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Low friction insertion structure and method of making

  • US 4,979,073 A
  • Filed: 04/29/1988
  • Issued: 12/18/1990
  • Est. Priority Date: 04/29/1988
  • Status: Expired due to Term
First Claim
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1. A heat dissipating container for retention of sheets of material of the nature of electronic circuit boards comprising oppositely disposed cold walls of substantially homogeneous heat conducting material throughout the mass of said cold walls, each cold wall comprising a heat conducting panel having an outside face and an inside face, a plurality of spaced parallel slots on the inside face of each panel for reception of opposite edge portions of said boards, each of said slots having a substantially rectangular shape with opposite side walls, a bottom wall and an open side opposite said bottom wall, one of said side walls having a semicylindrical pocket extending throughout the length of a corresponding slot, the panel of said corresponding slot having a substantially T-shaped groove adjacent the bottom wall of said corresponding slot with a shaft portion of the T-shaped groove in communication with said corresponding slot, a crossbar portion of the T-shaped groove being located in the material of said panel between said bottom wall of said corresponding slot and said outside face of the panel, a substantially T-shaped spring member having a crossbar portion lodged in the crossbar portion of the groove and part of a shaft portion of the spring member being lodged in the shaft portion of the T-shaped groove and extending inwardly into the slot, there being a rod member rotatably mounted in each slot, said rod member having a retention position in the pocket and extending against the spring member for retention of the board, said rod member having a rotationally removed release position for said board, there being a plurality of laterally spaced heat dissipating fins extending throughout the area of the outside face of each of said cold walls.

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