Glass ceramic substrate having electrically conductive film

• US 5,011,732 A
• Filed: 07/17/1989
• Issued: 04/30/1991
• Est. Priority Date: 07/26/1988
• Status: Expired due to Term

• Current Assignee: NGK Insulators Limited
• Original Assignee: NGK Insulators Limited
• Inventors: Kimura, Koji, Takeuchi, Yukihisa, Ishikawa, Masayasu
• Primary Examiner(s): Ryan, Patrick J.
• Application Number:
  US07/380,318
• Time in Patent Office: 652 Days
• Field of Search: 428/209, 428/210, 428/324, 428/426, 428/428, 428/446, 428/454, 428/702, 428/901, 174/68.5, 361/397
• US Class Current: 428/209
• CPC Class Codes: C03C 17/36 at least one coating being a metal
• CPC Class Codes: C03C 17/3607 Coatings of the type glass/inorganic compound/metal
• CPC Class Codes: C03C 17/3642 the multilayer coating containing a metal layer
• CPC Class Codes: C03C 17/3652 the coating stack containing at least one sacrificial layer to protect the metal from oxidation
• CPC Class Codes: C03C 17/3655 the multilayer coating containing at least one conducting layer
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 3/38 Improvement of the adhesion between the insulating substrate and the metal
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/24926 including ceramic, glass, porcelain or quartz layer
• CPC Class Codes: Y10T 428/251 Mica

Abstract

A glass ceramic substrate containing mica and having an electrically conductive film formed thereon includes a bonding layer made of a material including at least silicon oxide, which is formed on a portion of one of the opposite surfaces of the glass ceramic substrate containing mica. The electrically conductive film is formed on the bonding layer and has a major component consisting of at least one element selected from the group consisting of aluminum, tungsten, molybdenum, titanium, tantalum and chromium.

Claims

1. A glass ceramic substrate containing mica, which has an electrically conductive film formed thereon, comprising:

a bonding layer made of a material including at least silicon oxide, which is formed on a portion of at least one of the surfaces of said glass ceramic substrate containing mica; and

said electrically conductive film being formed on said bonding layer, and having a major component consisting of at least one element selected from the group consisting of aluminum, tungsten, molybdenum, titanium, tantalum and chromium.

2. A glass ceramic substrate according to claim 1, wherein said bonding layer is formed by applying to said one surface of the glass ceramic substrate a solution which contains at least a silicon compound, and subsequently effecting a heat treatment of said bonding layer, prior to forming said electrically conductive film.

3. A glass ceramic substrate according to claim 2, wherein said heat treatment prior to forming said electrically conductive film is conducted at a temperature within a range of 200°

-1000°

C.

4. A glass ceramic substrate according to claim 3, wherein said heat treatment is conducted at a temperature within a range of 400°

-800°

C.

5. A glass ceramic substrate according to claim 1, which is subjected to a heat treatment in a non-oxidizing atmosphere after said electrically conductive film is formed on the substrate.

6. A glass ceramic substrate according to claim 5, wherein said heat treatment after forming said electrically conductive film is conducted at a temperature within a range of 500°

-1000°

C.

7. A glass ceramic substrate according to claim 6, wherein said heat treatment is conducted at a temperature within a range of 800°

-1000°

C.

8. A glass ceramic substrate according to claim 1, wherein said bonding layer has a thickness selected within a range of 0.1-20 microns.

9. A glass ceramic substrate according to claim 8, wherein said bonding layer has a thickness selected within a range of 0.3-3 microns.

10. A glass ceramic substrate according to claim 9, wherein said glass ceramic substrate contains 50-70% by weight of mica.

11. A glass ceramic substrate according to claim 1, wherein said electrically conductive film includes chromium.

12. A glass ceramic substrate containing mica in an amount of 30-80 wt %, said substrate having an electrically conductive film formed thereon, said substrate comprising:

a bonding layer made of a material including at least silicon oxide, which is formed on a portion of at least one of the surfaces of said glass ceramic substrate containing mica; and

said electrically conductive film being formed on said bonding layer, and having a major component consisting of at least one element selected from the group consisting of aluminum, tungsten, molybdenum, titanium, tantalum and chromium.

13. The glass ceramic substrate of claim 12, wherein said glass ceramic substrate contains 50-70 wt % mica.