Surface package type semiconductor package

• US 4,971,196 A
• Filed: 08/10/1989
• Issued: 11/20/1990
• Est. Priority Date: 11/25/1986
• Status: Expired due to Term

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Nishi, Kunihiko, Kitamura, Wahei, Murakami, Gen
• Primary Examiner(s): Fidei, David T.
• Application Number:
  US07/393,120
• Time in Patent Office: 467 Days
• Field of Search: 206/328, 206/329, 206/331, 206/484, 206/524.2, 206/204, 206/811, 428/35.3, 428/35.9, 428/920, 428/922, 361/212, 361/220
• US Class Current: 206/204
• CPC Class Codes: B32B 2307/7246 Water vapor barrier
• CPC Class Codes: B32B 2311/24 Aluminium
• CPC Class Codes: B32B 2323/04 Polyethylene
• CPC Class Codes: B32B 2327/06 PVC, i.e. polyvinylchloride
• CPC Class Codes: B32B 2439/00 Containers; Receptacles closures therefor B32B2435/00
• CPC Class Codes: B32B 27/08 of synthetic resin
• CPC Class Codes: B32B 27/18 characterised by the use of special additives
• CPC Class Codes: B32B 27/304 comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
• CPC Class Codes: B32B 27/32 comprising polyolefins comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30
• CPC Class Codes: B65D 79/02 Arrangements or devices for indicating incorrect storage or transport B65D79/005 takes precedence ; measuring devices G01
• CPC Class Codes: B65D 81/266 for absorbing gases, e.g. oxygen absorbers or desiccants B65D51/244, B65D51/30 take precedence
• CPC Class Codes: H01L 21/67121 Apparatus for making assemblies not otherwise provided for, e.g. package constructions
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 : the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/48599 : Principal constituent of the connecting portion of the wire connector being Gold (Au)
• CPC Class Codes: H01L 2224/48699 : Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
• CPC Class Codes: H01L 2224/49171 : Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 2224/8592 : Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 23/3107 : the device being completely enclosed
• CPC Class Codes: H01L 23/3135 : Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 23/49506 : an insulative substrate being used as a diepad, e.g. ceramic, plastic H01L23/49531 takes precedence
• CPC Class Codes: H01L 23/49582 : Metallic layers on lead frames
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01007 : Nitrogen [N]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01018 : Argon [Ar]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H05K 13/0084 : Containers and magazines for components, e.g. tube-like magazines
• CPC Class Codes: Y10S 174/08 : Shrinkable tubes
• CPC Class Codes: Y10S 428/922 : Static electricity metal bleed-off metallic stock
• CPC Class Codes: Y10T 29/49121 : Beam lead frame or beam lead device

Abstract

In surface packaging of thin resin packages such as resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging. To solve this problem, the devices are packaged moisture-tight at an assembly step of the resin molded devices where the resin is still dry, and are taken out from the bags immediately before the execution of surface packaging.

Claims

1. A package comprising:

(a) at least one semiconductor chip on which at least one electronic device is formed;

(b) at least one resin molded member, respectively covering at least part of the main plane of said at least one semiconductor chip, each resin molded member and its respective semiconductor chip forming a semiconductor package, the semiconductor package being a surface mounting package which has not been mounted on a packaging substrate; and

(c) a moisture-proofing bag member, which prevents intrusion of moisture thereinto, each semiconductor package being air-tightly sealed in the moisture-proofing bag member so as to cut off said semiconductor package from outside, the moisture-proofing bag member being made of a multi-layered film containing at least one metal sheet, whereby moisture is prevented from intruding into the semiconductor package while the semiconductor package is in the moisture-proofing bag member, so that semiconductor package cracking and interface peeling can be avoided when mounting the semiconductor package on the packaging substrate.

2. A package according to claim 1, wherein the moisture-proofing bag member includes a base member of polyester having moisture permeability up to 2.0g/m².24 hr.

3. A package according to claim 1, wherein the moisture-proofing bag member has a surface intrinsic resistance of up to 10⁶ ohms on the outer surface and up to 10¹¹ ohms on the inner surface.

4. A package according to claim 1, wherein the bag member has been heat-sealed, the interior of the bag member being deaerated.

5. A package according to claim 1, wherein the at least one metal sheet has a relatively low moisture permeability so as to prevent intrusion of moisture into the bag member.

6. A package according to claim 1, wherein said bag member is sealed air-tight.

7. A package according to claim 1, wherein the moisture-proofing bag member is a laminate including a film layer that is a barrier layer for preventing intrusion of moisture.

12. A package according to claim 1, wherein the moisture-proofing sheet member is a laminate including a film layer that is a barrier layer for preventing intrusion of moisture.

13. A package according to claim 1, further comprising an interior box, the moisture-proofing bag member being positioned within said interior box.

14. A package according to claim 1, wherein said moisture-proofing bag member air-tightly seals therein a plurality of the semiconductor packages, each semiconductor package including a resin molded member and its respective semiconductor chip.

15. A package according to claim 1, wherein the semiconductor package is a gull wing package, the resin molded member of the gull wing package having a pair of opposed sides, with leads extending from the pair of opposed sides, each of the leads having a first portion extending in a first direction away from the resin molded member, a second portion extending in a thickness direction of the resin molded member, and a third portion extending in a second direction away from the resin molded member.

16. A package according to claim 1, wherein the semiconductor package is a flat plastic package, the resin molded member of the flat plastic package having a pair of adjacent sides, with leads extending from each of the adjacent sides, each of the leads having a first portion extending in a first direction away from the resin molded member, a second portion extending in a thickness direction of the resin molded member, and a third portion extending in a second direction away from the resin molded member.

17. A package according to claim 1, wherein the semiconductor package is a small outline J-bend package, with leads extending from a side of the resin molded member of the small outline J-bend package, each of the leads being in the shape of a "J" and having a first portion extending in a thickness direction of the resin molded member and a second portion, which is a curved portion of the "J" shape, which extends to a position beneath the resin molded member.

18. A package according to claim 1, wherein the semiconductor package is a plastic leaded chip carrier, the resin molded member of the plastic leaded chip carrier having two sides, with leads extending from each of the two sides, each of the leads being in the shape of a "J" and having a first portion extending in a thickness direction of the resin molded member and a second portion, which is a curved portion of the "J" shape, which extends to a position beneath the resin molded member.

8. A package according to claim 77, wherein said barrier layer is a polyester film having a vinylidene chloride film thereon.

9. A package according to claim 8, wherein said laminate includes, in order, a first layer of a polyethylene film having an antistatic agent therein, a polyester film layer having a pinhole proofing function, said film layer that is a barrier layer, a carbon conductive layer and a protective layer.

10. A package according to claim 99, wherein said laminate further includes a polyester film between the film layer and carbon conductive layer, for reinforcing mechanical strength and dielectric resistance.

11. An air-tight package made of a moisture-proofing film, comprising:

a plurality of semiconductor packages, each semiconductor package being a surface mounted package which has not been mounted on a packaging substrate, each semiconductor package including a resin molded semiconductor device;

a plurality of device storing magazines, storing therein said semiconductor packages aligned in a line;

a packaging bag, made of a moisture-proofing sheet member that prevents intrusion of moisture when the packaging bag is sealed air-tight, storing said magazines aligned in lines and in close contact with one another, said packaging bag being sealed air-tight such that the plurality of semiconductor packages are air-tightly sealed in the packaging bag, whereby moisture is prevented from intruding into the semiconductor packages while the semiconductor packages are sealed air-tight in said packaging bags, so that semiconductor package cracking and interface peeling can be avoided when mounting the semiconductor packages on packaging substrates;

an interior box arranged to contain therein said packaging bag; and

a desiccant stored in said packaging bag.

19. A package comprising:

(a) at least one semiconductor chip on which at least one electronic device is formed;

(b) at least one resin molded member, respectively covering at least part of the main plane of the at least one semiconductor chip; and

(c) a moisture-proofing bag member, which prevents intrusion of moisture thereinto, for cutting off said at least one resin molded member from outside, made of a multi-layered film containing at least one metal sheet, the multi-layered film being a laminate of a polyethylene film having an antistatic agent therein, a polyester film, a conductive carbon film, and an acrylic protective layer, in addition to said at least one metal sheet.