Pendulum with bending spring joint

• US 4,953,834 A
• Filed: 01/20/1988
• Issued: 09/04/1990
• Est. Priority Date: 01/20/1987
• Status: Expired due to Term

• Current Assignee: Litec-LP GmbH
• Original Assignee: Litec-LP GmbH
• Inventors: Ryrko, Bruno, Ebert, Wolfram, Hafen, Martin, Handrich, Eberhard
• Primary Examiner(s): Olszewski, Robert P.
• Assistant Examiner(s): Graham, Matthew C.
• Application Number:
  US07/146,295
• Time in Patent Office: 958 Days
• Field of Search: 267/141, 267/182, 267/150, 267/158, 267/160, 156/643, 156/647, 156/662, 74/570
• US Class Current: 267/160
• CPC Class Codes: F16C 11/12 incorporating flexible connections, e.g. leaf springs
• CPC Class Codes: F16F 1/18 Leaf springs planar springs in general F16F1/027; "Belleville"-type springs with generally radial arms F16F1/324

Abstract

A micromechanical bending spring joint is formed of selectively etched wafer material. The joint includes a pair of leaf springs arranged alongside each other. Each spring is inclined at an oblique angle to the opposed surfaces of the wafer and such springs cross to define a point of intersection. The joint, selectively etched from a single wafer, is characterized by high precision of fulcrum position, bending spring constant and transverse axis rigidity.

Claims

1. A pendulum device comprising in combination:

(a) a generally T-shaped pendulum;

(b) a pendulum fastening device;

(c) said pendulum and said pendulum fastening device being formed from a wafer;

(d) said pendulum being joined to said pendulum fastening device by means of two homologous micromechanical bending spring joints comprising a pair of leaf springs arranged alongside each other and at oblique angles with respect to the major surfaces of said wafer; and

(e) said pendulum device being selectively etched from a single wafer.

2. A pendulum device as defined in claim 1 further characterized in that said wafer is of silicon.

3. A pendulum device comprising, in combination:

(a) a generally T-shaped pendulum;

(b) a pendulum fastening device;

(c) said pendulum and said pendulum fastening device being formed from a generally-planar wafer;

(d) said pendulum being joined at said pendulum fastening device by means of two homologous micromechanical bending spring joints comprising a pair of leaf springs so arranged alongside each other and at oblique angles with respect to the major surfaces of said wafer as to cross in a plane perpendicular to the plane of said wafer; and

(e) said pendulum device being selectively etched from a single wafer.

4. A pendulum device as defined in claim 3 further characterized in that said wafer is of silicon.