Pendulum with bending spring joint
First Claim
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1. A pendulum device comprising in combination:
- (a) a generally T-shaped pendulum;
(b) a pendulum fastening device;
(c) said pendulum and said pendulum fastening device being formed from a wafer;
(d) said pendulum being joined to said pendulum fastening device by means of two homologous micromechanical bending spring joints comprising a pair of leaf springs arranged alongside each other and at oblique angles with respect to the major surfaces of said wafer; and
(e) said pendulum device being selectively etched from a single wafer.
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Abstract
A micromechanical bending spring joint is formed of selectively etched wafer material. The joint includes a pair of leaf springs arranged alongside each other. Each spring is inclined at an oblique angle to the opposed surfaces of the wafer and such springs cross to define a point of intersection. The joint, selectively etched from a single wafer, is characterized by high precision of fulcrum position, bending spring constant and transverse axis rigidity.
42 Citations
4 Claims
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1. A pendulum device comprising in combination:
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(a) a generally T-shaped pendulum; (b) a pendulum fastening device; (c) said pendulum and said pendulum fastening device being formed from a wafer; (d) said pendulum being joined to said pendulum fastening device by means of two homologous micromechanical bending spring joints comprising a pair of leaf springs arranged alongside each other and at oblique angles with respect to the major surfaces of said wafer; and (e) said pendulum device being selectively etched from a single wafer. - View Dependent Claims (2)
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3. A pendulum device comprising, in combination:
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(a) a generally T-shaped pendulum; (b) a pendulum fastening device; (c) said pendulum and said pendulum fastening device being formed from a generally-planar wafer; (d) said pendulum being joined at said pendulum fastening device by means of two homologous micromechanical bending spring joints comprising a pair of leaf springs so arranged alongside each other and at oblique angles with respect to the major surfaces of said wafer as to cross in a plane perpendicular to the plane of said wafer; and (e) said pendulum device being selectively etched from a single wafer. - View Dependent Claims (4)
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Specification