Method and apparatus for improving thermal coupling between a cooling plate of a semiconductor package housing and a heat sink

• US 5,001,547 A
• Filed: 08/07/1989
• Issued: 03/19/1991
• Est. Priority Date: 10/21/1983
• Status: Expired due to Term

• Current Assignee: SGS Microeletrronica SpA (STMicroelectronics NV)
• Original Assignee: SGS Microeletrronica SpA (STMicroelectronics NV)
• Inventors: RomanoLuigi
• Primary Examiner(s): Mintel, William
• Application Number:
  US07/391,674
• Time in Patent Office: 589 Days
• Field of Search: 357/65, 357/69, 357/70, 357/72, 357/81, 357/74, 357/65, 357/69, 357/70, 357/72, 357/81, 357/79, 439/571, 439/431, 439/432, 439/571, 439/431, 439/432
• US Class Current: 257/712
• CPC Class Codes: H01L 2023/405 heatsink to package
• CPC Class Codes: H01L 2023/4087 Mounting accessories, interposers, clamping or screwing parts
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/49562 for devices being provided for in H01L29/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A semiconductor component package comprises a metal plate and a synthetic resin housing or body. The plate is formed with an aperture by which it can be secured to a heat sink, generally a metal plate. Around the aperture is a weakened annular portion produced by shearing. When the package housing is secured to a surface which is not completely flat, mechanical stressing due to the tightening of the screw coupling is limited to the weakened annular portion and is not transmitted to the resin housing and to the elements therein.

Claims

1. An electronic component package including a metal cooling plate for transferring heat to an external heat sink comprising, in combination:

a substantially flat metal cooling plate portion;

through-hole means in said substantially flat metal cooling plate portion for screw attachment of said package to said external heat sink;

a screw passing through said through-hole means;

a head on said screw; and

said substantially flat metal cooling plate portion including an annular portion completely surrounding said though-hole means and larger than said screw head, said annular portion being separated from the remainder of said flat cooling plate portion by a structurally distinct sheared region for reducing the stress transmitted to the remainder of said flat cooling plate due to the tightening of said screw, wherein said structurally distinct region is created by shearing said annular portion surrounding said through-hole from said flat cooling plate by displacing said annular metal portion from the remainder of said flat cooling plate portion by a predetermined amount during the manufacture of said package and then restoring said metal portion by compressing it in place through elastic deformation to provide said structurally distinct region in aid flat cooling plate.

2. An electronic component package including a metal cooling plate for transferring heat to an external heat sink, comprising, in combination:

a substantially flat metal cooling plate portion;

through-hole means in said substantially flat metal cooling plate portion for permitting said package to be attached to said external heat sink screw means having a head with a diameter larger than the diameter of said through-hole means for attaching said package to said external heat sink;

said substantially flat metal cooling plate portion including sheared and recompressed in place annular portion means completely surrounding said through-hole means for reducing the stress transmitted tot he remainder of said flat cooling plate due to the tightening of said screw means, said annular portion means being provided in said cooling plate portion prior to the introduction of said screw means into said through-hole means.