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Board wiring pattern for a high density memory module

  • US 5,012,389 A
  • Filed: 12/14/1988
  • Issued: 04/30/1991
  • Est. Priority Date: 12/14/1988
  • Status: Expired due to Term
First Claim
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1. A memory module comprising:

  • a plurality of memory chips and a mounting surface therefor, each chip including a plurality of signal pins for power, ground, control, address and data signals and at least one enable pin for selecting said chip, said memory chips being mounted on said mounting surface in an array of at least three rows and a plurality of columns;

    said mounting surface including a group of serpentine parallel conductors extending along two adjacent columns in the at least three rows of said array, which connect the corresponding signal pins between the two adjacent columns in the at least three rows to one another.

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