Field effect transistor for microstrip mounting and microstrip-mounted transistor assembly

• US 4,996,582 A
• Filed: 09/08/1989
• Issued: 02/26/1991
• Est. Priority Date: 09/14/1988
• Status: Expired due to Term

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Nagahama, Kohki
• Primary Examiner(s): James, Andrew J.
• Assistant Examiner(s): MONIN, DONALD L JR
• Application Number:
  US07/404,636
• Time in Patent Office: 536 Days
• Field of Search: 357/68, 357/22, 357/69, 357/23.14, 333/247, 333/246
• US Class Current: 257/280
• CPC Class Codes: H01L 2223/6644 Packaging aspects of high-frequency amplifiers
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48237 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/48599 Principal constituent of the connecting portion of the wire connector being Gold (Au)
• CPC Class Codes: H01L 2224/4903 Connectors having different sizes, e.g. different diameters
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/06 of a plurality of bonding areas
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/0101 Neon [Ne]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01018 : Argon [Ar]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01031 : Gallium [Ga]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/01052 : Tellurium [Te]
• CPC Class Codes: H01L 2924/01072 : Hafnium [Hf]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/10336 : Aluminium gallium arsenide [AlGaAs]
• CPC Class Codes: H01L 2924/12032 : Schottky diode
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13063 : Metal-Semiconductor Field-Effect Transistor [MESFET]
• CPC Class Codes: H01L 2924/13064 : High Electron Mobility Transistor [HEMT, HFET [heterostructure FET], MODFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: Y10S 257/926 : Elongated lead extending axially through another elongated lead

Abstract

A field effect transistor chip for connection to a microstrip transmission line includes a semiconductor substrate, a field effect transistor formed in the substrate, source, gate, and drain electrodes disposed at least partially on the substrate, the gate and source electrodes forming an air bridge, and gate and drain beam leads extending from the substrate for electrical connection to the conductors of a microstrip transmission line. The microstrip transmission line includes dielectric substrates on which substantially uniform width conductors are disposed, the substrates being separated by a gap in which the transistor chip is disposed. The beam leads may be unitary with the electrodes of the chip or with the conductors of the transmission line.

Claims

1. A field effect transistor chip for connection to a microstrip transmission line comprising:

a semiconductor substrate having first and second generally opposed surfaces;

a field effect transistor formed in said semiconductor substrate including a gate, a source, and a drain, all accessible from said first surface;

opposed drain and gate electrodes of substantially the same width respectively electrically connected to said drain and gate and disposed on said first surface;

a source electrode electrically connected to said source disposed partially on said first surface and forming an air bridge so that said source electrode crosses over and is electrically insulated from said gate electrode; and

a gate beam lead and a drain beam lead respectively electrically connected to said gate and drain electrodes, each beam lead including an extension extending beyond said semiconductor substrate for connection to microstrip transmission line conductors wherein said gate and drain beam leads each have widths transverse to the extension of said gate and drain beams leads beyond said substrate and the widths of said gate electrode and said gate beam electrode, and of said drain electrode and said drain beam electrode, are substantially equal, respectively.

2. The field effect transistor chip of claim 1 wherein said gate electrode includes a plurality of electrically conducting fingers electrically connected to said gate on said first surface.

3. The field effect transistor chip of claim 2 wherein said air bridge includes portions of said source electrode spaced from each of said electrically conductive fingers and contacting said first surface between said fingers.

4. The field effect transistor chip of claim 1 wherein said source electrode is in electrical contact with said second surface through a metallized via extending through said substrate from said first surface to said second surface.

5. A microstrip transmission line and field effect transistor chip assembly comprising:

a microstrip transmission line including first and second dielectric substrates on which are disposed first and second electrical conductors, respectively, each having a substantially uniform width, said first and second substrates being spaced apart by an intervening gap;

a semiconductor substrate having first and second generally opposed surfaces, said semiconductor substrate being disposed in the gap between said first and second dielectric substrates;

a field effect transistor formed in said semiconductor substrate including a gate, a source, and a drain, all accessible from said first surface;

opposed drain and gate electrodes of substantially the same width respectively electrically connected to said drain and gate and disposed at least partially on said first surface;

a source electrode electrically connected to said source disposed at least partially on said first surface and forming an air bridge so that said source electrode crosses and is electrically insulated from said gate electrode; and

a gate beam lead and a drain beam lead respectively electrically connected to said gate and drain electrodes, each beam lead including an extension extending beyond said semiconductor substrate between and electrically connecting said gate and drain electrodes to said first and second conductors, respectively wherein said gate and drain beam leads each have widths transverse to the extension of said gate and drain beam leads beyond said substrate and the widths of said gate electrode, said gate beam electrode, said drain electrode, said drain beam electrode, and said first and second electrical conductors are substantially equal.

6. The assembly of claim 5 wherein said air bridges includes a portion of said gate electrode spaced from said first surface and said source electrode by an air gap, said source electrode being disposed on said first surface.

7. The assembly of claim 6 wherein said gate electrode includes a plurality of electrically conducting fingers extending from the portion of said gate electrode spaced from said first surface to and electrically connected to said gate at said first surface.

8. The assembly of claim 5 wherein said air bridge includes a portion of said source electrode spaced from said first surface and said gate electrode by an air gap, said gate electrode being disposed on said first surface.

9. The assembly of claim 8 wherein said gate electrode includes a plurality of electrically conducting fingers electrically connected to said gate on said first surface.

10. The assembly of claim 9 wherein said air bridge includes portions of said source electrode spaced from each of said electrically conductive fingers and contacting said first surface between said fingers.

11. The assembly of claim 5 wherein said source electrode is in electrical contact with said second surface through a metallized via extending through said substrate from said first surface to said second surface.

12. The assembly of claim 5 wherein said gate and drain beam leads are unitary portions of said gate and drain electrodes extending to said first and second conductors.