Method for recirculating high-temperature etching solution

• US 4,980,017 A
• Filed: 09/26/1989
• Issued: 12/25/1990
• Est. Priority Date: 10/01/1988
• Status: Expired due to Term

• Current Assignee: M.FSI Ltd.
• Original Assignee: Nisso Engineering Co., Ltd. (Nippon Soda Company Limited)
• Inventors: Kaji, Toshimitsu, Takeuchi, Tadao, Hisatome, Yasuya, Miyakoshi, Eiichi, Kawashima, Tsutomu, Nishikata, Yasukatsu
• Primary Examiner(s): Cohan, Alan
• Application Number:
  US07/412,444
• Time in Patent Office: 455 Days
• Field of Search: 137/563, 137/2, 137/88, 137/3, 134/108, 134/2, 134/99, 437/225, 437/228, 156/662, 156/642
• US Class Current: 216/93
• CPC Class Codes: H01L 21/67075 for wet etching
• CPC Class Codes: H01L 21/67086 with the semiconductor substrates being dipped in baths or vessels
• CPC Class Codes: Y10T 137/0329 Mixing of plural fluids of diverse characteristics or conditions
• CPC Class Codes: Y10T 137/2499 Mixture condition maintaining or sensing

Abstract

A method for recirculating a high-temperature etching solution according to the present invention comprises the steps of continuously removing, from a bath for etching a wafer for a semiconductor device, a portion of an etching solution contained in the etching bath, injecting a predetermined amount of pure water for adjusting the concentration of the etching solution into the removed etching solution, heating the resulting solution to a predetermined temperature, and recirculating the heated solution into the etching bath.

Claims

1. A method for recirculating a high-temperature etching solution, comprising the steps of:

continuously removing, from an etching bath in which a wafer for a semiconductor device is etched, a portion of an etching solution contained in the etching bath;

detecting a temperature of said bath;

injecting a predetermined amount of pure water for adjusting the concentration of the etching solution into the removed etching solution in response to said detected temperature, said predetermined amount being selected as a function of a difference between the detected etching bath temperature and a preset boiling temperature, wherein the amount of water injected corresponds to said temperature difference;

heating the resulting solution to a predetermined temperature and

recirculating the heated solution into the etching bath.

2. A method for recirculating a high temperature etching solution according to claim 1, wherein said etching solution is a solution such as an aqueous solution of phosphoric acid where the etching is conducted at near its boiling point.

3. A method for recirculating a high-temperature etching solution according to claim 1, wherein said etching bath comprises an overflow weir mounted at an upper portion, and a distributing plate mounted at a bottom within the etching bath, so that the etching solution contained in said etching bath is caused to overflow through said overflow weir and removed, and the etching solution removed and adjusted in concentration is recirculated into said etching bath through said dIstributing plate.

4. A method for recirculating a high-temperature etching solution according to claim 1, wherein the pure water for adjusting the concentration of said etching solution is injected into the etching solution removed from the etching bath by use of a water injecting device including a flowmeter having an automatic valve.