Die attach adhesive composition

• US 5,006,575 A
• Filed: 04/26/1990
• Issued: 04/09/1991
• Est. Priority Date: 10/20/1989
• Status: Expired due to Term

• Current Assignee: E. I. du Pont de Nemours and Company (Corteva, Inc.)
• Original Assignee: E. I. du Pont de Nemours and Company (Corteva, Inc.)
• Inventors: Chan, Man-Sheung
• Primary Examiner(s): Michl, Paul R.
• Assistant Examiner(s): DEAN, KAREN A
• Application Number:
  US07/515,698
• Time in Patent Office: 348 Days
• Field of Search: 523/458, 525/930, 252/514
• US Class Current: 523/458
• CPC Class Codes: C08K 3/08 Metals
• CPC Class Codes: C08L 2666/02 Organic macromolecular compounds, natural resins, waxes or and bituminous materials
• CPC Class Codes: C08L 2666/16 Addition or condensation polymers of aldehydes or ketones according to C08L59/00 - C08L61/00; Derivatives thereof
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C09J 163/00 Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
• CPC Class Codes: C09J 171/00 Adhesives based on polyethers obtained by reactions forming an ether link in the main chain based on polyacetals C09J159/00; based on epoxy resins C09J163/00; based on polythioether-ethers C09J181/02; based on polyethersulfones C09J181/06; Adhesives based on derivatives of such polymers
• CPC Class Codes: H01B 1/22 the conductive material comprising metals or alloys
• CPC Class Codes: H01L 23/4828 Conductive organic material or pastes, e.g. conductive adhesives, inks
• CPC Class Codes: H01L 23/49883 the conductive materials containing organic materials or pastes, e.g. for thick films for printed circuits H05K1/092
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: Y10S 525/93 Reaction product of a polyhydric phenol and epichlorohydrin or diepoxide, having a molecular weight of over 5,000, e.g. phenoxy resins

Abstract

A solid adhesive composition which is suitable for the very rapid attachment of IC chips to high surface energy substrates comprising flake silver particles dispersed in solid matrix consisting essentially of a thermoplastic phenoxy resin and a small amount of thermally crosslinkable resin.

Claims

1. An adhesive composition for attaching IC chips to high surface energy inorganic substrates comprising:

(a) 60-80% by weight of flake silver particles dispersed in

(b) 40-20% by weight of a solid, homogeneous, amorphous polymeric halide-free matrix consisting essentially of 92-99.5% by weight thermoplastic phenoxy resin and 8-0.5% by weight thermally crosslinkable resin, the polymeric matrix having a Tg of 80°

-160°

C. and a tensile modulus of at least 1.0×

10⁵ psi.

2. The composition of claim 1 in which component (a) is 65-75% by weight flake silver.

3. The composition of claim 1 in which the thermally crosslinkable resin is a heat-reactive resole resin.

4. The composition of claim 1 containing 6 to 2% by weight of the thermally crosslinkable resin.

5. The composition of claim 1 in which the thermally crosslinkable resin is a melamine-formaldehyde resin.

6. The composition of claim 1 in which the phenoxy resin corresponds to the structural formula ##STR10## in which X is selected from the group consisting of:

##STR11##

7. The composition of claim 5 in which X is ##STR12##

8. The composition of claim 5 in which X is ##STR13##

9. The composition of claim 5 in which X is ##STR14##

10. The composition of claim 1 in which the Tg of the polymeric matrix is 100°

-120°

C.

11. The composition of claim 1 in the form of a self-supporting ribbon.

12. A thick film paste composition comprising

(a) 60-80% by weight of finely divided flake silver particles dispersed in

(b) 40-20% by weight of a solid, homogeneous, amorphous polymeric halide-free matrix consisting essentially of 92-99.5% by weight thermoplastic phenoxy resin and 8-0.5% by weight thermally crosslinkable resin, the polymeric matrix having a Tg of 80°

-160°

C. and a tensile modulus of at least 1.0×

10⁵ psi dissolved in a nonvolatile organic solvent.