Mark detecting method and apparatus

• US 4,962,423 A
• Filed: 01/25/1989
• Issued: 10/09/1990
• Est. Priority Date: 01/27/1988
• Status: Expired due to Term

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Nogawa, Hideki, Yamada, Yuichi, Suzukawa, Hiroki, Ayata, Naoki
• Primary Examiner(s): Groody, James J.
• Assistant Examiner(s): Kostak, Victor R.
• Application Number:
  US07/301,367
• Time in Patent Office: 622 Days
• Field of Search: 358/101, 358/107, 358/106, 358/93, 382/8, 382/30, 382/32, 356/248
• US Class Current: 382/144
• CPC Class Codes: G03F 9/70 for microlithography measuring printed patterns for monitoring overlay G03F7/70633 or focus G03F7/70641; projection system adjustment G03F7/70258; position control G03F7/70775

Abstract

Mark detecting method and apparatus usable, for example, in a semiconductor exposure apparatus such as a stepper for printing a pattern of a reticle upon a semiconductor wafer, for detecting, by using an image sensor, an alignment mark provided on a reticle or wafer for alignment of the same. Plural search marks are provided two-dimensionally around the alignment mark, each search mark having a first pattern and one or more second patterns indicative of the position of the alignment mark. When at least one first pattern of the search mark is caught by an image pickup device, the reticle is displaced in accordance with the positional information as indicated by the second pattern of the search mark. This brings the alignment mark within the image pickup region of the image sensor. The alignment mark is subsequenlty used to accurately align the reticle with a predetermined position. Thus, the time required for completing the reticle alignment can be reduced remarkably.

Claims

1. A mark detecting method for alignment of an object with respect to a predetermined position, said method comprising the steps of:

providing, on the object, an alignment mark usable for the alignment of the object with respect to said predetermined position and an index mark indicative of the position of the alignment mark on the object;

placing the object on a stage;

forming an image of a portion of the object by use of image pickup means and an associated optical system, and discriminating, by use of an image signal from the image pickup means, whether the index mark is present within an image pickup region of the image pickup means;

detecting the position of the alignment mark as indicated by the index mark, by use of calculating means and the image signal from the image pickup means, when the presence of the index mark within the image pickup region is discriminated;

moving the stage by use of stage driving means, on the basis of information indicative of the position of the alignment mark as detected by the calculating means; and

forming an image of the alignment mark, positioned in a desired portion of the image pickup region as a result of the movement of the stage, by use of the image pickup means and the optical system, for aligning the object with respect to said predetermined position.

2. A method according to claim 1, wherein the optical system has a variable imaging magnification which is set higher for the image pickup of the alignment mark by the image pickup means, than for the image pickup of the index mark by the image pickup means, said forming steps comprising the steps of magnifying the image of the index mark and the alignment mark using the optical system, said alignment mark being magnified to a greater extent than the index mark.

3. A method according to claim 1, wherein said providing step comprises the step of providing a plurality of index marks in association with the alignment mark.

4. A method according to claim 3, wherein said providing step comprises the step of providing the index marks two-dimensionally around the alignment mark.

5. A method according to claim 3, wherein said providing step further comprises the step of providing index marks having first patterns of the same configuration and second patterns different in number and/or position from the first patterns.

6. A method according to claim 5, wherein said forming and discriminating steps further comprise the step of discriminating the presence/absence of the index mark within the image pickup region on the basis of template matching by use of the image signal from the image pickup means.

7. A mark detecting method, comprising the steps of:

providing on an object an alignment mark to be brought into a predetermined positional relationship with a reference mark, and an index mark indicative of the position of the alignment mark;

placing the object on a stage;

forming an image of a portion of the object by use of image pickup means and an associated optical system;

discriminating, by use of an image signal from the image pickup means, whether the index mark is present within an image pickup region of the image pickup means;

detecting the position of the alignment mark as indicated by the index mark, by use of calculating means and the image signal from the image pickup means, when the presence of the index mark within the image pickup region is discriminated;

moving the stage by use of stage driving means, on the basis of information indicative of the position of the alignment mark as detected by the calculating means; and

forming, by use of the image pickup means and the optical system, an image of the reference mark and the alignment mark positioned, by the movement of the stage, in a desired portion of the image pickup region which portion is related to the reference mark, so as to bring the alignment mark into the predetermined positional relationship with the reference mark.

8. A method according to claim 7, wherein the optical system has a variable imaging magnification which is set higher for the image pickup of the alignment mark by the image pickup means, than for the image pickup of the index mark by the image pickup means, said forming steps comprising the steps of magnifying the image of the index mark and the alignment mark using the optical system, said alignment mark being magnified to a greater extent than the index mark.

9. A method according to claim 7, wherein said providing step comprises the step of providing a plurality of index marks in association with the alignment mark.

10. A method according to claim 9, wherein said providing step comprises the step of providing the index marks two-dimensionally around the alignment mark.

11. A method according to claim 9, wherein said providing step further comprises the step of providing index marks having first patterns of the same configuration and second patterns different in number and/or position from the first patterns.

12. A method according to claim 11, wherein said forming and discriminating steps further comprise the step of discriminating the presence/absence of the index mark within the image pickup region on the basis of template matching by use of the image signal from the image pickup means.

13. A mark detecting device, comprising:

a stage for carrying thereon an object having an alignment mark to be brought into a predetermined positional relationship with a reference mark, and an index mark indicative of the position of the alignment mark;

image pickup means for forming, through an optical system, an image of a portion of the object placed on said stage;

detecting means operable to discriminate, after the object is placed on said stage and by use of an image signal from said image pickup means, whether the index mark is present within an image pickup region of said image pickup means and also to detect the position of the alignment mark as indicated by the index mark, by use of the image signal from said image pickup means, when the presence of the index mark within the image pickup region of said image pickup means is discriminated; and

stage driving means operable to move said stage on the basis of information indicative of the position of the alignment mark as detected by said detecting means, to position the alignment mark in a desired portion of the image pickup region which portion is related to the reference mark;

wherein said image pickup means is operable to form, through said optical system, an image of the reference mark and the alignment mark positioned in said desired portion, for bringing the alignment mark into a predetermined positional relationship with the reference mark.

14. A reticle usable for printing a pattern on a semi-conductor wafer, comprising:

a base member;

an alignment mark provided on said base member and being adapted so that an image thereof is formed by image pickup means for alignment of said reticle with a predetermined position;

a search mark provided on said base member and being disposed so that said search mark is located within an image pickup region of said image pickup means when the alignment mark is not located in a predetermined portion of the image pickup region of said image pickup means; and

an information mark provided in a portion of said base member adjacent to said search mark and having positional information related to the position of the alignment mark on said base member, said information mark being disposed so that said information mark is located within the image pickup region of said image pickup means when the search mark is located within the image pickup region of said image pick means.

15. A reticle according to claim 14, further comprising plurality of search marks provided in relation to the alignment mark.