to protruding pins of respective ones of said pogo-pins by way of strands of insulated center conductor that extend through channels of said waffleline.

22. A device according to claim 21, wherein a respective pogo-pin comprises a conductive tube from a first end of which protrudes a conductive pin that is mechanically solid with and electrically coupled with said first end of said tube, said tube further containing an internal spring which is mechanically coupled to a translatable rod member which extends through said tube to a second end thereof, and a conductive ring member affixed to said tube, and wherein the diameter of said conductive ring member is less than the diameter of a cylindrical bore through said housing, so that there is an annular gap between said conductive ring member and said bore, and wherein a respective bore is fitted with a pair of sleeves of dielectric material that extend from said first and second surfaces of said housing into said bore and abut against the conductive ring member of the pogo-pin that has been inserted into the bore.

23. A device according to claim 22, wherein a respective one of the apertures through said conductive plate has a wide diameter region which receives a bushing to provide coaxial alignment of a conductor pin of said package within said respective aperture.

24. A pogo-pin for use with a multi-GHz signal coupling device comprising a conductive tube, protruding from a first end of which is a conductive pin that is mechanically solid with and electrically coupled with said first end of said conductive tube, said conductive pin having a diameter less than that of said conductive tube, said conductive tube containing an internal spring which is mechanically coupled to a translatable rod member which extends through a second end of said conductive tube and further including a conductive ring member affixed to said tube.