Probing plate for wafer testing

• US 4,961,052 A
• Filed: 07/17/1989
• Issued: 10/02/1990
• Est. Priority Date: 01/07/1989
• Status: Expired due to Term

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Takagi, Ryoichi, Kohara, Masanobu, Tada, Tetsuo
• Primary Examiner(s): Karlsen, Ernest F.
• Assistant Examiner(s): Nguyen, Vinh P.
• Application Number:
  US07/380,427
• Time in Patent Office: 442 Days
• Field of Search: 324/158 P, 324/158 F, 324/73 PC, 324/72 S, 324/73 AT, 324/158 R, 437/8, 439/482
• US Class Current: 324/756.03
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Abstract

A probing plate for wafer testing is provided with a plurality of probes arranged so as to correspond to a plurality of bonding pads of semiconductor devices fabricated on a semiconductor wafer. The probing plate has a base plate formed of an insulating material, such as a photosensitive glass, and has contact fingers each having a raised portion in the free end thereof, contact conductors respectively formed on the surfaces of the raised portions of the contact fingers so as to be brought into contact with the corresponding bonding pads, and wiring conductors formed in a predetermined pattern on the surface of the base plate so as to extend respectively from the contact conductors. The contact conductors and the wiring conductors are formed simultaneously by a photolithographic process. The contact fingers and the raised portions thereof are also formed by subjecting the base plate to a photolithographic process. Forming the contact conductors over the surfaces of the raised portions of the contact fingers prevents accidental contact of the contact conductors with the bonding pads of semiconductor devices other than the objective semiconductor devices.

Claims

1. A probing plate for wafer testing having a plurality of probes arranged so as to correspond to a plurality of bonding pads of semiconductor devices fabricated on a semiconductor wafer, comprising:

an electrically insulating base plate having raised portions formed at predetermined positions in the major surface thereof;

contact conductors of a conductive film formed over the surfaces of said raised portions and serving as portions of said probes, respectively; and

wiring conductors formed integrally with said contact conductors over the major surface of said base plate in a predetermined pattern so as to extend respectively from said contact conductors,

wherein said raised portions are formed respectively at distal ends of contact fingers formed by removing portions of said base plate selectively by a photolithographic process so as to extend at predetermined intervals and correspond to said plurality of bonding pads.

2. A probing plate for wafer testing according to claim 1, wherein:

the height of the surfaces of the raised portions with respect to the major surface of said base plate is greater than the height of the bonding pads of the semiconductor devices.

3. A probing plate for wafer testing according to claim 1, wherein:

said base plate comprises a photosensitive glass material.

4. A probing plate for wafer testing according to claim 1, wherein:

said base plate includes an elastic plate.

5. A probing plate for wafer testing according to claim 1, wherein:

said wiring conductors include terminal conductors to be connected electrically to contact pins of a wafer prober.

6. A probing plate for wafer testing according to claim 5, wherein:

said wiring conductors include wiring conductors that are formed on the surface of said base plate opposite the major surface and are connected to the wiring conductors formed on the major surface through conductive layers formed over the inner surfaces of through-holes in the base plate, respectively.

7. A probing plate for wafer testing according to claim 1, wherein:

said wiring conductors include contact conductors to be connected electrically through wiring conductors formed on a plate holding said probing plate to correspondingly disposed contact pins of a wafer prober.

8. A probing plate for wafer testing according to claim 1, wherein:

the surface areas of said contact conductors are smaller than the areas of the corresponding bonding pads of the semiconductor devices.