Zero power IC module

• US 5,008,776 A
• Filed: 06/06/1990
• Issued: 04/16/1991
• Est. Priority Date: 06/06/1990
• Status: Expired due to Term

• Current Assignee: SGS Thomson Microelectronics Inc (STMicroelectronics NV)
• Original Assignee: SGS Thomson Microelectronics Inc (STMicroelectronics NV)
• Inventors: Queyssac, Daniel
• Primary Examiner(s): TUDOR, HAROLD JAY
• Application Number:
  US07/531,150
• Time in Patent Office: 314 Days
• Field of Search: 357/74, 357/75, 361/392, 361/394, 361/380, 174/52.4, 365/228, 365/226, 365/229, 365/52, 365/53, 429/90-100
• US Class Current: 361/728
• CPC Class Codes: G11C 5/141 Battery and back-up supplies
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85207 Thermosonic bonding
• CPC Class Codes: H01L 23/49503 characterised by the die pad
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49551 characterised by bent parts
• CPC Class Codes: H01L 23/49593 Battery in combination with a leadframe
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01055 : Cesium [Cs]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/0132 : Binary Alloys
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H05K 2201/10689 : Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 2201/2054 : Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
• CPC Class Codes: H05K 2203/1581 : Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
• CPC Class Codes: H05K 2203/304 : Protecting a component during manufacturing
• CPC Class Codes: H05K 3/341 : Surface mounted components
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

An integrated circuit package encapsulates a volatile memory chip and a backup battery for preserving data in the event of loss of main power supply. The package includes a finger lead assembly encapsulated within a body of non-conductive material, with a coplanar base support finger lead traversing an interconnect region. One terminal of the battery is welded to the base support finger lead, and the integrated circuit chip is bonded directly onto the other battery terminal by a layer of conductive epoxy. The stacked assembly of the integrated circuit chip, the battery and the base support finger lead is disposed within a central region whereby the stacked assembly, including gold interconnect wires, are completely encapsulated within the molded package body.

Claims

1. A device package for providing electrical power to an electronic circuit device comprising, in combination:

a body of non-conductive material;

a finger lead assembly encapsulated within said body of non-conductive material, said finger lead assembly including a plurality of conductive finger leads, with one of said finger leads defining a power lead;

a battery having a positive polarity power terminal and a negative polarity power terminal, one of said battery power terminals being mounted onto said power lead; and

,

an electronic circuit device encapuslated within said body of non-conductive material and coupled to one of said battery power terminals opposite of said battery terminal mounted onto said power lead.

2. A device package as defined in claim 1, wherein said conductive finger leads and said power lead are substantially coplanar with each other.

3. A device package as defined in claim 1, wherein said electronic circuit device is an integrated circuit implemented on a semiconductor chip, said chip being mechanically mounted upon and electrically connected to said opposite battery terminal in stacked relation therewith, said integrated circuit having a plurality of input/output nodes and a plurality of wire conductors connecting said input/output nodes to said conductive finger leads, and having positive and negative power nodes electrically connected by said wire conductors to said power lead and to said opposite terminal on which said chip is mounted respectively.

4. A device package as defined in claim 1, including:

a non-conductive coupling substrate interposed between coupling together said circuit device and said opposite battery power terminal.

5. A device package as defined in claim 1, wherein said negative polarity power terminal is mounted on and electrically connected to said power lead.

6. A device package as defined in claim 1, wherein said positive polarity power terminal is mounted on and electrically connected to said power lead.

7. A device package as defined in claim 1, further comprising bonding wires electrically connecting said finger leads to said electronic circuit device.

10. A device package as defined in claim 1, wherein said battery is a hermetically sealed battery.

11. A device package as defined in claim 1, wherein said battery is characterized by an internal resistance which increases non-linearly in response to short circuit current flow.

12. A device package as defined in claim 1, wherein said battery is rechargeable.

13. A device package as defined in claim 1, wherein said device package is adapted for surface mount, including a layer of thermally reflective metal attached to the external surface on the surface mount side of said non-conductive body.

8. A device package for providing electrical power to an electronic circuit device comprising, in combination:

a body of non-conductive material;

a finger lead assembly encapsulated within said body of non-conductive material, said finger lead assembly including a plurality of conductive finger leads, with one of said finger leads defining a power lead wherein said power lead includes a base support segment disposed within a finger lead interconnect region;

a battery having a positive polarity power terminal and a negative polarity power terminal, one of said battery power terminals being mounted onto and electrically connected to said base support segment; and

,

an electronic circuit device encapsulated within said body of non-conductive material and mounted onto one of said battery power terminals opposite of said battery terminal mounted onto said power lead.

9. A device package for providing electrical power to an electronic circuit device comprising, in combination;

a body of non-conductive material;

a finger lead assembly encapsulated within said body of non-conductive material, said finger lead assembly including a plurality of conductive finger leads, with one said finger leads defining a power lead;

a battery having a positive polarity power terminal and a negative polarity power terminal, one of said battery power terminals being mounted onto said power lead;

an electronic circuit device encapsulated within said body of non-conductive material and coupled to one of said battery power terminals opposite of said battery terminal mounted onto said power lead, wherein said electronic circuit device is an integrated circuit implemented on a semiconductor chip

a non-conductive coupling substrate interposed between, coupling together, said circuit device and said opposite battery power terminal, wherein said coupling substrate is intersected by a via aperture, and wherein said semiconductor chip is mounted upon said coupling substrate in stacked relation therewith, said integrated circuit having a plurality of input/output nodes to said conductive finger leads, and having positive and negative power nodes electrically connected by said wire conductors to said power lead and to said opposite battery power terminal, respectively, with one of said wire conductors being extended from said circuit device through said via aperture to said opposite battery power terminal.

14. In an electronic circuit package of the type having a circuit device including multiple input/output nodes encapsulated within a body of non-conductive material, a plurality of connector leads mounted onto said body of non-conductive material and projecting externally thereof, and a plurality of conductive finger leads encapsulated within said body of non-conductive material and a plurality of wire conductors electrically connecting said input/output nodes to said finger leads, the improvement comprising:

a plurality of said conductive finger leads having internal end portions spaced about an interconnect region;

one of said conductive finger leads defining a power lead and having a base support segment transversing said interconnect region; and

,

a battery having positive and negative polarity power terminals, one of said power terminals being mounted on and electrically connected to the base support segment of said power lead, and said circuit device being mounted on the other battery power terminal.

15. A method of packaging an electronic circuit device and a battery for providing electrical power to said electronic circuit device comprising the steps:

mounting a power terminal of a battery onto a finger lead of a finger lead assembly;

mounting said electronic circuit device onto the other power terminal of said battery; and

,

encapsulating the electronic circuit device, battery and finger lead within a body of non-conductive material.