Surface acoustic wave device

• US 4,993,000 A
• Filed: 12/22/1989
• Issued: 02/12/1991
• Est. Priority Date: 12/22/1988
• Status: Expired due to Fees

• Current Assignee: Clarion Co., Ltd. (Faurecia SA)
• Original Assignee: Clarion Co., Ltd. (Faurecia SA)
• Inventors: Niitsuma, Teruo, Mitsutsuka, Syuichi
• Primary Examiner(s): Jordan, Charles T.
• Assistant Examiner(s): ELDRED, JOHN W
• Application Number:
  US07/455,163
• Time in Patent Office: 417 Days
• Field of Search: 367/140, 333/150, 333/151, 333/154, 333/193, 333/194, 310/313 R, 310/313 B
• US Class Current: 367/140
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H03H 9/1085 the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the BAW device
• CPC Class Codes: H03H 9/1092 the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's

Abstract

A surface acoustic wave device according to the present invention can be molded surely with resin, leaving a free space over exciting portions and a propagating portion by disposing a recess portion formed over the exciting portions and the propagating portion on a piezoelectric substrate without using any metallic package.

Claims

1. A surface acoustic wave device comprising:

a substrate having a piezoelectric outer surface on one side, said substrate having on said one side a recessed portion extending part-way through said substrate to define a recess with a piezoelectric floor on which a pair of spaced excitation portions are applied, each excitation portion having excitation transducer electrodes formed on the piezoelectric surface of said recess floor and a propagating portion between said excitation portions;

taking-out electrodes applied upon said substrate and extending from each of said transducer electrodes to the surface of said substrate outside of said recessed portion;

a plate-shaped covering body covering said recessed portion, said recessed portion being sufficiently deep that an air gap remains on the inner side of said covering body over said exciting portions and said propagating portion;

an encapsulation body sealingly covering at least the outer surfaces of said covering body; and

leads connected to said take-out electrodes and projecting beyond said encapsulation body to make connection to an external circuit.

2. A surface acoustic wave device according to claim 1 wherein said covering body is fixed to said subtrate by adhesive applied to the surface of said substrate along and outside the margins of said recessed portion.

3. A surface acoustic wave device according to claim 2 wherein said adhesive is made of a sound-absorbing material.

5. A surface acoustic wave device according to claim 1 or 4 wherein said leads and said covering body are initially formed as one substantially coplanar body in a lead frame which is then cut to separate the same.

6. A surface acoustical wave device according to claim 1 or 4 wherein said encapsulating body sealingly covers all outer surfaces of said covering body, all outer surfaces of said substrate, and both sides of the interior portions of said leads, the outer ends of which project beyond said encapsulating body.

11. The acoustic wave device of claim 1, 4 or 7 wherein said recess floor has applied thereto a first conductive area between said excitation portions and other conductive areas on the defining walls of said recess and on said one side of said substrate outside of said recess for electrically coupling said first conductive area to the exterior of said device, and a conductive lead connected to a portion of said other conductive areas and projecting beyond said encapsulation body to provide electrical connection to an external circuit.

12. The surface acoustic wave device of claim 1, 4 or 7 wherein said covering body covers and seals over the entire marginal portion of the recess in the substrate.

13. The surface acoustic wave device of claim 1, 4 or 7 wherein said air gap is provided over the entire inner side of said covering body.

4. A surface acoustic wave device comprising:

a layered substrate including at least an insulating base and a piezoelectric thin film disposed on said base, said base and piezoelectric film having a recessed portion formed thereon having a pair of spaced acoustic wave excitation portions formed on said piezoelectric film and each having excitation transducer electrodes formed thereon and a propagating portion between said excitation portions and a conductive area formed on said propagating portion;

taking-out electrodes on said piezoelectric film extending from each of said transducer electrodes and conductive area to the surface of said substrate outside of said recessed portion;

a covering body comprising a plate covering said recessed portion, said recessed portion being sufficiently deep that an air gap remains on the inner side of said covering body over said exciting portions and said propagating portion;

an encapsulation body sealingly covering at least the outer surfaces of said plate; and

leads connected to said take-out electrodes and projecting beyond said encapsulation body to make connection to an external circuit.

7. A surface acoustic wave device comprising:

a substrate, one side of said substrate having opposite end surfaces interconnected by side surfaces, said end and side surfaces defining the margins of a recess extending part way through said substrate and having a piezoelectric surface floor, said substrate having conductive acoustic wave excitation portions disposed on the piezoelectric floor of said recess, spaced conductive pads on said one side of the substrate, conductive areas applied to said substrate surfaces and to the defining walls of said recess for interconnecting said conductive pads and excitation portions, a covering body adhesively secured over said recess along the margins of said recess and defining an air gap in said recess between said recess floor and covering body, conductive leads conductively secured to said pads, and an encapsulation body applied over the outer surfaces of said covering body and substrate, with said leads projecting from said encapsulating body.

8. The acoustic wave device of claim 7 wherein said end and side surfaces of said substrate are coplanar.

9. The acoustic wave device of claim 7 wherein said excitation portions are opposite said end surfaces, a pair of said conductive pads are provided on each of said end surfaces of said substrate, with a pair of said conductive areas extending from each of said pair of pads to the adjacent acoustic wave excitation portion.

10. The acoustic wave device of claim 7 wherein said adhesive extends onto the floor of said recess to form a sound absorber preventing acoustic wave deflection thereat.