Thermoplastic resin composition

• US 4,957,966 A
• Filed: 06/07/1988
• Issued: 09/18/1990
• Est. Priority Date: 06/10/1987
• Status: Expired due to Fees

• Current Assignee: Sumitomo Chemical Company Limited
• Original Assignee: Sumitomo Chemical Company Limited
• Inventors: Okada, Takayuki, Sanada, Takashi, Nishio, Taichi, Hosoda, Satoru, Abe, Hiroomi, Suzuki, Yasurou
• Primary Examiner(s): Ziegler, Jacob
• Application Number:
  US07/203,187
• Time in Patent Office: 833 Days
• Field of Search: 525/397, 525/905, 525/66, 525/68, 525/92, 525/395, 525/396
• US Class Current: 525/66
• CPC Class Codes: C08K 5/0008 Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
• CPC Class Codes: C08L 2666/02 Organic macromolecular compounds, natural resins, waxes or and bituminous materials
• CPC Class Codes: C08L 2666/22 Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
• CPC Class Codes: C08L 71/00 Compositions of polyethers obtained by reactions forming an ether link in the main chain of polyacetals C08L59/00; of epoxy resins C08L63/00; of polythioether-ethers C08L81/02; of polyether-sulfones C08L81/06; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 71/123 not modified by chemical after-treatment
• CPC Class Codes: C08L 75/00 Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 77/00 Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain of polyhydrazides C08L79/06; of polyamideimides or polyamide acids C08L79/08; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 81/00 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
• CPC Class Codes: Y10S 525/905 Polyphenylene oxide

Abstract

A novel thermoplastic resin composition comprising a matrix of polyamide resin (E) and a disperse phase of a composition (D), said composition (D) comprising a polyphenylene ether (A), a rubber-like materail (B) and a mutual compatibilizer (C), said polyphenylene ether (A) being obtained from at least one phenol compound represented by the formula: ##STR1## wherein R₁, R₂, R₃, R₄ and R₅ represents a hydrogen atom, a halogen atom or a substituted or unsubstituted hydrocarbon residue, with a proviso that at least one of them is a hydrogen atom, and said polyphenylene ether (A) having a reduced viscosity η_sp/c of 0.40-0.58 deciliter/gram, said mutual compatibilizer (C) being compatible or reactive with said polyphenylene ether and reactive with said polyamide resin, and said polyamide resin (E) having a number average molecular weight of 14,000-40,000 and an end amino group content of 50-95 mmole/kg, wherein the thermoplastic resin composition constitutes 1-65 wt. % of said polyphenylene ether (A), 1-20 wt. % of said rubber-like material (B), 0.01-5 wt. % of said mutual compatibilizer (C) and 35-97.99 wt. % of said polyamide resin (E), based on the total weight of said thermoplastic resin composition, and the weight average particle size of said disperse phase is 2 micron or less.

Claims

1. A thermoplastic resin composition comprising a matrix of polyamide resin (E) and a disperse phase of a composition (D) which is obtained by melting and mixing the composition (D) and the polyamide resin (E),

said composition (D) being obtained by melting and mixing a polyphenylene ether (A) together with a rubber-like material (B) and a mutual compatibilizer (C).

said polyphenylene ether (A) being obtained by oxidation polymerization of at least one phenol compound represented by the formula:

##STR7## wherein R₁, R₂, R₃, R₄ and R₅ represent a hydrogen atom, a halogen atom or a substituted or unsubstituted hydrocarbon residue, with a proviso that at least one of them is a hydrogen atom, and said polyphenylene ether (A) having a reduced viscosity η

_sp/c of 0.40-0.58 deciliter/gram,

said mutual compatibilizer (C) being reactive with said polyphenylene ether and reactive with said polyamide resin, and

said polyamide resin (E) having a number average molecular weight of 14,000-30,000 and an end amino group content of 50-90 mmole/kg,

wherein the thermoplastic resin composition constitutes 1-65 wt. % of said polyphenylene ether (A), 1-20 wt. % of said rubber-like material (B), 0.01-5 wt. % of said mutual compatibilizer (C) and 35-97.99 wt. % of said polyamide resin (E), based on the total weight of said thermoplastic resin composition, and the weight average particle size of said disperse phase is 2 microns or less.

2. A thermoplastic resin composition according to claim 1 wherein the mutual compatibilizer (C) is at least one compound selected from the compounds which are capable of melting in and grafting to polyphenylene ether and contain in its molecule at least one of carboxyl group, acid anhydride group, acid amide group, imide group, carboxylate ester group, epoxy group, amino group, isocyanate group, a group containing oxazoline ring and hydroxyl group.

3. A thermoplastic resin composition according to claim 2 which said mutual compatibilizer (C) is maleic anhydride and addition amount of said maleic anhydride is 3% or less by weight based on said polyphenylene ether (A).

4. A thermoplastic resin composition according to claim 1 wherein the reduced viscosity η

_sp/c of said polyphenylene ether (A) is 0.45-0.52 deciliter/gram.

5. A thermoplastic resin composition according to claim 1 wherein said rubber-like material (B) is saturated polyolefine rubber or styrene copolymer rubber.

6. A thermoplastic resin composition according to claim 5 wherein said saturated polyolefine rubber is maleic anhydride modified ethylene-propylene rubber.

7. A thermoplastic resin composition according to claim 1 wherein said rubber-like material (B) is styrene-ethylene-butylene-styrene block copolymer rubber or styrene-butadiene-styrene block copolymer rubber.

8. A thermoplastic resin composition according to claim 1 wherein the weight average particle size of said disperse phase is 1 micron or less.

9. A thermoplastic resin composition according to claim 3 wherein addition amount of maleic anhydride is 1.5% or less by weight based on said polyphenylene ether (A).