Lift off patterning process on a flexible substrate
First Claim
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1. A method of making a patterned deposit on a flexible substrate comprising the steps of:
- providing a flexible, sheet-like substrate and integral with at least a portion of one major surface of said sheet a first, etchable masking material which stiffens the flexible substrate and defines physical protrusions generally normal to said surface of said substrate; and
depositing over at least a portion of the masked region a second, pattern material chemically different from said first material, said second, pattern material being deposited primarily on said exposed substrate and mask surfaces which are parallel to the plane of said major surface of said substrate,;
controlling said deposition so that said mask material is not completely covered or sealed; and
applying a chemical agent to selectively etch away said first masking material whereby a pattern of said second material remains on said substrate.
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Abstract
A method of providing patterned, thin-film materials on flexible substrates by depositing a first, etchable, integral mask onto a substrate, depositing a second pattern material over the mask region and then removing the mask, such as by etching. Patterned films useful as printed circuits and the like can be prepared by this method. In an alternate embodiment, patterned particles can be prepared for dispersion in a vehicle or matrix using the described process.
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Citations
19 Claims
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1. A method of making a patterned deposit on a flexible substrate comprising the steps of:
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providing a flexible, sheet-like substrate and integral with at least a portion of one major surface of said sheet a first, etchable masking material which stiffens the flexible substrate and defines physical protrusions generally normal to said surface of said substrate; and depositing over at least a portion of the masked region a second, pattern material chemically different from said first material, said second, pattern material being deposited primarily on said exposed substrate and mask surfaces which are parallel to the plane of said major surface of said substrate,; controlling said deposition so that said mask material is not completely covered or sealed; and applying a chemical agent to selectively etch away said first masking material whereby a pattern of said second material remains on said substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of making articles having a shape corresponding to a pre-selected pattern comprising the steps of:
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providing a substrate and covering at least a portion of said substrate with a first, etchable masking material integral with said substrate, and which includes physical protrusions normal to said surface of said substrate, depositing on at least a portion of the masked region a second, pattern material chemically different from said first masking material, said second pattern material being deposited primarily on said first masking material which is parallel to the surfaces of said substrate; and discontinuing said deposition before all of said masking material is completely covered; and applying a chemical agent to selectively etch away said first masking material underneath said pattern material whereby said pieces of said pattern material are released from said substrate. - View Dependent Claims (16, 17, 18, 19)
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Specification