Surface package type semiconductor package
First Claim
Patent Images
1. A package comprising:
- (a) at least one semiconductor chip on which at least one electronic device is formed;
(b) at least one resin molded member, respectively covering at least part of the main plane of said at least one semiconductor chip, each resin molded member and its respective semiconductor chip forming a semiconductor package, the semiconductor package being a surface mounting package which has not been mounted on a packaging substrate; and
(c) a moisture-proofing bag member, which prevents intrusion of moisture thereinto, each semiconductor package being air-tightly sealed in the moisture-proofing bag member so as to cut off said semiconductor package from outside, the moisture-proofing bag member being made of a multi-layered film containing at least one metal sheet, whereby moisture is prevented from intruding into the semiconductor package while the semiconductor package is in the moisture-proofing bag member, so that semiconductor package cracking and interface peeling can be avoided when mounting the semiconductor package on the packaging substrate.
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Abstract
In surface packaging of thin resin packages such as resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging. To solve this problem, the devices are packaged moisture-tight at an assembly step of the resin molded devices where the resin is still dry, and are taken out from the bags immediately before the execution of surface packaging.
84 Citations
19 Claims
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1. A package comprising:
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(a) at least one semiconductor chip on which at least one electronic device is formed; (b) at least one resin molded member, respectively covering at least part of the main plane of said at least one semiconductor chip, each resin molded member and its respective semiconductor chip forming a semiconductor package, the semiconductor package being a surface mounting package which has not been mounted on a packaging substrate; and (c) a moisture-proofing bag member, which prevents intrusion of moisture thereinto, each semiconductor package being air-tightly sealed in the moisture-proofing bag member so as to cut off said semiconductor package from outside, the moisture-proofing bag member being made of a multi-layered film containing at least one metal sheet, whereby moisture is prevented from intruding into the semiconductor package while the semiconductor package is in the moisture-proofing bag member, so that semiconductor package cracking and interface peeling can be avoided when mounting the semiconductor package on the packaging substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 12, 13, 14, 15, 16, 17, 18)
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- 8. A package according to claim 77, wherein said barrier layer is a polyester film having a vinylidene chloride film thereon.
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10. A package according to claim 99, wherein said laminate further includes a polyester film between the film layer and carbon conductive layer, for reinforcing mechanical strength and dielectric resistance.
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11. An air-tight package made of a moisture-proofing film, comprising:
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a plurality of semiconductor packages, each semiconductor package being a surface mounted package which has not been mounted on a packaging substrate, each semiconductor package including a resin molded semiconductor device; a plurality of device storing magazines, storing therein said semiconductor packages aligned in a line; a packaging bag, made of a moisture-proofing sheet member that prevents intrusion of moisture when the packaging bag is sealed air-tight, storing said magazines aligned in lines and in close contact with one another, said packaging bag being sealed air-tight such that the plurality of semiconductor packages are air-tightly sealed in the packaging bag, whereby moisture is prevented from intruding into the semiconductor packages while the semiconductor packages are sealed air-tight in said packaging bags, so that semiconductor package cracking and interface peeling can be avoided when mounting the semiconductor packages on packaging substrates; an interior box arranged to contain therein said packaging bag; and a desiccant stored in said packaging bag.
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19. A package comprising:
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(a) at least one semiconductor chip on which at least one electronic device is formed; (b) at least one resin molded member, respectively covering at least part of the main plane of the at least one semiconductor chip; and (c) a moisture-proofing bag member, which prevents intrusion of moisture thereinto, for cutting off said at least one resin molded member from outside, made of a multi-layered film containing at least one metal sheet, the multi-layered film being a laminate of a polyethylene film having an antistatic agent therein, a polyester film, a conductive carbon film, and an acrylic protective layer, in addition to said at least one metal sheet.
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Specification