Method for manufacturing semiconductor device

• US 4,957,882 A
• Filed: 03/08/1989
• Issued: 09/18/1990
• Est. Priority Date: 11/25/1988
• Status: Expired due to Fees

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Shinomiya, Kohji
• Primary Examiner(s): Hearn, Brian E.
• Assistant Examiner(s): Griffis, Andrew
• Application Number:
  US07/320,498
• Time in Patent Office: 559 Days
• Field of Search: 437/209, 437/927, 264/272.17
• US Class Current: 438/65
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/29011 comprising apertures or cavities
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/83193 wherein the layer connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/8385 using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 23/495 Lead-frames or other flat leads H01L23/498 takes precedence; lead frame interconnections between components H01L23/52
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 27/1443 with at least one potential jump or surface barrier
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/0665 Epoxy resin
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/16235 : Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/18161 : of a flip chip
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: Y10T 29/49121 : Beam lead frame or beam lead device

Abstract

Disclosed is a method for manufacturing a semiconductor device having a semiconductor chip with a light receiving element disposed in a surface of the semiconductor chip, and a light transmission window having a first surface facing the light receiving element and a second surface generally parallel to the first surface and for protecting the light receiving element. One of two liquid agents constituting a two-part adhesive is applied to the surface of the semiconductor chip so that the liquid agent surrounds the light receiving element, and the other of the liquid agents of the two-part adhesive is applied to the first surface of the light transmission window in correspondence with the former liquid agent. These liquid agents are brought into contact with each other to fix the light transmission window to the semiconductor chip. The semiconductor chip and part of the light transmission window is then resin-molded so that the second surface of the light transmission window is exposed.

Claims

1. A method for manufacturing a semiconductor device having a semiconductor chip with a light receiving element disposed in a surface of said semiconductor chip and a light transmission window for protecting said light receiving element, said light transmission window having a first surface facing said light receiving element and a second surface generally parallel to said first surface, said method comprising:

applying a first of first and second liquid agents comprising a two-part adhesive to a surface of a semiconductor chip in which is disposed a light receiving element to surround said light receiving element with said first liquid agent;

applying the second of said liquid agents of said two-part adhesive to a first surface of a light transmission window at a location corresponding to the first of said liquid agents as applied to said semiconductor chip;

fixing said semiconductor chip and said light transmission window to each other by bringing said first and second liquid agents into contact with each other; and

molding said semiconductor chip in a resin without obscuring said second surface of said light transmission window with the resin.

2. A method according to claim 1 wherein said first and second liquid agents set by contacting each other including forming a space enclosed by the adhesive between said light receiving element and said light transmission window.

3. A method according to claim 1 including forming a peripheral wall on the surface of said semiconductor chip so that said peripheral wall surrounds said light receiving element and applying said first liquid agent to said peripheral wall.

4. A method according to claim 1 wherein said light transmission window has an annular peripheral wall formed on said first surface including applying said second liquid agent to said peripheral wall.

5. A method according to claim 1 wherein said two-part adhesive is an epoxy adhesive.

6. A method according to claim 1 including applying said first and second liquid agents by screen printing.

7. A method according to claim 1 including applying said first and second liquid agents by stamping.

8. A method according to claim 1 wherein said semiconductor chip has a plurality of bonding pads including mounting said semiconductor chip on a die pad of a lead frame having a plurality of leads, electrically connecting said leads with wires to said bonding pads, and resin-molding said semiconductor chip after electrically connecting the leads and bonding pads.