Multilayer printed wiring board with single layer vias

• US 5,001,605 A
• Filed: 11/30/1988
• Issued: 03/19/1991
• Est. Priority Date: 11/30/1988
• Status: Expired due to Fees

• Current Assignee: Raytheon Company (Rtx Corporation)
• Original Assignee: Hughes Aircraft Company (Rtx Corporation)
• Inventors: Savagian, Peter J., Fitzhugh, Thomas E.
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Ghosh, Paramita
• Application Number:
  US07/278,115
• Time in Patent Office: 839 Days
• Field of Search: 361/410, 361/414, 174/262, 174/266
• US Class Current: 361/792
• CPC Class Codes: H05K 1/113 Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 2201/0959 Plated through-holes or plated blind vias filled with insulating material
• CPC Class Codes: H05K 2201/09627 Special connections between adjacent vias, not for grounding vias redundant conductors or connections H05K2201/0979
• CPC Class Codes: H05K 2201/10727 Leadless chip carrier [LCC], e.g. chip-modules for cards
• CPC Class Codes: H05K 3/0094 Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
• CPC Class Codes: H05K 3/3473 Plating of solder
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
• CPC Class Codes: H05K 3/4623 the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards H05K3/462 takes precedence

Abstract

The top board (12) in multi-layer printed wiring board (10) has a conductor (48) on its underside leading from the principal via (20) to small via (54). The small via is filled with resin material so that it is plated level over with copper layer (62) and solder layer (64). When leadless chip carrier (66) is attached, there is no place for the solder layer (64) to run to starve the joint to result in reliable solder attachment.

Claims

1. A multi-layer printed wiring board with a top surface of a top board layer comprising:

at least first and second layers, said first and second layers having an interface therebetween, said first layer being a printed wiring board having an etched copper clad layer thereon defining a via top pad and a mounting top pad, said via top pad and said mounting top pad being physically separated on said top surface of said top board layer wherein said first layer is a fiber-filled thermosetting synthetic polymer composition material board and there is a third layer beneath said second layer and in contact therewith and said third layer is a fiber-filled thermosetting synthetic polymer composition material board and said second layer is a fiber-reinforced thermosetting synthetic polymer composition material which is unset when said boards are assembled and is thermoset with said boards in assembled condition so that thermosetting synthetic polymer composition material extends into said second via hole before thermosetting of the polymer composition material in said layer;

a first via pad in said interface between said first and second layers below said via top pad and a second via pad in said interface between said first and second layers below said mounting pad;

a first via hole through said via pad on said top surface and said first via pad in said interface, said first via hole extending through said multilayer printed wiring board including said first and second layers thereof, a conductor in said first via hole to interconnect said top via pad and said first via pad in said interface;

a second via hole between said mounting pad on said top surface and said second via pad in said interface, a conductive coating through said second via hole to connect said mounting pad and said second via pad; and

an electrical conductor in said interface interconnecting said first via pad and said second via pad in said interface so that said top via pad is interconnected with said mounting pad without electrical interconnection along said top surface of said first layer.

2. The multi-layer printed wiring board of claim 1 wherein said first layer has clad copper on both the upper and lower surface thereof and said first and second via pads and said conductor connecting said first and second via pads in said interface are formed on the lower copper clad layer of said first layer.

3. The multi-layer printed wiring board of claim 2 wherein subsequent to forming pads and conductors in said clad layers, said clad layer on the top surface of said first layer has copper plated thereon to cover said second via and has solder deposited thereon to permit solder attachment to said mounting pad.

4. The multi-layer printed wiring board of claim 3 wherein there is a plurality of mounting pads on said top surface of said first layer and there is a plurality of vias extending through said multi-layer printed wiring board, at least some of said mounting pad being connected to a corresponding via in said interface between said first and second layers.

5. The multi-layer printed wiring board of claim 4 further including in combination a leadless chip carrier mounted so as to be secured and electrically connected by said solder layer on said pads.

6. A multi-layer printed wiring board comprising:

a plurality of layers, said plurality of layers including first, second and third layers, said first and third layers each having an upper and lower surface, said upper and lower surfaces of said first and third layers each having clad layer thereon and said clad copper on said upper surface of said first layer having via pads and mounting pads thereon, said lower surface of said first layer and said upper surface of said third layer having via pads and conductors thereon;

said second layer being formed of unset thermosetting synthetic polymer composition material in reinforcing fiber;

a first via hole through all of said layers of said multi-layer printed wiring board and a second via hole through only said first layer of said printed wiring board, said first via hole extending through a plurality of via pads and including a via pad on said upper surface of said first layer and through a via pad on said lower surface of said first layer;

a second via hole extending through a mounting pad on the top surface of said first layer and through a second via pad on said lower surface of said first layer;

a circuit conductor in said clad layer on said lower surface of said first layer extending between said first via hole and said second via pad, a conductive coating through both said via openings so that said conductive coating interconnects all pads in said opening through said multi-layer printed wiring board and a conductive coating connects said mounting pad and said via pad, said second layer extending up into said second via hole to at least partially fill said second via hole; and

solder deposited on said mounting pad, said mounting pad being separated from said via so that solder on said mounting pad does not run toward said via when said solder is melted.

7. The multi-layer printed wiring board of claim 6 further including in combination an electrical component having one of its leads connected to said mounting pad by being attached to said solder on said mounting pad.

8. The multi-layer printed wiring board of claim 6 wherein said third layer of said multi-layer printed wiring board has pads and conductors on the upper and lower surfaces thereof and said second via does not extend thereto.