Chemical vapor deposition reactor and method of use thereof

• US 4,976,996 A
• Filed: 02/17/1987
• Issued: 12/11/1990
• Est. Priority Date: 02/17/1987
• Status: Expired due to Term

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Logan, Mark A., Monkowski, Joseph R.
• Primary Examiner(s): BUEKER, RICHARD R
• Application Number:
  US07/015,359
• Time in Patent Office: 1,393 Days
• Field of Search: 118/719, 118/725, 118/730, 414/217, 427/248.1, 427/255.5, 427/255.7
• US Class Current: 427/255.5
• CPC Class Codes: C23C 16/455 characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
• CPC Class Codes: C23C 16/45504 Laminar flow
• CPC Class Codes: C23C 16/45508 Radial flow
• CPC Class Codes: C23C 16/45591 Fixed means, e.g. wings, baffles
• CPC Class Codes: C23C 16/54 Apparatus specially adapted for continuous coating
• CPC Class Codes: H01L 21/67011 Apparatus for manufacture or treatment processes H01L21/30, H01L21/46; for production or after-treatment of single crystals or homogeneous polycrystalline material C30B35/00

Abstract

A chemical vapor deposition (CVD) recstor is described which comprises an annular reaction zone with means for one or more reactive gases to be passed in single pass radial flow in which there is little lateral diffusion, means for preventing recirculation of reactive gases or reaction products from occurring at any point in the reaction chamber, and means in the reaction chamber for maintaining a laminar gas flow. rotational means permit the wafer support plates and wafers to be rotated around the central axis of the reaction zone and different gases may be passed over the wafers at different points in the reaction zone such that two or more materials can be deposited on the wafers during a single reactor run.

Rotation through alternating deposition zones can also be done repeatedly such that a series of alternating layers of two different deposited materials is built up. This allows for the formation of polymetallic layers by CVD alone or in combination with other deposition processes such as sputtering, plasma or evaporation deposition.

Claims

1. A CVD reactor for depositing at least one layer of material onto wafer substrates, comprising:

a reaction chamber being generally circular about a central axis, said chamber having gas passages into and out of said chamber at the periphery and center thereof;

a horizontal top surface with said chamber extending substantially across said chamber, which can be held at a desired temperature and which in conjunction with a horizontal wafer support plate defines a wafer deposition zone below said top surface;

said horizontal wafer support plate for said wafer substrates disposed within said chamber below and spaced apart from said top surface, which can be held at a desired temperature and which in conjunction with said top surface defines said wafer deposition zone above said wafer support plate;

heating means to heat said wafer substrates positioned on said wafer support plate;

means for supplying said wafer deposition zone at least one reactive gas from which said layer of material is to be deposited on said wafer substrate and for exhausting excess gas and gaseous reaction products from said wafer deposition zone at the periphery and center of said reaction chamber; and

flow control means located at the periphery and center of said reaction chamber between said supplying and exhausting means and said wafer deposition zone, for passing said reactive gas radially through said wafer deposition zone and over said wafer substrates in a laminar flow and for preventing the recirculation of any reactive gas or gaseous reaction product over any wafer substrate or through any part of said reaction chamber which might affect said wafer substrate;

whereby said reactive gas passes over said wafer substrates once for a predetermined residence time.

2. A reactor as in claim 1 wherein said flow control means comprises horizontal straightening vanes positioned between said supplying and exhausting means and said wafer deposition zone.

3. A reactor as in claim 1 wherein the temperature of the top surface and the distance of the top surface plate from the wafer support plate are such that recirculation cells do not form in the reactor.

4. A reactor as in claim 1 wherein said heating means comprises heating coils disposed beneath said wafer support plate.

5. A reactor as in claim 1 wherein said heating means comprises heating coils disposed within said wafer support plate.

6. A reactor as in claim 1 wherein said supplying means is located near said center axis and said exhausting means is located near said periphery.

7. A reactor as in claim 1 wherein said supplying means is located near said periphery and said exhausting means is located near said center axis.

8. A reactor as in claim 1 wherein there are separate zones above said top surface or below said wafer support plate, through which inert gases may be passed.

9. A reactor as in claim 8 wherein said heating means are disposed in said zone below said wafer support plate.

10. A reactor as in claim 9 wherein said heating means comprises heating coils.

11. A reactor as in claim 1 wherein said wafer support plate is rotatably mounted coaxially with said chamber and said reactor also comprises means to rotate said support plate about the central axis of said chamber.

12. A reactor as in claim 11 further comprising gas flow control means to provide separate flows of gases to different radial segments of said wafer deposition zone.

13. A reactor as in claim 12 wherein one or more of said segments of said wafer deposition zone are configured to conduct a non-chemical-vapor-deposition process and one or more of segments are configured to conduct chemical vapor deposition.

14. A reactor as in claim 12 wherein said flow control means prevents said separate flows of gases from any significant mixing with each other while passing through said wafer deposition zone.

15. A reactor as in claim 14 wherein said flow control means provides two separate reactive gases, each at a different radial segment of said wafer deposition zone, and said rotating means rotates said wafer support plate and wafer substrates between said segments such that two separate materials are deposited sequentially on said wafer substrates.

16. A process for the deposition of at least one layer of material on a wafer substrate from a gas which comprises:

a. positioning at least one wafer substrate horizontally within a generally circular wafer deposition zone;

b. passing reactive gas radially through said zone and across the surface of said wafer substrate in a single pass and preventing the recirculation of any reactive gas or gaseous reaction product over any wafer substrate or through any part of said reaction chamber which might affect said wafer substrate;

c. heating said wafer substrate to a point at which the desired deposition material will be formed from said reactive gas by reaction on said surface of said heated wafer substrate and will subsequently bond with said surface; and

d. causing said deposition of material on said surface to be substantially uniform by maintaining said radial flow of gas at a flow rate to produce a predetermined residence time of gas over each such wafer substrate sufficiently short to prevent significant lateral diffusion or depletion of said gas across said wafer substrate.

17. A process as in claim 16 wherein said wafer deposition zone is periodically cleaned by plasma surface reaction techniques.

18. A process as in claim 16 wherein said reactive gas and gaseous reaction products are maintained in laminar flow radially across said zone.

19. A process as in claim 18 wherein said radial flow of said reactive gas in radially inwardly through said wafer deposition zone from the periphery thereof and excess gas and gaseous reaction products exhaust from said wafer deposition zone at the center thereof.

20. A process as in claim 18 wherein said radial flow of said reactive gas in radially outwardly through said wafer deposition zone from the center thereof and excess gas and gaseous reaction products exhaust from said wafer deposition zone at the periphery thereof.

21. A process as in claim 18 wherein a period of time is provided between movement of said wafer substrates from one segment to the next.

22. A process as in claim 21 wherein during said period of time diffusion, annealing or layer buildup occurs.

23. A process as in claim 20 wherein a plurality of reactive gases are passed to said reaction zone, with each gas being passed to a different radial segment of said zone and the gases not mixing within said zone, and said wafer substrates are moved sequentially from one segment to the next segment such that different materials are deposited on said wafer substrate in each said segment.

24. A process as in claim 23 wherein the different materials deposited are the metallic elements of a polymetallic layer.

25. A process as in claim 23 wherein a non-chemical-vapor-deposition process is conducted in at least one of said segments.

26. A process as in claim 25 wherein said non-chemical-vapor-deposition process is sputter deposition, evaporation deposition or plasma deposition.

27. A CVD reactor for depositing at least one layer of material onto semiconductor wafer substrates, comprising:

a horizontal plate for supporting said wafer substrates for deposition, said plate having a vertical axis and being symmetric about said vertical axis;

a top surface above and spaced apart from said supporting plate, said top surface extending parallel to and substantially coextensive with said supporting plate, said top surface and supporting plate defining an annular wafer deposition chamber therebetween about said vertical axis with inner and outer peripheries;

inlet and outlet means at said inner and outer peripheries for introducing reactive gas into and removing gas from said deposition chamber for radial gas flow with respect to said vertical axis;

means for heating said wafer substrates on said wafer supporting plate; and

means at the said inner and outer peripheries of said reaction chamber for controlling the flow of said reactive gas such that said gas flow through said deposition chamber is laminar and recirculation of reactive gas or gaseous reaction product over wafer substrates in said deposition chamber is prevented;

whereby said gas flows over said wafer substrates a single time for a predetermined residence time.

28. The CVD reactor as in claim 27 wherein said gas controlling means comprise a plurality of horizontal

29. The CVD reactor as in claim 28 wherein said vanes comprise first and second sets, each vane in said sets being annular and arranged vertically displaced from one another in a stack about said central axis, said first set at said outer periphery and said second set at said inner periphery.

30. The CVD reactor as ian claim 29 wherein said gas inlet means is located at said outer periphery and said outlet means is located at said inner periphery of said reaction chamber.

31. The CVD reactor as in claim 29 wherein said wafer supporting plate is rotatable about said central axis.

32. A CVD reactor for depositing at least one layer of material onto semiconductor wafer substrates comprising

means for supplying gas for the deposition of material onto said wafer substrates;

means displaced from said gas supplying means for exhausting gas from said gas supplying means;

a wafer support plate having a wafer deposition region for holding said wafer substrates between said gas supplying means and said gas exhausting means;

means for heating said wafer support plate during operation;

a top plate parallel to and displaced above said wafer support plate; and

first and second means for controlling the flow of said reactive gas through said wafer deposition zone and over said wafer substrates in a laminar flow and for preventing the recirculation of said gas or gaseous reaction product over a wafer substrate, said first flow controlling means located between said gas supplying means and said wafer deposition region, said second flow controlling means located between said wafer deposition region and said gas exhausting means;

whereby said gas passes over said wafer substrates once for a predetermined residence time.

33. The reactor as in claim 32 wherein said top plate is displaced above said wafer support plate by no more than 0.8 inches.

34. The reactor as in claim 32 wherein said top plate is displaced above said wafer support plate by a distance in the range of 0.2 to 0.8 inches.

35. The reactor as in claim 32 wherein said gas supplying means and said gas exhausting means are selected to flow gas through said wafer deposition region at a rate in the approximate range of 0.1 to 10 meters per second.

36. The reactor as in claim 35 wherein said gas supplying means and said gas exhausting means are selected to flow gas through said wafer deposition region at the approximate rate of 1 meter per second.

37. The reactor as in claim 32 wherein said first and second flow control means comprise gas flow stabilizer vanes.

38. The reactor as in claim 37 wherein said gas flow stabilizer vanes are arranged in sets, the vanes in a set arranged in parallel to each other and to said wafer support plate.

39. The reactor as in claim 38 wherein at least some of said vanes have differing dimensions in the direction of gas flow between said gas supplying means and said gas exhausting means.

40. The reactor as in claim 32 wherein said heating means comprises heating coils beneath said wafer support plate.

41. The reactor as in claim 40 wherein said heating coils comprises a plurality of sets, at least one set beneath said wafer deposition region, each set separately controllable from the other for the uniform heating of wafer substrates in said wafer deposition region.

42. The reactor as in claim 41 wherein said wafer support plate extends beneath said first and second flow controlling means and a first set of heating coils is beneath said first flow controlling means, a second set is beneath said wafer deposition region, and a third set beneath said second flow controlling means.

43. The reactor as in claim 32 wherein said gas supplying means, gas exhausting means, wafer support plate, heating means, top plate, first and second flow control means are circularly symmetric about a central axis.

44. The reactor as in claim 43 wherein said gas exhausting means is located nearer to said central axis than said gas supplying means.

45. The reactor as in claim 44 wherein said wafer support plate is rotatable about said central axis.

46. The reactor as in claim 45 wherein said gas supplying means further comprises means for supplying different gases to different radially bounded sectors of said wafer deposition region.