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Method of manufacture interconnect device

  • US 4,995,941 A
  • Filed: 05/15/1989
  • Issued: 02/26/1991
  • Est. Priority Date: 05/15/1989
  • Status: Expired due to Term
First Claim
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1. A method of making an interconnect drive for electronic components comprising the steps of:

  • forming a release layer on a carrier plate;

    forming a conductive pattern of leads on said release layer;

    forming registration features on said release layer;

    bonding a laminate to said conductive pattern of leads by a layer of adhesive, said laminate including a conductive sheet and a dielectric sheet wherein said dielectric sheet faces said conductive pattern of leads and said conductive sheet faces away from said adhesive layer;

    forming via holes in said laminate in a predetermined pattern, said via holes extending through said conductive sheet, dielectric sheet and adhesive layer to expose said leads;

    depositing conductive material in said via holes and onto said conductive sheet of said laminate to interconnect said leads to said conductive sheet;

    forming at least one window in said device by removing selected parts of said conductive material, said laminate and said adhesive layer, said window extending through said dielectric sheet and adhesive layer to expose said leads; and

    forming at least one frame spaced from and surrounding said window in said device by removing selected parts of said conductive material, said laminate and said adhesive layer, said frame extending through said dielectric sheet and adhesive layer to expose said leads.

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