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Composite polymer/desiccant coatings for IC encapsulation

  • US 4,977,009 A
  • Filed: 03/06/1990
  • Issued: 12/11/1990
  • Est. Priority Date: 12/16/1987
  • Status: Expired due to Fees
First Claim
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1. A composite coating for maintaining low moisture levels at the surface of solid substrates, which composite coating comprises:

  • a substantially continuous first layer comprising first elastomeric polymer on said substrate, said first elastomeric polymer being substantially non-reactive with said substrate and being present in a thickness of at least about 0.1 millimeter;

    a substantially continuous second layer, on said first layer, comprising a mixture of desiccant and second elastomeric polymer having low permeability to water.

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