I/O pin and method for making same

• US 4,949,455 A
• Filed: 02/01/1989
• Issued: 08/21/1990
• Est. Priority Date: 02/27/1988
• Status: Expired due to Fees

• Current Assignee: AMP Incorporated (Johnson Controls International plc)
• Original Assignee: AMP Incorporated (Johnson Controls International plc)
• Inventors: Kurokawa, Noriharu, Kitai, Toshihiko, Nakamura, Keiichi, Oshima, Tsutomu
• Primary Examiner(s): Hall, Carl E.
• Assistant Examiner(s): Arbes, Carl J.
• Application Number:
  US07/305,312
• Time in Patent Office: 566 Days
• Field of Search: 29/840, 29/843, 29/877, 29/878, 29/879, 174/68.5, 228/180.2, 228/56.3, 439/91, 439/75, 439/65, 361/412, 361/414, 204/15
• US Class Current: 29/843
• CPC Class Codes: H01L 21/4885 Wire-like parts or pins wire ball formation B23K20/00; methods related to connecting semiconductor or other solid state bodies H01L24/00
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 Fully indexed content
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 Monolayer substrate
• CPC Class Codes: H01L 2924/15312 being a pin array, e.g. PGA
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H05K 2201/0367 Metallic bump or raised conductor not used as solder bump
• CPC Class Codes: H05K 2201/10378 Interposers
• CPC Class Codes: H05K 2203/0235 Laminating followed by cutting or slicing perpendicular to plane of the laminate; Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires
• CPC Class Codes: H05K 3/4007 Surface contacts, e.g. bumps H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3457
• CPC Class Codes: H05K 3/4038 Through-connections; Vertical interconnect access [VIA] connections H05K3/403, H05K3/42 take precedence
• CPC Class Codes: Y10T 29/49149 by metal fusion bonding
• CPC Class Codes: Y10T 29/49213 : Metal

Abstract

An electrical pin comprises a metal pin having plated metal members at peripheral end surfaces thereof and head members including solder secured to the end surfaces of the metal pin and the plated metal members.

Claims

1. A method of making electrical pins comprising the steps of:

forming a matrix of a metal plate member and metal rods secured in longitudinally spaced grooves in a surface of the metal plate member;

securing a plurality of said matrix together along with a planar metal plate member on the uppermost matrix thereby forming a stacked structure;

cutting the stacked structure at a specified length and perpendicular to the direction of the metal rods thereby providing a workpiece of metal plate member sections and pins;

placing photoresist layers on upper and lower surfaces of said workpiece;

applying light through a mask onto the photoresist layers causing areas of the photoresist layers over the end surfaces of the pins and between the pins to be fixed while the areas of the photoresist layers surrounding the fixed areas over the end surfaces of the pins is unfixed;

removing the unfixed areas of the photoresist layers thereby exposing the areas of the metal plate member sections thereunder;

etching the exposed areas of the metal plate member sections thereby forming recesses and exposing peripheral surfaces at the ends of the pins;

plating the recesses and peripheral end surfaces of the pins with a metal layer;

removing the fixed areas of the photoresist layers from the workpiece;

applying a photoresist layer onto the upper and lower surfaces of the workpiece leaving the end surfaces of the pins and the plated metal layers exposed;

plating a solder layer onto the exposed end surfaces of the pins and plated metal layers thereby forming head members;

removing the photoresist layer from the workpiece surfaces; and

etching the metal plate member sections until a thin section thereof remains thereby forming a carrier member with a group of electrical pins.

2. A method as claimed in claim 1 and including the further steps of:

adhering the head members of the electrical pins in the same plane to an orientation member;

and etching the remaining thin section of the metal plate member sections away leaving the electrical pins adhered to the orientation member.

3. A method as claimed in claim 2, and including the additional steps of:

removing the electrical pins from the orientation member; and

securing the electrical pins onto a carrier member at a specified distance between the pins.

5. An electrical pin as claimed in claim 1, wherein said head members are solder alloy.

4. An electrical pin, comprising:

an elongate member having plated metal members secured to peripheral surfaces of the ends of the elongate member with the end surfaces of the elongate member being substantially coplanar with the respective end surfaces of the plated metal members; and

head member of conductive metal including solder secured onto the end surfaces of said elongate member and said plated metal members, and an inner layer of a precious metal covered by the solder.

6. An electrical pin as claimed in claim 4, wherein the precious metal layer is gold.

7. An electrical pin comprising:

a straight, elongated electrically conductive pin member of substantially constant small diameter over the entire length;

plated metal members electrically plated over the outer peripheries of said electrically conductive pin member at and near both end portions thereof to a sufficient width and a thickness to substantially increase the outer diameter; and

generally semi-spherical members made of low melting point electrically conductive material and, completely covering both end surfaces of said pin member and plated metal members;

wherein said plated metal members and generally semi-spherical members constitute a pair of integral metal head members of the electrical pin.

8. An electrical pin of claim 7, wherein said generally semi-spherical members are made of solder alloy.

9. An electrical pin of claim 7, wherein each of said generally semi-spherical members comprises a precious metal inner layer and a solder alloy outer layer.

10. An electrical pin comprising:

a pin member having plated metal members secured to peripheral surfaces of the ends of the pin member, the pin member having a first diameter, the end surfaces of the pin member being substantially coplanar with the respective end surfaces of the plated metal members;

head members of conductive metal including solder secured onto the end surfaces of the pin member, the head members having a second diameter, such that the second diameter is larger than the first diameter.