Hermetically sealed ceramic and metal package for electronic devices implantable in living bodies

• US 4,991,582 A
• Filed: 09/22/1989
• Issued: 02/12/1991
• Est. Priority Date: 09/22/1989
• Status: Expired due to Term

• Current Assignee: Alfred E. Mann Foundation For Scientific Research
• Original Assignee: Alfred E. Mann Foundation For Scientific Research
• Inventors: Schulman, Joseph H., Rostami, Ali, Byers, Charles L., Beazell, James W.
• Primary Examiner(s): Cohen, Lee S.
• Assistant Examiner(s): GETZOW, SCOTT M
• Application Number:
  US07/411,403
• Time in Patent Office: 508 Days
• Field of Search: 128/419 R, 128/419 P, 128/903, 128/631, 128/418 F, 29/825, 29/830
• US Class Current: 607/2
• CPC Class Codes: A61N 1/375 Constructional arrangements, e.g. casings

Abstract

A hermetically sealed combination ceramic and metal package for electronic components of an electronic device implantable in a living body, at least some of the components being adversely affected by high temperatures. The package comprises a ceramic sleeve and a metal band having substantially the same coefficients of linear thermal expansion. An annular end face of the sleeve butts against and hermetically seals to an annular end of the metal band. A header plate carrying a substrate upon which the components are mounted and a plurality of electrical connectors closes the open end of the sleeve and is hermetically sealed to the metal band.

Claims

1. A hermetically sealed combination ceramic and metal package for electronic devices implantable in living bodies, comprising:

a sleeve having a closed end and an open end for receiving electronic components of a device implantable in a living body, at least some of the components being adversely sensitive to high temperatures, the sleeve being formed of a ceramic material and the open end having a flat annular end face;

a closed band having an annular edge butting against and hermetically bonded to the open-end face of the sleeve, the band being formed of a metal having a coefficient of linear thermal expansion substantially the same as that of the ceramic material forming the sleeve; and

header means closing the package, hermetically bonded to the band and carrying a plurality of electrical connectors for connecting electrical leads to the electrical components within the sleeve.

2. The package of claim 1 wherein the annular end face of the sleeve and the annular edge of the band are flat to butt against each other.

3. The package of claim 1 wherein the annular end of the sleeve and the annular edge of the band are stepped to define a self-jigging junction between the sleeve and the band.

4. The package of claim 1 further including a cable connector releasably secured to the header means and comprising a plurality of sockets receiving the electrical connectors.

5. The package of claim 4 wherein the cable connector is secured by screws to the header means.

6. The package of claim 1 wherein the electrical connectors are hermetically sealed to the header means.

7. The package of claim 1 wherein the ceramic is an inert ceramic and the metal comprising the band is selected from the group consisting of niobium, molybdenum and tantalum.

8. The package of claim 1 wherein the annular end of the band is bonded by a metal or metal alloy braze to the annular end face of the sleeve.

9. The package of claim 1 wherein the header means carries a substrate supporting electronic components including an antenna within the sleeve remote from the open end.

10. The package of claim 9 wherein the antenna has an axis substantially parallel to the end face of the sleeve.

11. The package of claim 1 wherein the header means includes a ceramic header plate carrying the plurality of electrical connectors and enclosed within a metal sleeve hermetically bonded to the metal band.

12. The package of claim 11 wherein the metal sleeve carries an axially extending annular flange within and bonded to an annular surface of the metal band to create a hermetic seal therebetween.

13. The package of claim 12 wherein the metal sleeve carries a radially and inwardly extending annular flange and wherein the ceramic header plate bears against the radially extending flange with an annular outer edge of the header plate bonded to an inner annular surface of the metal sleeve.

14. The package of claim 13 wherein the outer edge of the ceramic header plate is bonded by a metal or metal alloy braze to the inner annular surface of the metal sleeve.

15. The package of claim 1 wherein the header means includes a metal header plate carrying the plurality of electrical connectors.

19. The method of claim 18 wherein the sealing of any micro-cracks in the end face comprises refiring the ceramic sleeve pursuant to claim 14.

16. A method of assembly for a hermetically sealed combination ceramic and metal case for electronic devices implantable in living bodies, the method comprising the steps of:

bonding an annular face of a metal band to an end face of an open end of a ceramic sleeve having a closed end and the open end for receiving electronic components of an implantable electronic device, the band having a coefficient of linear thermal expansion substantially the same as that of the ceramic forming the sleeve;

loading electronic components carried by a header plate through the open end, the header plate closing the metal band and carrying a plurality of electrical connectors for connecting electrical leads to the electronic components housed within the sleeve; and

welding the header plate to the metal band to hermetically seal the open end of the ceramic sleeve.

17. The method of claim 16 further comprising the steps of:

firing the ceramic sleeve;

grinding the annular end face of the open end of the sleeve such that at least a portion of the end face is flat and smooth; and

sealing micro-cracks in the end face caused by the grinding thereof.

18. The method of claim 17 wherein firing the ceramic sleeve comprises slowly raising the temperature of the sleeve to and holding the temperature at about the sintering temperature for the ceramic and then slowly cooling the sleeve.

20. The method of claim 17 further including the step of cleaning of the surface of the sleeve after sealing any micro-cracks by firing the sleeve at about 1000°

C. to remove organic material and contaminates.

21. The method of claim 17 further including the step of coating of the end face of the sleeve after sealing any micro-cracks by masking all but the end face of the sleeve and sputter coating the end face with a metal or metal alloy braze under a vacuum.

22. The method of claim 17 wherein the bonding of the metal band to the ceramic sleeve comprises placing a metal or metal alloy foil between the end face of the sleeve and an annular end of the band, mounting the sleeve and band in fixtures with the end face butting against the annular end of the band and slowly heating the sleeve and band under a vacuum to the sintering temperature of the foil and then slowly lowering the temperature.

23. The method of claim 17 wherein, the welding of the header plate to the metal band comprises welding at an annular surface of the band around an annular axially extending surface o the header plate to create an internal hermetic seal between the band and plate.

24. The method of claim 23 wherein the welding is accomplished in a series of welding steps at spaced sections of the band accompanied by heat sinking.