Composite polymer/desiccant coatings for IC encapsulation
First Claim
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1. A composite coating for maintaining low moisture levels at the surface of solid substrates, which composite coating comprises:
- a substantially continuous first layer comprising first elastomeric polymer on said substrate, said first elastomeric polymer being substantially non-reactive with said substrate and being present in a thickness of at least about 0.1 millimeter;
a substantially continuous second layer, on said first layer, comprising a mixture of desiccant and second elastomeric polymer having low permeability to water.
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Abstract
This invention is directed to composite coating for maintaining low moisture levels at the surface of solid substrates. One embodiment of the invention comprises a coating having a desiccant layer between layers of the same or different elastomeric polymers. Another embodiment comprises a layer of elastomeric polymer covered with a layer of an elastomeric polymer/desiccant mixture. The composite coating may be applied to integrated circuits to prevent corrosion thereof.
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9 Claims
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1. A composite coating for maintaining low moisture levels at the surface of solid substrates, which composite coating comprises:
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a substantially continuous first layer comprising first elastomeric polymer on said substrate, said first elastomeric polymer being substantially non-reactive with said substrate and being present in a thickness of at least about 0.1 millimeter; a substantially continuous second layer, on said first layer, comprising a mixture of desiccant and second elastomeric polymer having low permeability to water. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification