Microencapsulated phase change material slurry heat sinks

• US 5,007,478 A
• Filed: 05/26/1989
• Issued: 04/16/1991
• Est. Priority Date: 05/26/1989
• Status: Expired due to Term

• Current Assignee: University of Miami
• Original Assignee: University of Miami
• Inventors: Sengupta, Subrata
• Primary Examiner(s): DAVIS JR, ALBERT
• Application Number:
  US07/357,719
• Time in Patent Office: 690 Days
• Field of Search: 165/47, 165/10, 165/902, 165/104.33, 165/104.11, 165/104.19, 361/385
• US Class Current: 165/10
• CPC Class Codes: F28D 20/023 the latent heat storage material being enclosed in granular particles or dispersed in a porous, fibrous or cellular structure
• CPC Class Codes: H01L 23/4275 by melting or evaporation of solids
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y02E 60/14 Thermal energy storage
• CPC Class Codes: Y10S 165/902 Heat storage

Abstract

A slurry of micro-encapsulated phase change materials is provided in accordance with the present invention as a heat sink for, for example, the thermal management of electronic components. The slurry of micro-encapsulated phase change material may be provided within an open container and the electronic component immersed therein. In the alternative, the slurry of micro-encapsulated phase change material can be provided within a container of either flexible bag-like design or a relatively rigid preformed structure to be mounted adjacent the article to be thermally controlled.

Claims

1. A heat sink device comprising:

a sealed container; and

a slurry of a microencapsulated phase change material and a fluid sealed within said container, said slurry being free flowing within said container.

2. A heat sink device as in claim 1, wherein said container is a flexible bag.

3. A heat sink device as in claim 1, wherein said container has walls of predetermined configuration so that said container has a predetermined shape.

4. A heat sink device as in claim 1, wherein said phase change material is a phase change material selected from n-octadecane, neicosane, myristic acid, stearic acid and acetamide.

5. A heat sink device as in claim 4, wherein said phase change material is encapsulated in a material that has a higher melting point than the encapsulated phase change material.

6. A heat sink device as in claim 5, wherein said phase change material is encapsulated in metal.

7. A heat sink device as in claim 5, wherein said phase change material is encapsulated in polystyrene or polyvinyl alcohol.

8. A heat sink device as in claim 1, wherein said phase change material is encapsulated in a material that has a higher melting point than the encapsulated phase change material.

9. A heat sink device as in claim 8, wherein said phase change material is encapsulated in metal.

10. A heat sink device as in claim 8, wherein said phase change material is encapsulated in polystyrene.

11. A heat sink device as in claim 1, wherein said liquid in which said microencapsulated phase change material is suspended is a non-reactive cooling fluid.

12. A method of maintaining the temperature of an electronic component comprising:

providing a slurry of a liquid and microencapsulated phase change material;

placing said slurry in an open container; and

immersing the electronic component in said slurry within said container.

13. A method as in claim 12, wherein said step of providing a slurry comprises providing a slurry of non-reactive cooling fluid and microencapsulated phase change material.

14. A method as in claim 12, wherein said step of providing a slurry includes providing a microencapsulated phase change material selected from n-octadecane, n-eicosane, myristic acid, stearic acid and acetamide.

15. A method of maintaining the temperature of an electronic component comprising:

providing a slurry of a liquid and microencapsulated phase change material;

providing a container;

disposing said slurry in said container;

sealing said container; and

placing said sealed container in contact with an electronic component.

16. A method as in claim 15, wherein said step of providing a slurry comprises providing a slurry of non-reactive cooling fluid and microencapsulated phase change material.

17. A method as in claim 15, wherein said step of providing a slurry includes providing a microencapsulated phase change material selected from n-octadecane, n-eicosane, myristic acid, stearic acid and acetamide.

18. A method as in claim 15, wherein said step of providing a container comprises providing a flexible bag.

19. A method as in claim 15, wherein said step of providing a container comprises providing a container having walls of predetermined configuration so that said container has a predetermined shape.

20. A method as in claim 15, wherein said step of providing a slurry includes providing a phase change material encapsulated in a material that has a higher melting point than the encapsulated phase change material.