Electrostatic handling device
First Claim
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1. An electrostatic handling device for a wafer having a pair of wafer faces, comprising:
- a dielectric region having a top face, said top face being adapted for accepting one of the pair of wafer faces thereagainst; and
a plurality of conductors in said dielectric region, at least one of the spacings between said plurality of conductors and the spacing from said plurality of conductors to said top face of said dielectric region being arranged to generate electrostatic force between said conductors and the wafer to thereby hold the wafer against said top face when said conductors are electrically charged, at least one of the spacings between said plurality of conductors and the spacing from said plurality of conductors to said top face of said dielectric region being arranged to generate substantially no net electrostatic force at the opposite one of the pair of wafer faces to thereby reduce electrostatic force interference thereat when said conductors are electrically charged.
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Abstract
An electrostatic handling device for a wafer having a pair of faces, includes a dielectric region having a top face which is adapted to accept one of the pair of wafer faces thereagainst. Conductors are positioned in the dielectric region. The conductors are arranged in the dielectric region to generate electrostatic force between the conductors and the wafer to hold the wafer against the top face of the dielectric region. The conductors are further arranged in the dielectric region to generate substantially no net electrostatic force at the opposite one of the pair of wafer faces to thereby reduce electrostatic force interference thereat.
88 Citations
21 Claims
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1. An electrostatic handling device for a wafer having a pair of wafer faces, comprising:
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a dielectric region having a top face, said top face being adapted for accepting one of the pair of wafer faces thereagainst; and a plurality of conductors in said dielectric region, at least one of the spacings between said plurality of conductors and the spacing from said plurality of conductors to said top face of said dielectric region being arranged to generate electrostatic force between said conductors and the wafer to thereby hold the wafer against said top face when said conductors are electrically charged, at least one of the spacings between said plurality of conductors and the spacing from said plurality of conductors to said top face of said dielectric region being arranged to generate substantially no net electrostatic force at the opposite one of the pair of wafer faces to thereby reduce electrostatic force interference thereat when said conductors are electrically charged. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method for holding the bottom face of a wafer against a dielectric surface comprising the step of:
- generating electrostatic force between the wafer and the dielectric surface which produce substantially no net electrostatic force at the top face of the wafer, whereby the top face of the wafer may be processed without electrostatic force interference.
- View Dependent Claims (21)
Specification