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Soldering method

  • US 4,967,950 A
  • Filed: 10/31/1989
  • Issued: 11/06/1990
  • Est. Priority Date: 10/31/1989
  • Status: Expired due to Term
First Claim
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1. A soldering method for direct attachment of electronic chips to a flexible circuitized substrate comprising the steps of:

  • providing a first solid solder on contacts of said chips;

    providing a second solder in which said first solder is miscible on contact pads on said flexible substrate;

    placing said chips at corresponding pads on said flexible circuitized substrate;

    heating where said first and second solders interface for effecting eutectic bonding therebetween.

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