Heat sink clip assembly

• US 4,972,294 A
• Filed: 04/03/1989
• Issued: 11/20/1990
• Est. Priority Date: 04/03/1989
• Status: Expired due to Fees

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Moses, John A. Jr., Budano, Joseph A. II
• Primary Examiner(s): Tolin, Gerald P.
• Application Number:
  US07/332,085
• Time in Patent Office: 596 Days
• Field of Search: 357/79, 357/81, 165/185, 165/80.2, 165/80.3, 174/16.3, 361/382, 361/386-388, 361/417, 361/419, 361/420, 361/427, 267/158, 267/160, 267/164, 267/181, 24/295, 24/458, 24/573, 24/625
• US Class Current: 361/704
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat sink assembly for protecting at least one electronic device is provided which comprises a heat sink and a clip. The clip includes first and second opposed end portions and an interconnecting intermediate portion. The first end portion is pivotally anchored. In order to bias at least one device against the heat sink, the intermediate portion includes at least one spring member resiliently engageable with at least one electronic device. The second end portion removably fastens the clip to the heat sink.

Claims

1. A heat sink assembly for at least one electronic device, comprising:

a heat sink;

supporting means supporting said heat sink; and

a clip including first and second opposed end portions and an interconnecting intermediate portion, said first end portion being pivotally anchored to said supporting means;

said intermediate portion including at least one spring member resiliently removably engaged with said at least one electronic device for biasing said at least one device against said heat sink; and

said second end portion removably fastening said clip directly to said heat sink.

2. A heat sink assembly for at least one electronic device, comprising:

a heat sink for operatively supporting said at least one electronic device and including fastening means;

supporting means supporting said heat sink and including anchoring means;

a clip including first and second opposed end portions and an interconnecting intermediate portion, said first end portion being pivotaly anchored to said anchoring means of said supporting means;

said intermediate portion including at least one spring member resiliently removably engaged with said at least one electronic device for biasing said at least one device against said heat sink; and

said second end portion removably fastening said clip directly to said fastening means of said heat sink.

3. The heat sink assembly of claim 2 wherein:

said fastening means of said heat sink comprises a projection; and

said second end portion of said clip includes an opening receiving said projection of said heat sink.

4. The heat sink assembly of claim 2 wherein said supporting means includes an opening for receiving said at least one electronic device.

5. The heat sink assembly of claim 2 wherein said at least one spring member of said clip comprises a resilient finger formed in said intermediate portion.

6. The heat sink assembly of claim 5 wherein said resilient finger includes an engagement surface for biasing said electronic device.

7. The heat sink assembly of claim 6 wherein said engagement surface of said clip is located closed to said first end portion than to said second end portion.

8. The heat sink assembly of claim 2 wherein said supporting means comprises a chassis.

9. The heat sink assembly of claim 4 wherein said chassis is metallic.

10. The heat sink assembly of claim 9 wherein said chassis and said heat sink are integrally formed.

11. The heat sink assembly of claim 9 wherein said chassis and said heat sink are integrally connected.

12. The heat sink assembly of claim 9 wherein:

said anchoring means of said chassis comprises at least one protrusion; and

said first end portion of said clip includes at least one opening for receiving said at least one protrusion of said chassis.

13. The heat sink assembly of claim 2 wherein said supporting means comprises a printed circuit board.

14. The heat sink assembly of claim 13 wherein:

said anchoring means of said printed circuit board comprises at least one protrusion; and

said first end portion of said clip includes at least one opening receiving said at least one protrusion of said printed circuit board.

15. A heat sink assembly for two electronic devices, comprising:

a heat sink;

supporting means supporting said heat sink; and

a clip including first and second opposed end portions and an interconnecting intermediate portion, said first end portion being pivotally anchored to said supporting means;

said intermediate portion including two spring members each being resiliently removably engaged with an associated one of said two electronic devices for biasing the devices against said heat sink; and

said second end portion removably fastening said clip directly to said heat sink.