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Method and apparatus for monitoring layer erosion in a dry-etching process

  • US 4,948,259 A
  • Filed: 06/30/1989
  • Issued: 08/14/1990
  • Est. Priority Date: 01/14/1989
  • Status: Expired due to Fees
First Claim
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1. A method for monitoring layer erosion of layers on at least one substrate in a dry-etching process, having a first electrode that electrically contacts the substrate to be etched and a second electrode that is located above the first electrode, both electrodes being situated inside a process chamber, comprising the steps of:

  • placing an optical photometer outside of the process chamber and reflecting a light beam off of the substrate in the process chamber by means of the photometer, signals output by the optical photometer being amplified by an electrical circuit and being edited and displayed by means of a Fourier transformation.

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