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Multi-chamber integrated process system

  • US 4,951,601 A
  • Filed: 06/23/1989
  • Issued: 08/28/1990
  • Est. Priority Date: 12/19/1986
  • Status: Expired due to Term
First Claim
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1. An integrated vacuum processing system for workpieces such as semiconductor wafers, comprising:

  • a vacuum load lock chamber, having a closable entrance;

    at least one vacuum processing chamber mounted to said load lock chamber and communicating therewith via openings in the adjacent chambers;

    each of said processing chambers including a wafer support means and being adapted for performing a process selected from at least one of gas chemistry etching, gas chemistry deposition, physical sputtering and rapid annealing on at least one wafer positioned on the support and, further including means for reversibly moving a wafer along an axis from a selected internal position adjacent the wafer support means to and onto the wafer support means; and

    a wafer handling robot mounted within the load lock chamber, comprising;

    a wafer support blade;

    a foldable dual four-bar link mechanism mounting the blade at a first, output end thereof and having a second, opposite actuator end comprising an input link rotatably mounted at a selected location with the chamber for moving the four-bar link mechanism between a folded configuration with the output end on one side of the selected mounting position and selected extended orientations with the output end on the opposite side of the selected mounting position, including an extended configuration with the wafer support blade at said selected internal position;

    means for rotating the input link to extend and retract the foldable dual four-bar link mechanism and support blade; and

    means for rotating the dual four-bar link mechanism and wafer support blade.

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