Method of assembling stacks of integrated circuit dies
First Claim
1. A method for assembling a stack of integrated circuit dies, comprising:
- making holes through a wafer having a plurality of integrated circuit dies in which the dies include pads thereon connected to integrated circuits in the dies, said holes being placed between the dies and adjacent the pads;
placing a layer of insulating material over the wafer and in the outer periphery of the holes;
adding an electrically conductive connection between the top of each pad and the inside of the insulating material in an adjacent hole;
separating the plurality of dies from each other along lines extending through the holes between the dies; and
connecting a plurality of dies by an electrical interconnection between the electrically conductive connections on the inside of the cut holes of the dies.
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Accused Products
Abstract
Integrated circuit dies, while still in wafer form, are prepared for stacking without requiring packaging. Holes are made through a wafer having a plurality of integrated circuit dies and are placed between the dies and adjacent the die pads. A layer of insulating material is placed on the wafer and in the outer periphery of the holes. An electrically conductive connection is made between the top of each pad and the inside of the insulating material in an adjacent hole. The insulating layer and the electrically conductive layer can be further extended to the backside of the dies if desired. The dies are separated from each other and can be assembled in a stack and/or surface mounted to a substrate.
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Citations
20 Claims
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1. A method for assembling a stack of integrated circuit dies, comprising:
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making holes through a wafer having a plurality of integrated circuit dies in which the dies include pads thereon connected to integrated circuits in the dies, said holes being placed between the dies and adjacent the pads; placing a layer of insulating material over the wafer and in the outer periphery of the holes; adding an electrically conductive connection between the top of each pad and the inside of the insulating material in an adjacent hole; separating the plurality of dies from each other along lines extending through the holes between the dies; and connecting a plurality of dies by an electrical interconnection between the electrically conductive connections on the inside of the cut holes of the dies. - View Dependent Claims (2, 3, 4, 5)
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6. A method of assembling a stack of integrated circuit dies, comprising:
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making holes through a wafer having a plurality of integrated circuit dies in which the dies include pads thereon connected to integrated circuits in the dies, said holes being placed between the dies and adjacent the pads; placing a layer of insulating material over the wafer and in the outer periphery of the holes; removing the insulating material from the top of the pads; adding an electrically conductive connection between the top of each pad and the inside of the insulating material in said adjacent hole; separating the plurality of dies from each other along lines passing through holes between the dies; and connecting a plurality of dies by an electrical interconnection between the electrically conductive connections on the inside of the cut holes of the dies.
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7. A method for assembling a stack of integrated circuit dies, comprising:
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making holes through a wafer having a plurality of integrated circuit dies in which the dies include pads thereon connected to integrated circuits in the dies, said holes being placed between the dies and adjacent the pads; placing a layer of insulating material over the wafer, in the outer periphery of the holes, and beneath the wafer along its backside; adding an electrically conductive connection between the top of each pad, the inside of the insulating material in an adjacent hole, and the bottom of the insulating layer beneath the wafer so that the pads are electrically interconnected to conductors beneath the wafer; and separating the plurality of dies from each other along lines extending through the holes between the dies. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A method of assembling a stack of integrated circuit dies, comprising:
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making holes through a wafer having a plurality of integrated circuit dies in which the dies include pads thereon connected to integrated circuits in the dies, said holes being placed between the dies and adjacent the pads; placing a layer of insulating material over the wafer, in the outer periphery of the holes, and beneath the wafer; removing the insulating material from the top of the pads; adding an electrically conductive connection between the top of each pad, the inside of the insulating material in an adjacent hole, and the bottom of the insulating layer beneath the wafer so that the pads are electrically interconnected to conductors beneath the wafer; and separating the plurality of dies from each other along lines passing through holes between the dies. - View Dependent Claims (20)
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Specification