Corrosion inhibitive pretreatment for "copper-free" mirrors

• US 5,008,153 A
• Filed: 12/08/1988
• Issued: 04/16/1991
• Est. Priority Date: 12/08/1988
• Status: Expired due to Term

• Current Assignee: Lilly Industries Limited
• Original Assignee: PPG Industries Incorporated (Nouryon BV)
• Inventors: Hayes, Deborah E.
• Primary Examiner(s): Beck, Shrive
• Assistant Examiner(s): Dang, Vi Duong
• Application Number:
  US07/281,358
• Time in Patent Office: 859 Days
• Field of Search: 427/306, 427/304, 106/1.11, 106/14.16, 106/287.11, 106/287.13, 428/429
• US Class Current: 428/429
• CPC Class Codes: C03C 17/38 at least one coating being a coating of an organic material
• CPC Class Codes: C09D 5/002 Priming paints C09D5/08 takes precedence
• CPC Class Codes: H05K 3/282 for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
• CPC Class Codes: H05K 3/389 by the use of a coupling agent, e.g. silane
• CPC Class Codes: Y10T 428/31612 As silicone, silane or siloxane

Abstract

A pretreatment composition comprising a combination of an adhesion promoter and corrosion inhibitor which is applied to the surface of a substrate and a process for pretreating the surface of a substrate before the deposition of thin metallic films to prepare mirrored substrates.

Claims

1. An improved process of depositing a thin metallic film on a substrate by applying to the substrate a thin metallic film the improvement comprising pretreating the surface of the substrate with a pretreatment composition comprising a protective material before applying the thin metallic film to the substrate, said pretreatment composition comprising

(A) an adhesion promoter bonding or coupling to the interface of the substrate and the thin metallic film and

(B) a corrosion inhibitor wherein (A) is selected from the group consisting of a silane compound, a titanium compound, a zirconium compound, and a mixture thereof, and (B) is selected from the group consisting of a nitrogen containing heterocyclic compound, a corrosion inhibitive metallic compound other than recited in (A) and a mixture thereof.

2. An improved process of depositing a thin metallic film of claim 1 wherein the protective material comprises an adhesion promoter and a corrosion inhibitor.

3. An improved process of claim 1 further comprising rinsing the pretreated substrate before depositing the thin metallic film thereon.

4. An improved process of claim 3 wherein rinsing is conducted with deionized water.

5. An improved process of claim 1 which further comprises depositing an organic coating over the thin metallic film.

6. An improved process of claim 5 wherein the organic coating is an alkyd/melamine coating.

7. An article of matter which is prepared by the process of claim 1.

8. An article of matter which is prepared by the process of claim 5.

9. An article of matter of claim 8 wherein the substrate is glass.

10. An article of matter of claim 1 wherein the substrate is plastic.

11. An article of matter of claim 8 wherein the thin metallic film is a layer of silver or layer of silver followed by a layer of copper.