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Package for very large scale integrated circuit

  • US 4,982,311 A
  • Filed: 09/29/1988
  • Issued: 01/01/1991
  • Est. Priority Date: 09/29/1987
  • Status: Expired due to Fees
First Claim
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1. A package (10) with a semiconductor chip (12), comprising signal terminals (14) and supply terminals (15a, 15b) for outer connection of the package, a thermally conductive tagboard (20) supporting the chip, a multilayered interconnect structure (16) carried by the tagboard and at least partially surrounding the chip, said interconnect structure including:

  • a decoupling device (17) comprising capacitor means (19) and superimposed conductor planes (18a, 18b) connected to said supply terminals;

    outer islets (32a, 32b, 32s) disposed in proximity with the chip and comprising supply islets (32a, 32b) connected to the corresponding conductor planes (18a, 18b) and signal islets (32s) being the ends of radiating conductors of a conductive layer (34b) formed on a face of the interconnect structure and connected to the respective signal terminals (14).

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