Hermetically sealed ceramic and metal package for electronic devices implantable in living bodies
First Claim
1. A hermetically sealed combination ceramic and metal package for electronic devices implantable in living bodies, comprising:
- a sleeve having a closed end and an open end for receiving electronic components of a device implantable in a living body, at least some of the components being adversely sensitive to high temperatures, the sleeve being formed of a ceramic material and the open end having a flat annular end face;
a closed band having an annular edge butting against and hermetically bonded to the open-end face of the sleeve, the band being formed of a metal having a coefficient of linear thermal expansion substantially the same as that of the ceramic material forming the sleeve; and
header means closing the package, hermetically bonded to the band and carrying a plurality of electrical connectors for connecting electrical leads to the electrical components within the sleeve.
1 Assignment
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Accused Products
Abstract
A hermetically sealed combination ceramic and metal package for electronic components of an electronic device implantable in a living body, at least some of the components being adversely affected by high temperatures. The package comprises a ceramic sleeve and a metal band having substantially the same coefficients of linear thermal expansion. An annular end face of the sleeve butts against and hermetically seals to an annular end of the metal band. A header plate carrying a substrate upon which the components are mounted and a plurality of electrical connectors closes the open end of the sleeve and is hermetically sealed to the metal band.
420 Citations
24 Claims
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1. A hermetically sealed combination ceramic and metal package for electronic devices implantable in living bodies, comprising:
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a sleeve having a closed end and an open end for receiving electronic components of a device implantable in a living body, at least some of the components being adversely sensitive to high temperatures, the sleeve being formed of a ceramic material and the open end having a flat annular end face; a closed band having an annular edge butting against and hermetically bonded to the open-end face of the sleeve, the band being formed of a metal having a coefficient of linear thermal expansion substantially the same as that of the ceramic material forming the sleeve; and header means closing the package, hermetically bonded to the band and carrying a plurality of electrical connectors for connecting electrical leads to the electrical components within the sleeve. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 19)
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16. A method of assembly for a hermetically sealed combination ceramic and metal case for electronic devices implantable in living bodies, the method comprising the steps of:
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bonding an annular face of a metal band to an end face of an open end of a ceramic sleeve having a closed end and the open end for receiving electronic components of an implantable electronic device, the band having a coefficient of linear thermal expansion substantially the same as that of the ceramic forming the sleeve; loading electronic components carried by a header plate through the open end, the header plate closing the metal band and carrying a plurality of electrical connectors for connecting electrical leads to the electronic components housed within the sleeve; and welding the header plate to the metal band to hermetically seal the open end of the ceramic sleeve. - View Dependent Claims (17, 18, 20, 21, 22, 23, 24)
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Specification