Electric component mounting method

• US 5,003,692 A
• Filed: 05/16/1990
• Issued: 04/02/1991
• Est. Priority Date: 05/17/1989
• Status: Expired due to Term

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Makino, Yutaka, Izumi, Yasuo, Ishimoto, Kazumi
• Primary Examiner(s): Hall, Carl E.
• Assistant Examiner(s): Arbes, Carl J.
• Application Number:
  US07/524,055
• Time in Patent Office: 321 Days
• Field of Search: 29/740, 29/840, 29/833, 29/759, 29/834, 228/6.2
• US Class Current: 29/834
• CPC Class Codes: H05K 13/0413 with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
• CPC Class Codes: H05K 13/0815 Controlling of component placement on the substrate during or after manufacturing
• CPC Class Codes: Y10T 29/49131 by utilizing optical sighting device
• CPC Class Codes: Y10T 29/49133 with component orienting
• CPC Class Codes: Y10T 29/53178 Chip component
• CPC Class Codes: Y10T 29/53261 Means to align and advance work part

Abstract

A component mounting method for successively mounting electric components on a printed circuit board, which method comprises the steps of recognizing the position of an electric component retained by a suction nozzle by the effect of a suction force; recognizing the predetermined mounting position on a printed circuit board or any other suitable substrate, at a location spaced a predetermined distance from the printed circuit board; mounting the electric component after the latter has been aligned with the predetermined mounting position on the printed circuit board; and recognizing, through the suction nozzle, the electric component to determine if the electric component has been mounted properly after the suction nozzle has been elevated to a position spaced a predetermined distance upwardly from the printed circuit board. In the event that the latter has been mounted incorrectly, information indicative of an incorrect mounting of the electric component is recorded in a control data.

Claims

1. A component mounting method which comprises the steps of:

recognizing the position of an electric component retained by a suction nozzle by the effect of a suction force;

recognizing the predetermined mounting position on a support medium such as, for example, a printed circuit board or any other suitable substrate, at a location spaced a predetermined distance from the support medium;

mounting the electric component after the latter has been aligned with the predetermined mounting position on the support medium;

recognizing, through the suction nozzle, the electric component to determine if the electric component has been mounted properly after the suction nozzle has been elevated to a position spaced a predetermined distance upwardly from the support medium; and

recording in a control data information indicative of an incorrect mounting of the electric component in the event that the latter has been mounted incorrectly.

2. A component mounting method which comprises the steps of:

recognizing the position of an electric component retained by a suction nozzle by the effect of a suction force;

recognizing the predetermined mounting position on a support medium such as, for example, a printed circuit board or any other suitable substrate, at a location spaced a predetermined distance from the support medium;

mounting the electric component after the latter has been aligned with the predetermined mounting position on the support medium;

recognizing, through the suction nozzle, the electric component to determine if the electric component has been mounted properly after the suction nozzle has been elevated to a postion spaced a predetermined distance upwardly from the support medium;

picking up again the electric component which has been incorrectly mounted;

recognizing, through the suction nozzle, the shape and posture of the electric component so picked up;

mounting the electric component on the support medium after the electric component has been aligned with the predetermined mounting position on the support medium in the event that the shape and posture of the electric component are correct; and

recognizing the electric component so mounted on the support medium.

3. The method as claimed in claim 2, wherein, in the event that the shape and posture of the electric component which has been re-picked up are defective, said electric component is discarded and information indicative thereof is recorded in the control data.