Method and apparatus for testing integrated circuits

• US 4,987,365 A
• Filed: 04/28/1989
• Issued: 01/22/1991
• Est. Priority Date: 04/28/1989
• Status: Expired due to Term

• Current Assignee: Avago Technologies ECBU IP Singapore Pte Limited (Broadcom, Inc.)
• Original Assignee: Hewlett-Packard Company (HP Inc.)
• Inventors: Atwood, B. Dale, Shreeve, Robert W.
• Primary Examiner(s): Eisenzopf, Reinhard J.
• Assistant Examiner(s): URBAN, EDWARD F
• Application Number:
  US07/344,885
• Time in Patent Office: 634 Days
• Field of Search: 324/158 F, 324/150 P, 174/52.4, 174/68.5, 437/8, 29/825, 29/829, 29/876
• US Class Current: 324/750.18
• CPC Class Codes: G01R 1/0735 arranged on a flexible frame or film

Abstract

A method and apparatus for testing an integrated circuit of the type which is mounted on a flexible strip and which includes a die in electrical communication with a plurality of test pads formed on the strip. In the method, a selected strip segment having an integrated circuit die mounted thereon is positioned against a substantially flat strip support member. A portion of the strip is compressed against the strip support member and thereafter a test probe is urged against each of selected test pads. The integrated circuit is tested and thereafter the probes are lifted from the pads, pressure is removed from the strip and the next integrated circuit is similarly tested.

Claims

1. A method of testing integrated circuits of the type which are sequentially mounted on a flexible strip and which include a die in electrical communication with a plurality of test pads formed on the strip, said method comprising the steps of:

positioning a selected strip segment having an integrated circuit die mounted thereon against a substantially flat strip support member;

advancing the strip laterally relative to said strip support member until a selected integrated circuit is in position for testing;

compressing a portion of the strip against the strip support member with a planar plate having an opening therein;

permitting plate angulation relative to said strip support member;

continuing such strip compression until lateral movement of said strip stops;

inserting test probes into the plate opening after stopping strip movement responsive to plate compression;

urging test probes so inserted against each of selected test pads;

testing the integrated circuit; and

lifting the test probes from the pads.

2. The method of claim 1 wherein said method further comprises the step of removing pressure from the strip.

3. The method of claim 1 wherein said plate includes a die opening therein of a size sufficient to receive the die and wherein the step of compressing a portion of the strip against the strip support member comprises the step of moving the plate toward the strip with the die received in said die opening and urging the plate against the strip.

4. The method of claim 3 wherein the step of compressing a portion of the strip the strip support member comprises the step of biasing the plate surface against the strip.

5. A method of making a tester for an integrated circuit of the type which is mounted on a flexible strip and which includes a die in electrical communication with a plurality of test pads formed on the strip, said method comprising the steps of:

creating at least one test pad opening in a plate which exposes selected test pads on the flexible strip when said plate is urged against the strip, said opening being of a size to receive test probes therethrough without touching said plate;

creating a die opening in the plate which receives the die therein when said plate is urged against the flexible strip;

mounting the plate on a probe test card;

enabling plate angulation relative to said probe test card;

enabling plate movement between a first position in which said plate extends entirely beyond a plurality of probes on said probe test card and a second position in which the probes extend through said test pad opening; and

biasing the plate towards said first position.

6. A method of testing integrated circuits of the type which are sequentially mounted on a flexible strip and which includes a die in electrical communication with a plurality of test pads formed on the strip, said method comprising the steps of:

providing a probe test card of the type having a plurality of probes extending downwardly from the underside thereof;

mounting a planar plate having an opening therein on the underside of said probe test card;

permitting plate angulation relative to said probe test card;

laterally advancing a selected strip segment having an integrated circuit die mounted thereon over a substantially flat strip support member;

lowering the probe test card or raising the strip support member until said plate compresses a portion of the strip against the strip support member;

further lowering the probe test card or raising the strip support member until lateral movement of said strip stops;

still further lowering the probe test card or raising the strip support member until said test probes are inserted into said opening;

urging test probes so inserted against selected test pads;

testing the integrated circuit;

raising the probe test card or lowering the strip support member until the probes are above said plate; and

further raising the probe test card or lowering the strip support member until the compression member no longer compresses the strip.

7. The method of claim 6 wherein the step of mounting a planar plate having an opening therein on the underside of said probe test card comprises the steps of:

mounting a plate on the lower side of the probe test card substantially parallel thereto;

enabling plate movement between a lower position in which the tips of probes extending from the underside of the probe test card are above the upper surface of the plate and an upper position in which the probe tips extend beneath the lower surface of the plate; and

biasing the plate to the lower position.

8. The method of claim 7 wherein said method further comprises the step of exposing the probes for repair or adjustment by clamping the planar plate in said upper position.

9. The method of claim 6 wherein the step of still further lowering the probe test card or raising the strip support member until said test probes are inserted into said openings comprises the step of lowering said plate until said die is received in an opening formed therein.

10. The method of claim 6 wherein said method further comprises the step of registering said strip with said probe test card.

11. The method of claim 10 wherein said strip includes a pair of alignment marks, said probe test card includes a corresponding pair of alignment marks, said plate includes a pair of corresponding openings and wherein the step of registering said strip with said probe test card comprises the steps of:

sighting said strip alignment marks through said compression member openings; and

aligning the strip alignment marks with the board alignment marks.

12. Apparatus for testing an integrated circuit of the type which is mounted on a flexible strip and which includes a die in electrical communication with a plurality of test pads formed on the strip, said apparatus comprising:

a substantially flat strip support member against which a selected strip segment having an integrated circuit formed thereon is positionable;

a probe test card having a plurality of test probes extending therefrom, said card and said support member being movable relative to one another between a first position in which said card is spaced away from said strip support member and a second position in which the tips of said probes are in electrical contact with said test pads when a strip segment is so positioned;

a planar plate mounted on said probe card adjacent said probes, said plate being movable between a first position in which said plate extends beyond the tips of said probes and a second position in which said plate compresses a portion of the strip against said strip support member when said probe card is in said second position;

means for permitting plate angulation relative to said strip support member when said plate is in its second position; and

an opening in said plate through which said probe tips pass as said plate moves from its first position to its second position, said opening being of a size sufficient to prevent probe contact with said plate for all operating conditions of said apparatus.

13. The apparatus of claim 12 wherein said plate further includes means for compressing a portion of said strip against said strip support member as said probe card and said strip support member move relative to one another from said first probe card position to said second probe card position and prior to the tips of said probes entering said openings.

14. The apparatus of claim 12 wherein said apparatus further includes means for biasing said plate to said first plate position.

15. The apparatus of claim 12 wherein said plate includes a die opening therein of a size sufficient to receive said die when said plate so compresses a portion of said strip.

16. The apparatus of claim 12 wherein apparatus further includes:

a pair of alignment marks formed on said strip;

a pair of corresponding alignment marks formed on said probe test card; and

a pair of openings formed in said compression member for permitting sighting of said strip alignment marks therethrough and thereafter alignment of said strip marks with said test card marks.

17. A test probe guard for use with an integrated circuit tester of the type having a test probe card which is movable between a first position spaced away from a flexible strip having a die and a plurality of test pads mounted thereon and a second position in which the tips of test probes on the card are in electrical contact with the test pads, said guard in operative condition comprising:

a substantially planar plate mounted on said test probe card adjacent said test probes for compressing said flexible strip as said card moves from said first position to said second position;

means for enabling plate travel toward and away from said test probe card;

means for enabling plate angulation relative to said probe test card;

means for limiting maximum plate travel away from said test probe card to a first plate position in which said plate extends beyond the tips of said test probes;

means for limiting maximum plate travel toward said test probe card to a second plate position in which the tips of test probes on said card extend beyond said plate;

means for biasing said plate toward said first plate position; and

an opening in said plate through which said probe tips pass as said plate moves from its first position to its second position, said opening being of a size sufficient to prevent probe contact which said plate for all operating conditions of said test probe guard.

18. The guard of claim 17 wherein said biasing means is constructed and arranged to bias said plate against said flexible strip as said test probe card moves from its first position to its second position and prior to said probes entering said plate opening.

19. The guard of claim 17 wherein said plate further includes an opening in which said die is received when said plate is biased against said flexible strip and said probes are in electrical contact with said test pads.

20. The guard of claim 17 wherein the surface of said plate which compresses said flexible strip is formed from nonconductive material.

21. A method of testing an integrated circuit of the type which is mounted on a flexible strip and which includes a die in electrical communication with a plurality of test pads formed on the strip, said method comprising the steps of:

providing a probe test card of the type having a plurality of probes extending downwardly from the underside thereof;

mounting a plate on the lower side of the probe test card substantially parallel thereto;

enabling plate movement between a lower position in which the probes extending from the underside of the probe test card are above the lower surface of the plate and an upper position in which the probes extend beneath the lower surface of the plate;

biasing the plate to the lower position;

positioning a selected strip segment having an integrated circuit die mounted thereon over a substantially flat strip support member;

lowering the probe test card or raising the strip support member until the flat surface of said compression member compresses a portion of the strip against the strip support member;

further lowering the probe test card of raising the strip support member until the probes are in electrical contact with selected test pads;

testing the integrated circuit;

raising the probe test card or lowering the strip support member until the probes are no longer in contact with the test pads;

further raising the probe test card or lowering the strip support member until the compression member no longer compresses the strip; and

exposing the probes for repair or adjustment by clamping the plate in said upper position.