Vapor deposition patterning method

• US 4,952,420 A
• Filed: 10/12/1988
• Issued: 08/28/1990
• Est. Priority Date: 10/12/1988
• Status: Expired due to Fees

• Current Assignee: Advanced Deposition Technologies, Inc.
• Original Assignee: Advanced Dielectric Technologies, Inc.
• Inventors: Walters, Glenn J.
• Primary Examiner(s): Lawrence, Evan
• Application Number:
  US07/256,695
• Time in Patent Office: 685 Days
• Field of Search: 118/721, 118/505, 118/623, 427/99, 427/272, 427/97, 427/282, 505/1, 505/741
• US Class Current: 427/96.8
• CPC Class Codes: C23C 14/042 using masks
• CPC Class Codes: C23C 16/042 using masks
• CPC Class Codes: H05K 3/143 Masks therefor H05K3/048 takes precedence
• CPC Class Codes: H05K 3/4076 by thin-film techniques
• CPC Class Codes: H05K 3/42 Plated through-holes or plated via connections
• CPC Class Codes: Y10S 505/741 Coating or casting onto a substrate, e.g. screen printing, tape casting

Abstract

An etchless patterning method for depositing material patterns upon substrates. The method involves providing substrate to be patterned, immobilizing a patterned physical mask upon a mask carrier, transferring the mask from the carrier to contact the substrate, immobilizing the mask upon the substrate while removing the mask carrier, exposing the masked substrate to vapor phase pattern material in a vacuum, reimmobilizing the mask upon the mask carrier and removing the mask from the substrate in a manner that allows the mask to remain immobilized on the mask carrier. The process is particularly well suited for the production of circuit boards or electronic applications.

Claims

1. An etchless patterning method for the direct vapor deposition of a desired material pattern on a substrate, the method comprising the steps of:

a. immobilizing a reusable, patterned physical mask upon a mask carrier, the mask being cut out in a desired physical pattern;

b. contacting the immobilized mask with a surface of the substrate in a manner such that the mask is immobilized upon such surface;

c. removing the carrier from the immobilized mask on the substrate surface;

d. vapor depositing a pattern material through said mask and onto the substrate thereby forming traces of the desired material pattern on said substrate;

e. reimmobilizing the mask upon the mask carrier; and

f. removing the patterned mask from the substrate surface in a manner such that the mask remains immobilized upon the mask carrier.

2. An etchless patterning method of claim 1 wherein the substrate is an electrically insulating, solid, polymeric material.

3. An etchless patterning method of claim 1 wherein the pattern material is selected from the group consisting of metals and metallic alloys, polymeric materials, elemental carbon, inorganic materials and combinations thereof.

4. An etchless patterning method of claim 1 wherein the vapor phase pattern material is provided by a method selected from the group consisting of chemical vapor deposition and physical vapor deposition.

5. An etchless patterning method of claim 1 wherein the patterned mask comprises a material selected from the group consisting of metals metallic alloys, ceramics and polymeric materials.

6. An etchless patterning method of claim 1 wherein the patterned mask is maintained in intimate contact with the substrate surface via magnetic attraction.

7. An etchless patterning method of claim 5 wherein the mask carrier is etch-resistant.

8. An etchless patterning method of claim 7 wherein the mask carrier comprises titanium.

9. An etchless patterning method of claim 5 wherein the patterned mask is continuously immobilized and the continuous immobilization is provided by magnetic attraction.

10. An etchless patterning method of claim 1 wherein the substrate comprises a circuit board substrate containing through-holes.

11. An etchless patterning method of claim 10 wherein the through-holes are countersunk on at least one substrate surface.

12. An etchless patterning method of claim 10 wherein the pattern material is deposited on the interior surfaces of the through-holes simultaneously with the deposition on the substrate surface.

13. An etchless patterning method of claim 1 wherein the pattern material comprises a superconducting material.

14. An etchless patterning method of claim 10 wherein conductive contact pads are deposited on at least one pattern region subsequent to pattern deposition.

15. An etchless patterning method of claim 14 wherein the conductive contact pads comprise a Ni-Au multilayer.

16. An etchless patterning method of claim 10 wherein conductive device mounting pads are deposited on at least one pattern region subsequent to pattern deposition.

17. An etchless patterning method of claim 16 wherein the conductive device mounting pads comprise solder.

18. A method as in claim 1 wherein the mask contains isolated mask sections which are maintained in proper orientation to the pattern throughout immobilization and substrate patterning.

19. A method for directly depositing a metallic pattern on a substrate, the method comprising the steps of:

a. immobilizing a reusable, solid, patterned mask upon a mask carrier, the mask being cut out in a desired material pattern;

b. contacting the immobilized mask with a surface of the substrate in a manner such that the mask is immobilized upon such surface;

c. removing the carrier from the immobilized mask on the substrate surface;

d. vapor depositing a metallic pattern material through said mask and onto the substrate thereby forming metallic traces of the desired material pattern in direct contact with the substrate;

e. reimmobilizing the mask upon the mask carrier; and

f. removing the reusable, solid, patterned mask from the substrate surface in a manner such that the mask remains immobilized upon the mask carrier.

20. An etchless patterning method of claim 19 wherein the metallic pattern material is selected from the group consisting of gold, silver, copper, aluminum and combinations thereof.

21. An etchless patterning method of claim 19 wherein the solid, patterned mask comprises a material selected from the group consisting of metals, metallic alloys, ceramics and polymeric materials.

22. An etchless patterning method of claim 19 wherein the solid, patterned mask is maintained in intimate contact with the substrate via magnetic attraction.

23. A method as in claim 19 wherein the mask contains isolated mask sections which are maintained in proper orientation to the pattern throughout immobilization and substrate patterning.

24. A method for the production of circuit boards, the method comprising the steps of:

a. providing a circuit board substrate having a plurality of through-holes;

b. immobilizing a reusable, solid, patterned mask upon a mask carrier, the mask being cut out in the desired pattern;

c. contacting the immobilized mask with a surface of the substrate in a manner such that the mask is immobilized upon such surface and registered to provide proper orientation with the substrate through-holes;

d. removing the carrier from the immobilized mask on the substrate surface;

e. vapor depositing an electrically conductive or superconductive pattern material through said mask and onto the substrate thereby forming electrically conductive or superconductive traces of the desired material pattern in direct contact with the substrate and electrically conductive or superconductive pattern material on interior surfaces of the substrate through-holes;

f. reimmobilizing the mask upon the mask carrier; and

g. removing the reusable, solid, patterned mask from the substrate surface in a manner such that the mask remains immobilized upon the mask carrier to thereby provide a circuit board having a patterned electrically conductive or superconductive material deposited on the substrate surface, said patterned material being integrally continuous with pattern material deposited upon the inner surfaces of the substrate through-holes.

25. An etchless patterning method of claim 24 wherein the through-holes are countersunk on at least one substrate surface.

26. A method as in claim 24 wherein the mask contains isolated mask sections which are maintained in proper orientation to the pattern throughout immobilization and substrate patterning.

27. An etchless method for the production of circuit boards, the method comprising the steps of:

a. providing a circuit board substrate on a substrate carrier surface, the substrate having a plurality of through-holes;

b. immobilizing a patterned physical mask on a mask carrier surface via a first magnetic means;

c. contacting the mask with the substrate surface while registering the mask to provide proper orientation with the substrate through-holes;

d. disengaging the first magnetic means while immobilizing the mask on the substrate surface via a second magnetic means;

e. removing the mask carrier surface;

f. vapor depositing a pattern material through the mask and onto the substrate to thereby form a desired material pattern on the substrate and on the interior surfaces of substrate through-holes;

g. replacing the mask carrier surface upon the mask;

h. disengaging the second magnetic means while immobilizing the mask on the mask carrier surface via the first magnetic means; and

,

i. removing the mask to thereby provide a circuit board having a pattern material deposited on the substrate surface and on the interior surfaces of substrate through-holes.

28. A method of claim 27 wherein the substrate through-holes are countersunk on at least one substrate surface.

29. A method of claim 27 wherein the mask carrier surface comprises titanium.

30. A method of claim 27 wherein at least one of said first or said second magnetic means comprises an electromagnet.

31. A method for forming a desired material pattern on a substrate, the method comprising the steps of:

a. immobilizing a mask material on a mask carrier;

b. completely removing mask material from regions defining the ultimate desired material pattern, to thereby provide an immobilized, reusable, patterned mask upon a mask carrier;

c. contacting the immobilized mask with a surface of the substrate in a manner such that the mask is immobilized upon such surface;

d. removing the carrier from the immobilized mask on the substrate surface;

e. vapor depositing a pattern material through said mask and onto the substrate, thereby forming traces of the desired material pattern on said substrate;

f. reimmobilizing the mask upon the mask carrier; and

g. removing the patterned mask in a manner such that the mask remains immobilized upon the mask carrier.

32. A method as in claim 31 wherein the mask contains isolated mask sections which are maintained in proper orientation to the pattern throughout immobilization and patterning.