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Method of making an integrated, microminiature electric-to-fluidic valve

  • US 4,966,646 A
  • Filed: 10/26/1988
  • Issued: 10/30/1990
  • Est. Priority Date: 09/24/1986
  • Status: Expired due to Term
First Claim
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1. A method for manufacturing an apparatus comprising the steps of:

  • (1) etching a membrane cavity trench using masking material in a first semiconductor wafer having first and second sides with a depth such that a flexible diaphragm is left which is defined by the bottom of the trench and said second side;

    (2) etching a nozzle trench in a first side of a second semiconductor wafer having first and second sides using masking material;

    (3) making with masking material a sealing surface portion of the second side of said second wafer and etching said second surface back so that when said masking material is removed, said sealing surface projects as a mesa from said second side, said sealing surface being shaped and located so as to have an etched back depression therein located within the perimeter of said nozzle trench as said perimeter is projected onto said second side of said second wafer;

    (4) masking a manifold trench portion of said second side of said second wafer without removing said sealing surface masking material and etching said second side of said second wafer back sufficiently to form a manifold trench in said second side around said sealing surface, said etch also being deep enough to etch said second side of said second wafer so as to form a fluid communication path from said depression to said nozzle trench so as to create a nozzle aperture in said sealing surface;

    (5) removing all masking material from said second side of said second wafer;

    (6) bonding said second side of said second wafer to said second side of said first wafer so that said sealing surface and nozzle aperture are located such if said flexible diaphragm is flexed toward said second wafer far enough, said flexible diaphragm would come to rest on said sealing surface and cut off flow of any material flowing through said nozzle aperture;

    (7) filling said membrane cavity trench with a material which has a changing vapor pressure with changing temperature and hermetically sealing said material in said membrane cavity.

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