Vibration sensor

• US 4,966,031 A
• Filed: 01/06/1989
• Issued: 10/30/1990
• Est. Priority Date: 01/11/1988
• Status: Expired due to Term

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: Mochizuki, Kazuo
• Primary Examiner(s): Chapman, John
• Application Number:
  US07/294,073
• Time in Patent Office: 662 Days
• Field of Search: 73/35, 73/654, 310/329
• US Class Current: 73/35.11
• CPC Class Codes: G01H 11/08 using piezoelectric devices

Abstract

In a vibration sensor including a base member shaped in the form of a sleeve having a structure for installation on an object of measurement, a piezoelectric conversion portion put onto the periphery of the same, and lead wire member connecting the same with the outside of the sensor, the present invention is characterized in that the piezoelectric conversion portion and a portion of the lead wire member are integrally covered with polyamide resin and it is thereby formed into a case member. The present invention with the above described arrangement makes most of the characteristics of the polyamide resin having a strong crystalline polymer structure, whereby the frequency response characteristic of the vibration sensor is improved against thermal stress.

Claims

1. A nonresonant knocking sensor comprising:

a ceramic piezoelectric element having electrodes and a mass member, whereby forming a seismic system;

a base member shaped in the form of a sleeve with a structure for installation on an object the knocking of which is to be measured;

means for mounting said piezoelectric element and said mass member onto the periphery of said base member;

means for tightening said piezoelectric element and said mass member to said base member;

lead wires connected to said electrodes extending away therefrom; and

polyamide resin casing integrally encasing said piezoelectric element, said mass member, said tightening means and a portion of the lead wires.

2. A vibration sensor according to claim 1, wherein said case member comprises polyamide resin with glass fibers mixed therewith.

3. A vibration sensor according to claim 2, wherein the content of the glass fibers is 30%.