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Method of manufacturing semiconductor device comprising step of patterning resist and light irradiation apparatus used by the manufacturing method

  • US 5,001,039 A
  • Filed: 03/10/1989
  • Issued: 03/19/1991
  • Est. Priority Date: 03/14/1988
  • Status: Expired due to Term
First Claim
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1. A method of manufacturing a semiconductor device forming a circuit pattern on a semiconductor substrate using a resist pattern comprising the steps of:

  • coating a resist over the whole surface of the main surface of the semiconductor substrate;

    forming a resist pattern by exposing the coated resist to light through a mask and then developing it; and

    selectively curing the surface of said resist pattern by irradiating the surface of said resist pattern only at a central portion of the semiconductor substrate with light having a predetermined wavelength, with the surface of said resist pattern at the peripheral portion surrounding the central portion of said semiconductor substrate remaining unirradiated.

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