Semiconductor device housing with magnetic field protection

• US 4,953,002 A
• Filed: 09/05/1989
• Issued: 08/28/1990
• Est. Priority Date: 03/31/1988
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Honeywell Incorporated (Honeywell International Inc.)
• Inventors: Nelson, Keith W., Kawai, Takeshi, Lenz, James E.
• Primary Examiner(s): Jackson, Jr., Jerome
• Application Number:
  US07/404,003
• Time in Patent Office: 357 Days
• Field of Search: 357/27, 357/74, 357/84
• US Class Current: 257/659
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/585 comprising conductive layers or plates or strips or rods or rings H01L23/60, H01L23/62, H01L23/64, H01L23/66 take precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

A housing for integrated circuit structures containing magnetic thin film which has permeable protective layers parallel thereto.

Claims

1. A housing for protecting a selected integrated circuit structure contained therein, said integrated circuit structure having therein at least one magnetizable material with its magnetization orientation confined substantially to a plane as a magnetization plane, said housing comprising:

a pair of spaced apart layers each formed of a relatively high magnetic permeability material positioned substantially parallel to said magnetization plane between which said integrated circuit structure is secured with each of said layers extending parallel to said magnetization plane to an extent greater than does said magnetizable material in said integrated circuit structure, said housing between said layers being substantially free of magnetic material that is oriented to extend substantially perpendicular to said magnetization plane, and said housing being free of any substantially permanent magnetic materials other than in said integrated circuit structure; and

a plurality of conductive leads extending past said pair of layers such that portions thereof are externally available, said integrated circuit structure having interconnection regions therein each electrically connected to a selected one of said plurality of conductive leads.

2. The apparatus of claim 1 wherein one of said pair of layers extends to a greater extent parallel to said magnetization plane than does that one remaining of said pair.

3. The apparatus of claim 1 where one of said pair of spaced apart layers is, with substantial portions of each of said conductive leads, in a plane as a layer plane, those portions of said conductive leads being electrically connected to said interconnection regions.

4. The apparatus of claim 3 wherein said conductive leads are formed of that same high magnetic permeability material as is that one of said pair of layers which is substantially in said layer plane with portions of said conductive leads.

5. The apparatus of claim 3 wherein said integrated circuit structure, said pair of layers, and said conductive lead portions which are in said layer plane with one of said layers have substantially all of those spaces occurring between them impregnated with an electrical insulating material.