Microencapsulated phase change material slurry heat sinks
First Claim
Patent Images
1. A heat sink device comprising:
- a sealed container; and
a slurry of a microencapsulated phase change material and a fluid sealed within said container, said slurry being free flowing within said container.
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Abstract
A slurry of micro-encapsulated phase change materials is provided in accordance with the present invention as a heat sink for, for example, the thermal management of electronic components. The slurry of micro-encapsulated phase change material may be provided within an open container and the electronic component immersed therein. In the alternative, the slurry of micro-encapsulated phase change material can be provided within a container of either flexible bag-like design or a relatively rigid preformed structure to be mounted adjacent the article to be thermally controlled.
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Citations
20 Claims
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1. A heat sink device comprising:
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a sealed container; and a slurry of a microencapsulated phase change material and a fluid sealed within said container, said slurry being free flowing within said container. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of maintaining the temperature of an electronic component comprising:
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providing a slurry of a liquid and microencapsulated phase change material; placing said slurry in an open container; and immersing the electronic component in said slurry within said container. - View Dependent Claims (13, 14)
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15. A method of maintaining the temperature of an electronic component comprising:
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providing a slurry of a liquid and microencapsulated phase change material; providing a container; disposing said slurry in said container; sealing said container; and placing said sealed container in contact with an electronic component. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification