Apparatus for inspecting the molded case of an IC device

• US 4,969,199 A
• Filed: 02/27/1987
• Issued: 11/06/1990
• Est. Priority Date: 02/28/1986
• Status: Expired due to Fees

• Current Assignee: Toshiba Corporation
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Nara, Seietsu
• Primary Examiner(s): Moore, David K.
• Assistant Examiner(s): Mancuso, Joseph
• Application Number:
  US07/019,783
• Time in Patent Office: 1,348 Days
• Field of Search: 382/8, 382/52, 382/22, 358/101, 358/106, 358/107
• US Class Current: 382/146
• CPC Class Codes: G01N 21/95607 using a comparative method
• CPC Class Codes: G06T 2207/30148 Semiconductor; IC; Wafer
• CPC Class Codes: G06T 7/001 using an image reference approach

Abstract

An inspection apparatus includes a device which prepares a circumscribing line of an object to be inspected from pictured image information of the inspected object, and a device which judges the quality of the inspected object from the image information on a portion of the inspected object defined by the circumscribing line prepared by the circumscribing line preparation device. The inspection apparatus may include a device which detects an inclination angle of a nondefective article with respect to a predetermined reference line from pictured image information of the nondefective article, said nondefective article serving as a reference which has the same configuration as the inspected object and registers the inclination angle as a reference angle, and a device for inspecting the quality of the inspected object based on the reference angle in the reference angle detecting and registering device. Moreover, the inspection apparatus may include a device which memorizes pictured image information of the object to be inspected by quantizing it, a device which rotates the quantized image information of the inspected object that is memorized in the quantization and memory device, and a device which memorizes the quantized image information rotated by the image information rotation device after making it multi-valued.

Claims

1. An apparatus for inspecting the molded case portion of an IC device having connecting pins for connecting the IC device to other members, comprising:

imaging means for taking an image of the IC device to be inspected;

means for deriving positional information of the connecting pins from the image;

means for making a circumscribing line enclosing the molded case portion of the image of the IC device in accordance with the positional information of the connecting pins; and

means for judging quality of the molded case portion from the image inside the circumscribing line.

2. The apparatus as claimed in claim 1 wherein the deriving means derives the positional information of the connecting pins as a function of the pin orientation image in which the connecting pins are emphasized by quantizing the image according to a predetermined slice level.

3. The apparatus as claimed in claim 1 wherein the judging means includes means for obtaining projection information regarding projections of the image of the molded case portion.

4. The apparatus as claimed in claim 1 further comprising means for deducing multi-valued image information defined by the circumscribing line.

5. The apparatus as claimed in claim 4 further comprising means for determining an average image density within the circumscribing line of the multi-valued image information.

6. The apparatus as claimed in claim 5 further comprising means for quantizing the multi-valued image information within the circumscribing line on a basis of the averaged image density in order to obtain case image information indicating image of the molded case portion enclosed inside the circumscribing line.

7. The apparatus as claimed in claim 6 wherein the judging means judges the quality of the molded case portion as a function of the case image information.

8. The apparatus as claimed in claim 7 wherein the judging means includes means for obtaining projection information to be utilized in judging the quality of structure of the molded case portion.

9. The apparatus as claimed in claim 1 wherein the making means includes means for deriving pin image information in which the connecting pins are emphasized by quantizing the image taken by the imaging means according to a predetermined slice level.

10. The apparatus as claimed in claim 9 wherein the making means includes means for calculating the size of the connecting pins from the pin image information.

11. The apparatus as claimed in claim 10 wherein the judging means also judges quality of the connecting pins by comparing the calculated size of the connecting pins with a reference size.