Semiconductor die and mounting assembly

• US 5,012,322 A
• Filed: 05/18/1987
• Issued: 04/30/1991
• Est. Priority Date: 05/18/1987
• Status: Expired due to Term

• Current Assignee: Allegro Microsystems Incorporated (Sanken Electric Company Limited)
• Original Assignee: Allegro Microsystems Incorporated (Sanken Electric Company Limited)
• Inventors: Panaccione, Paul, Martiska, Thomas J., Guillotte, Paul A., Gagnon, Jay J.
• Primary Examiner(s): MINTEL, WILLIAM A
• Application Number:
  US07/050,662
• Time in Patent Office: 1,443 Days
• Field of Search: 357/72, 357/81, 357/54, 357/49
• US Class Current: 257/753
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/83855 Hardening the adhesive by curing, i.e. thermosetting
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/0665 Epoxy resin
• CPC Class Codes: H01L 2924/07025 Polyimide
• CPC Class Codes: H01L 2924/07802 not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/0781 being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15747 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19043 : being a resistor

Abstract

A uniformly thick dielectric polyimide coating is provided on the back face of an integrated circuit and the die is mounted to a copper lead frame finger by interposing an epoxy resin bonding agent between the uniformly thick polyimide coating and the copper support finger. The die coating is provided before separating die from the precursive water. Liquid polyimide is poured onto the back side of the water which is spun, in a manner similar to that usually used for obtaining uniformly thick photoresist films. After curing the polyimide, the die are cut from the wafer by sawing.

Claims

1. A semiconductor die and mounting assembly comprising:

(a) a semiconductor die having an electronic device formed in one major face thereof;

(b) at least one uniform cured-liquid dielectric-resin coating self adhered directly to the other major face of said die;

(c) a solid mounting support; and

(d) a bonding agent disposed directly between said at least one dielectric coating and said support.

2. The assembly of claim 1 wherein said mounting support is electrically conductive.

3. The assembly of claim 1 wherein said solid mounting support is a metal.

4. The assembly of claim 1 wherein said dielectric resin coating is polyimide.

5. The assembly of claim 1 wherein said bonding agent is selected from an epoxy resin and a polyimide resin.

6. The assembly of claim 1 wherein said bonding agent is electrically conductive.