Modular heat sink structure

• US 4,989,070 A
• Filed: 11/10/1988
• Issued: 01/29/1991
• Est. Priority Date: 11/10/1988
• Status: Expired due to Fees

• Current Assignee: Corioliss Ltd.
• Original Assignee: Corioliss Ltd.
• Inventors: Whitaker, Stephan, Iversen, Arthur H.
• Primary Examiner(s): James, Andrew J.
• Assistant Examiner(s): Nguyen, Viet Q.
• Application Number:
  US07/269,882
• Time in Patent Office: 810 Days
• Field of Search: 357/82
• US Class Current: 257/712
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]

Abstract

There is disclosed a novel high heat flux liquid cooled semi-conductor heat sink of modular construction suitable for semi-conductor chips such as IC'"'"'s, hybrids, lasers, and power semi-conductors, said modular heat sink containing inserts with chip substrates made of metals, such as tungsten or molybdenum, said substrate including at least one surface suitable for bonding one or more semi-conductor chips in intimate thermal relationship thereto, and including a heat exchange surface on the interior surface thereof, said module providing means for enclosing said heat exchange surface in a liquid tight manner and including means for providing a flow of coolant liquid to remove heat from said heat exchange surface by formation of nucleate vapor bubbles on said heat exchange surface, the improvement wherein said heat sink module comprises individual heat sink inserts upon which semi-conductor chips are intimately bonded, said heat sink element being provided with means to electrically isolate each heat sink element from all other heat sink elements mounted on said heat sink module, said heat sink elements having their corresponding liquid cooled surface directly opposing said semi-conductor chip, the heat transfer characteristics of said liquid cooled surface being unobstructed by said electrically isolating means.

Claims

1. A heat transfer apparatus comprising a heat exchange surface and an opposing heated surface which is exposed to a heat flux, said heat exchange surface being exposed to a flow of nucleate boiling liquid, said heat exchange surface having nucleate boiling cavity sites disposed thereon, said nucleate boiling cavity sites including means for creating curved streamlines over said nucleate boiling cavity sites, said curved streamlines creating a zone of reduced pressure at said cavities thereby lowering the initiating superheat required to induce nucleate boiling at said nucleate boiling cavity sites.

2. The apparatus of claim 1 wherein said means for creating streamlines comprises a plurality of protrusions, each of said protrusions substantially encompassing one of said cavities, said protrusions extending from said heat exchange surface and forming a concave surface therewith.

3. The apparatus of claim 2 wherein said protrusions range from approximately .001 mm to 0.5 mm in height.

4. The apparatus of claim 1 wherein said heat exchange surface further comprises a plurality of protrusions substantially encompassing said nucleate boiling site cavities, said protrusions ranging from 0.001 mm to 0.5 mm in height.

5. The apparatus of claim 1 wherein said heat exchange surface further comprises undulations in the direction of coolant flow, said undulations having a peak-to-peak height ranging from .001 mm to 0.5 mm and a period ranging from 0.005 mm to 5 mm.

9. The apparatus of claim 5, wherein said undulations comprise a continuous series of alternating concave and convex curved surfaces spaced apart along the direction of said coolant flow and extending in a direction transverse to said direction of said coolant flow.

6. A heat exchange system comprising:

a heat exchange liquid;

a substrate having a heat exchange surface disposed for thermal communication with said heat exchange liquid and an opposing heated surface which is exposed to a heat flux; and

means for generating a flow of said liquid over said heat exchange surface at a predetermined velocity;

said heat exchange surface comprising boiling means for inducing nucleate boiling of said liquid proximate said heat exchange surface, said boiling means comprising;

a plurality of nucleate boiling cavity sites disposed on said heat exchange surface;

means for inducing curved streamlines within said liquid proximate said cavity sites to thereby induce nucleate boiling of said liquid at a predetermined temperature.

7. The system of claim 6 wherein said liquid is a dielectric liquid.

8. The system of claim 6 wherein said liquid is a fluorocarbon liquid.

10. The system of claim 6, wherein said boiling means further comprises a concave curved surface disposed about at least one of said cavity sites such that, when said liquid flows over said cavity sites, a zone of reduced pressure is created over said at least one of said cavity sites.

11. The system of claim 6, wherein said boiling means further comprises means for creating a Bernoulli effect proximate at least one of said cavity sites to thereby reduce the pressure over said at least one cavity site.

12. The system of claim 6, wherein said heat exchange surface further comprises a series of alternating curved peaks and valleys spaced apart along the direction of said liquid velocity and extending along a direction transverse to said direction of said liquid velocity.